Saki Adds Ultra-High-Speed 3D AXI Solution to In-Line X-ray PCB Inspection Range


Reading time ( words)

Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces the addition of a new 3D X-ray Automated Inspection System (3D-AXI) to its popular 3Xi-M110 range, bringing further improvements in cycle time and inspection accuracy. The newly developed 3Xi-M110 V3 delivers an impressive 50% cycle-time reduction and the highest accuracy volumetric inspection results on the market today.

Building on the previous enhancements released in 2022, Saki starts the new year with further optimizations to its 3D automated X-ray range. The need for premium printed circuit board and component inspection has grown year-on-year. Saki stands at the forefront of the essential technology required for automated quality assurance with its 3Xi-M110 V3 heading the Saki Total Inspection Line Solution, delivering the cutting-edge results manufacturers strive for.

At the core of the machines’ upgrades is the exclusive Planar CT technology and a suite of tools that are custom developed in-house to optimize the inspection of PCBs of every type. The 3Xi-M110 V3 model delivers cycle times of more than twice as fast as previously possible and the accuracy provided is unparalleled, ensuring cleaner results untarnished by shadows or noise.

Saki’s Planar CT technology used in the 3Xi-M110 detects solder joint defects and microstructure abnormalities in high-density PCBs. The automated X-ray inspection system utilizes Real 3D volumetric inspection to clearly identify voids in multi-layer solder, THT assembly and BGA head-in-pillow issues, and defective component parts based on fillet position and other factors.

The 3Xi-M110 V3 maintains the same light weight and compact footprint as the original 3Xi-M110 while consuming 40% less power per board, which underlines Saki’s commitment to contributing to sustainable manufacturing with Saki's latest inspection solutions.

Saki will debut the 3Xi-M110 V3 machine at the 37th NEPCON JAPAN, which will be held at Tokyo Big Sight on January 25-27. Visitors to the show are invited to Saki's booth (East Hall 2, Booth No. 15-1) for a demonstration and to discover Saki's latest solutions for the ever-changing inspection environment.

Norihiro Koike, President and CEO of Saki Corporation said: “The 3Xi-M110 V3 model has merged hardware and software optimization to achieve speeds that are twice as fast as the previous model and to help improve manufacturing quality thanks to Saki's proprietary planar CT technology for X-ray inspection. Saki will continue to advance its technology to ensure highest maintainability, manufacturing efficiency and economic viability. For 2023, we look forward to further develop and deepen our relationships with our global customer base and business partners.”

Share




Suggested Items

Real Time with … IPC APEX EXPO 2023: Mycronic Extends Reach

01/11/2023 | Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.

Five-Star Reflow Recipes: Q&A With Rob Rowland

12/28/2022 | Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”

Essemtec: Manufacturing Moves In-house

12/28/2022 | Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.