-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Heraeus Electronics Launches New Innolot 2.0 Solder Paste
February 24, 2023 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics is pleased to announce the release of its new Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste. The new high reliability, high performance solder paste provides a competitive TCO offering. Based on Heraeus Electronics’ proven experience, Innolot 2.0 allows a wide process window, enabling soldering in air with a low defect rate. Additionally, it is designed to offer an optimized formulation for lower costs.
The requirements for mobility are changing worldwide. Electrification and automation of vehicles lead to high demand for cost- and performance-efficient materials. These are required to meet the increasing need for safety and support systems such as advanced driver assistance systems, increasingly intelligent control units, as well as in-car entertainment systems. The increasing demand is accompanied by harsher requirements for components and materials as well as TCO challenges.
With its new approach through Microbond® SMT660 Innolot® 2.0 for highly reliable and cost-effective solder alloys for automotive applications, Heraeus Electronics introduces the ability to maintain a competitive Total-Cost-of-Ownership, while fulfilling emerging requirements. The next generation of Innolot® alloy offers reduced cost while maintaining the well-known features of higher creep resistance, resulting in longer product life cycles at higher operating temperatures. The Microbond® SMT660 Innolot® 2.0 solder paste performs in the air without additional N2 during reflow, while keeping defect rates low, reducing your TCO.
The flux Microbond® SMT660 uses an acrylic based synthetic resin eliminating potential batch-to-batch variations when using natural raw materials. Due to its low impurities and the flux design, a high SIR performance is achieved. As a result, SMT 660 reduces the risk for electrochemical migration. The combination of the flux with Innolot® or Innolot® 2.0 alloy delivers a solder paste with superior reliability – especially in miniaturized systems in the automotive industry.
Suggested Items
Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024
03/13/2024 | PVANihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
Apollo Seiko Presents the Next Frontier in Non-Contact Soldering at 2024 IPC APEX EXPO
03/12/2024 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is pleased to announce plans to showcase its latest advancements at Booth 1408 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California.
Essemtec Exhibiting at IPC APEX Expo at Booth 2409
03/12/2024 | EssemtecEssemtec presents its agile dispensing platform on the TARANTULA machine. The machine can be equipped with five different valves, for a comprehensive range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam, and Underfill.
StenTech to Unveil Cutting-Edge StenTech BluPrint™ CVD Surface Treatment at 2024 IPC APEX EXPO
03/12/2024 | StenTechStenTech® Inc., a leading global company specializing in SMT Printing Solutions, will introduce the new StenTech BluPrint™ Chemical Vapor Deposited (CVD) Surface Treatment at the 2024 IPC APEX EXPO.
Revolutionizing Soldering: Kurtz Ersa to Debut Cutting-Edge Lineup at APEX
03/12/2024 | Kurtz ErsaKurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to showcase its latest advancements and a range of cutting-edge soldering machines at the 2024 IPC APEX EXPO.