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Make plans to join us for iNEMI’s March Packaging Tech Topic webinar. Power electronics have become increasingly important in modern electronic systems. Andy Mackie, PhD, of Indium Corporation will be talking about the evolution of power electronics packaging, focusing in particular on advancements in assembly and thermal interface materials.
The webinar will cover:
- Challenges associated with power electronics packaging and the critical role that assembly and thermal interface materials play in addressing these challenges
- Impact of emerging technologies such as silicon carbide (SiC) and gallium nitride (GaN) on power electronics packaging and the new challenges they pose
- An in-depth analysis of the different types of materials used in power electronics packaging, their advantages, and limitations
- The future direction of power electronics packaging and the potential for further advancements in assembly and thermal interface materials to enable even more efficient and reliable power electronic systems
Evolution of Power Packaging: Assembly and Thermal Interface Materials
Presented by Andy Mackie, PhD, Indium Corporation
Tuesday, March 28, 2023
9:00-10:00 a.m. EDT (US)
3:00-4:00 p.m. CEST (Europe)
22:00-23:00 p.m. JST (Japan)
For more information visit iNEMI's website.
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