Creative Materials Announces Advanced Products for B-Staged Epoxy Films

Reading time ( words)

Creative Materials expands a series of functional B-staged epoxy films. These lines of film products include isotropic and anisotropic electrically conductive options as well as thermally conductive and electrically insulating options. The high reliability and controlled reflow allow these adhesive films to be used to eliminate ingress to vias or bleed into sensitive areas and set them apart from typical die attach films. These series of products are available in sheets and can be provided as custom preforms to customer-specified geometries or in custom length and width rolls. Examples of products include: 125-22-F which is an isotropically conductive series of films available in standard thicknesses of 1-5 mils; other thicknesses can be requested and 126-37-F which is an anisotropically conductive series of films which are able to accommodate a variety of pitch and contact sizes. 127-03-F provides electrical insulation with a high thermal conductivity for thermal management and structural bonding. These films and preforms are supplied on an easy-to-remove release liner.

These products offer excellent thermal stability and high temperature properties to 325C intermittent and 230°C continuous, excellent electrical properties, chemical resistance when fully cured, adhesion to a wide variety of metallic and organic surfaces, minimal flow during bonding and curing, and low CTE. Cure temperature are typically around 150°C but low temperature curing versions are available for even less than 100C. 

These products are typically used in conductive splicing of ribbon cables, PTF circuits, electrical attachment of surface-mounted devices, heat sinking, as well as assembly of electrical and electronic components. The anisotropic product is used when shorts between closely spaced contacts is a concern.


Suggested Items

Five-Star Reflow Recipes: Q&A With Rob Rowland

12/28/2022 | Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”

Cybord: 100% Component Inspection Is Here

12/21/2022 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Cybord’s Zeev Efrat about managing supply chain issues through advanced component verification procedures. Efrat describes the four-step process Cybord recommends to not only ensure that the components used are genuine and in good condition, but also to provide detailed provenance at the component level, thereby improving OEMs' ability to provide cradle-to-grave traceability.

Intermingling Semiconductor and PCB Machine Capabilities

12/14/2022 | Nolan Johnson, I-Connect007
In the midst of electronica, which included the co-hosted SEMICON show, Nolan Johnson speaks with Koh Young’a Harald Eppinger about the convergence of capabilities in the IC and PCB lines at Koh Young. In addition, Eppinger points out that while there are similarities between the global regions of production, there also are unique requirements.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.