The Five Most-read Design007 Articles of 2022


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Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Blake Shelton album. 

So, put on your ugliest holiday sweater and prop up that iPad. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022. 

Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
The I-Connect007 eBooks have been moving like hotcakes, and Ventec’s 2022 offering got a lot of eyeballs on the page. Co-written by Ventec’s Didier Mauve and Robert Art, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrate, Volume 2 was the second in the series, and PCB designers snapped it up. This article about the book launch was the most-read Design007 article of the year.

High-Voltage Circuit Design Guidelines and Materials
More of our readers seem to be entering the high-voltage arena lately, and this article by Celso Faia and Davi Correia of Cadence Design Systems rode a voltage spike into our top five. As they point out, a lot of high-voltage issues can be precluded early in the design cycle—if you know what you’re doing. Check it out.

Flexible Hybrid Electronics Design: Reducing Time to Market
Flex and rigid-flex design has been a hot topic for a few years, and Sean Nachnani’s article on flexible hybrid design flexed its biceps all the way into our five most-read items. NextFlex is leading much of the research in this space, and they’ve published a variety of articles this year. As we’ve seen, many of our readers are being forced into flex for one reason or another, and flex hybrids are making inroads into this segment now. 

Kris Moyer Discusses New IPC Role
There’s an old saying in business-to-business publishing: People like reading about other people, and it shows. Our interview with IPC design instructor Kris Moyer was the most popular PCB design interview of 2022. More young people are entering this segment, and designers and design engineers are yearning for cutting-edge design education. 

Altium Focusing on Educating Designers of Today and Tomorrow
Altium has been working with the educational community for years, providing EDA software to universities and holding educational events such as AltiumLive and Altium Education. This interview with Altium VP of Education Rea Callender and consultant Zach Peterson shot up into our most-read earlier this year. Education may be the hottest of the hot topics in PCB design now.

 

  

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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/20/2023 | Andy Shaughnessy, Design007 Magazine
We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff. This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.

Altium Focuses on Design Education

01/16/2023 | I-Connect007 Editorial Team
Altium keeps its eyes on the designers of the future. The company has been working with colleges and universities for years, providing free seats of Altium Designer for the next generation of PCB designers and design engineers. At IPC APEX EXPO 2023, Altium will be providing software for the finalists in the IPC Design Competition just as it did last year. They offer a variety of other educational programs as well, including Upverter classes and a design competition that aims to address environmental change. Here, Rea Callender, Altium’s VP of education, discusses its educational programs and plans for the week of the show.

The Battle of the Boards

01/12/2023 | Patrick Crawford, IPC
Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.



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