Reading time ( words)
The upcoming 19th International Conference and Exhibition on Device Packaging, hosted by IMAPS on March 13-16 in Fountain Hills, AZ, will include participation by two Indium Corporation experts. Product Manager (Semiconductor) Dean Payne will deliver a presentation on pressure copper sinter paste for die-attach in power electronics devices while Dr. Andy Mackie, Principal Engineer and Manager for Thermal Interface Materials Applications, is set to chair a special invited session.
Payne’s presentation, scheduled for 10:30–11 a.m. on Thursday, March 16, is titled “Processing and Reliability Testing of a Copper Pressure Sinter Paste for Use in High Power Module, Die-Attach Applications.” Power electronics are evolving to meet the high demands of new and emerging applications, such as e-Mobility/vehicle electrification. Pressure sintered silver is fast becoming the material of choice for die-attach due to the favorable material properties and proven reliability. This presentation will introduce a copper sinter paste that can achieve consistently high shear strengths (~40MPa) when sintered with 15–20MPa of pressure. The impact of process conditions will be examined, plus reliability testing.
In addition, Dr. Mackie has been tapped to chair a special lunch session, “Words Matter: Clarity in Terminology Around Advanced Packaging is Needed Now More Than Ever.” As the ubiquity of semiconductor chips in our daily lives has become increasingly apparent, the interconnection and protection of the semiconductor chip (IPSC, also known as “Packaging”) is also starting to enter the public consciousness. In order to enable clear communication to everyone—from layperson to senior engineer—the session will address the proliferation of sometimes confusing and overlapping terminologies (MCM, heterogeneous integration, advanced packaging, advanced assembly, and so on), how to differentiate these terms from each other, and what is necessitated for clear communications to all stakeholders.
Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Payne holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
Dr. Mackie is an electronics industry expert with a technical background in physical chemistry, surface chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all aspects of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his current role, he is focused on identifying thermal material needs and trends for various high-performance applications, as well as the development and testing of innovative solutions to meet the emerging thermal interface material requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the University of Bristol, UK.
