Amtech Systems Receives Large Repeat Order for Advanced Packaging Reflow Systems

Reading time ( words)

Amtech Systems, Inc., a manufacturer of capital equipment, including thermal processing, wafer polishing, cleaning and related consumables and services used in fabricating semiconductor devices, such as silicon carbide (SiC), silicon power, and electronic assemblies with a focus on enabling technologies for electric vehicles (EV) and clean energy applications, announced a multi-unit order for high volume reflow systems used in advanced packaging applications.

This order, valued at $1.8M, came from a leading OSAT customer of BTU International and will begin shipping this month through the third fiscal quarter of fiscal 2023. With this, the total number of units ordered by this key customer is over 300. The Pyramax reflow oven is the oven of choice for outsourced semiconductor assembly and test (OSAT) due to its combination of extreme control of thermal and atmosphere conditions at very high throughput.

“While the semiconductor industry is undergoing a period of uncertainty, we are encouraged by this recent order that serves the advanced computing market,” said Michael Whang, CEO of Amtech Systems. “Our relationships with key customers in the OSAT sector are ones we are particularly proud of – and in passing the 300-unit milestone with this customer, it’s a credit to the entire team responsible for this account,” added Whang.

11/30/2022 | Nolan Johnson, I-Connect007

Dale McHerron is senior manager at IBM Research and oversees heterogenous integration research. In his presentation, Dale spoke about the need to architect the next generation of AI systems, and what it means to the infrastructure to run AI systems at this high level of technology.

04/12/2022 | Nolan Johnson, I-Connect007

Nolan Johnson speaks with Ryan Bonner, CEO of DEFCERT, about government regulations for data and cybersecurity. A key component of moving to a digital factory will be to ensure security of the data required to operate a digital factory, and most importantly, customer design data.

04/22/2021 | Brent Fischthal, Koh Young America

Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.