ZESTRON Launches New Product - VIGON SC 200 Stencil Cleaner Wipes

Reading time ( words)

ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce a new product to the market, VIGON® SC 200 Stencil Cleaner Wipes. A powerful combination of low-lint wiping material and effective stencil chemistry provides an efficient and safe alternative to alcohol-based cleaners.

VIGON® SC 200 Stencil Cleaner Wipes are designed to manually remove solder pastes and adhesives in electronic assembly manufacturing. Due to the water-based chemistry formulation, they provide exceptional cleanliness while ensuring operator safety. The polyester non-woven wipes offer excellent wet strength, reduce staining and lint left behind on your stencil, as well as increase cleaning protocol consistency.  Compatible with nano-coated stencils, they are an ideal replacement for alcohol-based cleaners and are recommended for use in both manual and prior to automatic cleaning processes.


Suggested Items

Real Time with … IPC APEX EXPO 2023: Mycronic Extends Reach

01/11/2023 | Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.

Five-Star Reflow Recipes: Q&A With Rob Rowland

12/28/2022 | Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”

Essemtec: Manufacturing Moves In-house

12/28/2022 | Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.