Indium to Feature Innovative Solutions from Portfolio of Thermal Management Products at SEMI-THERM

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Indium Corporation® will feature an array of innovative thermal management solutions at SEMI-THERM, March 13‒17, in San Jose, CA. 

Indium Corporation’s new line of innovative liquid metal pastes (LMP) has enabled a true liquid metal-based TIM solution capable of handling heat dissipation issues while maintaining long-term reliability. With higher viscosity than standard liquid metal, Indium Corporation’s next generation LMPs offer:

  • Rth as low as 0.03K/W
  • Predictable spreading characteristics
  • Lower risk of pump-out
  • Lower total costs

Indium Corporation’s Heat-Spring® solutions, ideal for TIM2 applications, are a compressible interface between a heat source and a heat-sink. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK. They are available as pure indium, pure indium clad with aluminum to prevent sticking to the device under test (DUT), indium-silver alloys, and indium-tin alloys.

Featured Heat-Spring® products at SEMI-THERM:

  • Are patterned to optimize contact with non-planar surfaces
  • Provide uniform contact between the burn-in head and the DUT
  • Provide more uniform thermal conductivity
  • Clean with no residue
  • Are recyclable and reclaimable

Indium Corporation’s GalliTHERM™ portfolio of gallium-based liquid metal solutions draws on the company's more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:

  • High thermal conductivity for end-product longevity and reliability
  • Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
  • Extraordinary wetting ability to both metallic and non-metallic surfaces

To learn more about Indium Corporation’s thermal management solutions, visit our experts at SEMI-THERM.


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