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ASC International, a leading manufacturer of 3D solder paste inspection (SPI) and automated optical inspection (AOI) systems, will exhibit in Booth #827 at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. ASC International will offer live demonstrations of its industry-leading SPI and AOI solutions.
On display will be the VisionPro M500 offering an affordable option for true 3D bench top SPI. The VisionPro Merlin sets the standard as the price to performance leader for offline 2D-3D AOI and the VisionPro DMI combines both 3D SPI and 2D-3D AOI into a single platform for the most cost-effective inspection station island solution in the market today.
Also on display, the LineMaster Fusion 3D provides sophisticated 3D solder paste measurement coupled with an intuitive user interface and Windows® 10 OS. With only a few minutes of training, an operator can perform accurate and reliable 3D measurements of solder paste deposits as well as many other important SMT measurement applications. LineMaster's completely automatic solder paste measurement process eliminates manual board handling as found with offline SPI systems and provides operators with immediate feedback to reduce printer related defects.
Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.
Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”
Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.