Reading time ( words)
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
The demand for ultra-thin packages has increased, thus the reduction in package thickness has caused increased warpage. The warpage during the reflow process increases the gap between BGA components and solder paste, leading to HoP issues and production yield loss.
PF606-P130N features great flux activity that can prevent oxidation of solder powder during the reflow process. Furthermore, the new paste shows excellent solderability and hot slump performance to cover the warpage of components and prevent BGA/CSP HoP issues.
PF606-P130N is designed for the SMT process, especially for thin BGA package components.
Share
Suggested Items
03/29/2023 |
I-Connect007
Episode 4, “Envisioning the Factory of the Future” from Koh Young’s new micro webinar series ‘Smarter Manufacturing Enabled with Inspection Data’ is available now.
02/28/2023 |
Nolan Johnson, I-Connect007
Alpha Circuit is a PCB fabricator located in Elmhurst, Illinois. Given that the launch of a new PCB fab is a rare occasion these days, we caught up with the senior team—Prashant Patel, president and CEO; Steve Smith, general manager; Steve Ryan, sales and direct support—guiding the buildout of Alpha Circuit’s brand new 44,000 square foot facility. They discuss what goes into equipment selection and line design, and the timing couldn’t have been better. At press time, the new facility was on schedule for test production by the end of January 2023.
02/15/2023 |
Nolan Johnson, I-Connect007
With machine installs somewhere in the range of 500 new annually and award-winning customer and field service, Koh Young has a commanding perspective on the evaluation, purchase, and installation processes for new equipment. We spoke with Mitchell Kim, applications engineer manager; Brent Fischthal, senior manager of Americas marketing and regional sales; and David Nemeth, Koh Young’s service manager for the U.S. and Canada, on what they see as the best practices for acquiring the right capital equipment.
