Heraeus Electronics Launches New Innolot 2.0 Solder Paste

Reading time ( words)

Heraeus Electronics is pleased to announce the release of its new Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste. The new high reliability, high performance solder paste provides a competitive TCO offering. Based on Heraeus Electronics’ proven experience, Innolot 2.0 allows a wide process window, enabling soldering in air with a low defect rate. Additionally, it is designed to offer an optimized formulation for lower costs.

The requirements for mobility are changing worldwide. Electrification and automation of vehicles lead to high demand for cost- and performance-efficient materials. These are required to meet the increasing need for safety and support systems such as advanced driver assistance systems, increasingly intelligent control units, as well as in-car entertainment systems. The increasing demand is accompanied by harsher requirements for components and materials as well as TCO challenges.

With its new approach through Microbond® SMT660 Innolot® 2.0 for highly reliable and cost-effective solder alloys for automotive applications, Heraeus Electronics introduces the ability to maintain a competitive Total-Cost-of-Ownership, while fulfilling emerging requirements. The next generation of Innolot® alloy offers reduced cost while maintaining the well-known features of higher creep resistance, resulting in longer product life cycles at higher operating temperatures. The Microbond® SMT660 Innolot® 2.0 solder paste performs in the air without additional N2 during reflow, while keeping defect rates low, reducing your TCO. 

The flux Microbond® SMT660 uses an acrylic based synthetic resin eliminating potential batch-to-batch variations when using natural raw materials. Due to its low impurities and the flux design, a high SIR performance is achieved. As a result, SMT 660 reduces the risk for electrochemical migration. The combination of the flux with Innolot® or Innolot® 2.0 alloy delivers a solder paste with superior reliability – especially in miniaturized systems in the automotive industry.


Suggested Items

Real Time with... IPC APEX EXPO 2023: Automotive Electrification

02/08/2023 | Real Time with...IPC APEX EXPO
Nolan Johnson talks with Senior Product Manager Chris Nash of Indium Corporation, who discusses Durafuse LT, a novel solder paste mixed alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.

Real Time with … IPC APEX EXPO 2023: Mycronic Extends Reach

01/11/2023 | Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.

Five-Star Reflow Recipes: Q&A With Rob Rowland

12/28/2022 | Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.