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Bentec is pleased to announce that Incap Electronics UK Ltd. purchased a Mirtec MV-3XL OMNI with an increased maximum PCB load size, angled cameras and Z-axis.
“Incap is one of Europe’s top EMS companies. As such we are delighted that Incap have decided to continue with their long-established partnership with Mirtec over the last decade,” said David Bennett Managing Director Bentec Ltd. “By deploying Mirtec’s leading 3D Inspection technology, the company can continue to offer their recognised high-quality service to customers.”
Incap Corporation is a trusted partner and full-service electronics manufacturing services provider. As a global EMS company, Incap supports customers ranging from large multinationals and mid-sized companies to small start-ups in their complete manufacturing value chain. Incap offers state-of-the-art technology backed by entrepreneurial culture and highly qualified personnel. The company has operations in Finland, Estonia, India, Slovakia, UK and Hong Kong. Employing approximately 2,500 people across the group.
“We decided to make this investment in our machinery to better meet customer demand and to support our company’s growth. Technology is changing rapidly, and we see that investing in a new Mirtec AOI machine allows us to provide the highest quality capability and standards,” said Dave Elms, Technical Director.
The MV-3XL OMNI Desktop 3D AOI machine is configured with the same hardware and software as Mirtec’s inline OMNI-VISION® 3D inspection systems, providing 100% compatibility across Mirtec’s 3D AOI product line. The MV-3XL OMNI is a variant of the MV-3 OMNI for customers such as Incap that require a larger maximum PCB load size of 660 x 510 mm (as opposed to 450 x 400 mm). The system features OMNI-VISION® 3D inspection technology that combines 15-megapixel CoaXPress camera technology with the company’s revolutionary digital tri-frequency Moiré 3D system in a cost-effective platform. The 15-megapixel CoaXPress vision system is a proprietary camera system designed for use with its complete product range of 3D inspection systems. Mirtec’s 12 projection digital tri-frequency Moiré technology provides true 3D inspection to yield precise height measurement data used to detect lifted component and lifted lead defects as well as solder volume post-reflow. Fully configured, the Mirtec MV-3 OMNI machine features four 10-megapixel sideview cameras in addition to the 15-megapixel top-down camera and multifunction AOI/SPI inspection capability.