-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
January 2023 Issue of SMT007 Magazine Available Now
January 3, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
As semiconductor companies seek ways to prolong Moore's Law, new advanced component packaging techniques are moving the boundaries between printed circuit fabrication and semiconductor fabrication.
In the past two years, we’ve covered the heterogenous integration roadmap (PCB007 Magazine, October 2020), and more recently, reported on the IPC Advanced Packaging Symposium held last October in Washington, D.C. This is a topic wherein printed circuit manufacturing and semiconductor manufacturing begin to converge. What will be the impact on the EMS industry?
In this issue, we open the discussion about how advanced packaging will change the structure of our industry.
Don't miss this issue of SMT007 Magazine.
Sign up for delivery to your e-mailbox by subscribing here.
Suggested Items
Cogiscan Collaborates with Koh Young to Unveil How Factory Insights Software Transforms Data Into Action at IPC APEX EXPO
03/28/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, is excited to announce Factory Insights, the latest offering from Cogiscan, will be demonstrated alongside KSMART in Koh Young booth 2112 during IPC APEX Expo.
ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
03/27/2024 | SEMIMore than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York.
NextFlex Announces $5M Education Fundraising Effort: First Spotlight - Transforming the Landscape for Women in Technology
03/27/2024 | BUSINESS WIRENextFlex Learning Programs, the education-focused arm of the NextFlex® Hybrid Electronics Manufacturing Innovation Institute, announces its first spotlight effort, “NextFlex Supports Women in STEM” to increase the number of women in STEM fields, which could accelerate U.S. GDP growth by boosting women’s cumulative earnings by $299B and adding $5.9T to the global stock market within 10 years according to S&P Global.
Don Dennison Appointed to Roll Out KIC’s Latest Thermal Analysis System Software in the Northeast
03/26/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is pleased to announce the appointment of PIT Equipment Services, LLC, led by Don Dennison, as its representative for New York, New Jersey, and Eastern Pennsylvania.
ACDi Takes Milestone Delivery of the 23,000th Koh Young Machine
03/26/2024 | ACDiAccording to ACDi (American Computer Development, Inc.), “Flexible, reliable, and equipped to keep your project on schedule, is what you need as an electronics manufacturing services partner.”