Winners of IPC Hand Soldering Competition at InnoElectro 2023 Announced

Reading time ( words)


IPC hosted a Hand Soldering Competition in Budapest, Hungary, at InnoElectro March 28-30, welcoming 42 competitors from 29 European electronics companies. Skilled contestants competed to build an assembly in accordance with IPC-A-610, Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process, and overall product quality. Contestants were allowed a maximum of one hour to complete the process.

Taking top honors this year were:

  • In first place for the second consecutive year, Peter Zsombok, BHE Bonn Hungary KFT, scored 538 points out of a maximum possible 558. Zsombok will compete for the World Championship title in November at productronica in Munich.
  • Second place: Viktor Czonka, Alpine Hungary, with a score of 535 out of 558.
  • Third place: Janos Szebelledi, BHE Bonn Hungary KFT, with a score of 529 out of 558.

This year’s Best Company Team trophy was presented to BHE Bonn Hungary KFT, for a combined score of 1028, achieved by team members Peter Zsombok and Janos Szebelledi.

IPC is grateful to the HSC sponsors for their generous support:

  • Gold sponsors: Weller Tools, Thales
  • Silver Sponsors: Almit, Ateliers Systems, NCAB Group, Optilia, Polygone CAO, SFM-Societe Française de Microscopie

“IPC thanks and congratulates all the participants and their companies for their interest and for taking up the hand soldering competition challenge,” said Philippe Leonard, IPC Europe director. “The competition board was very complex this year, and the contestants rose to the challenge with amazing performances. We look forward to more exciting competitions this year, ending with the World Championship at productronica in Munich.”


Suggested Items

Darwin AI Evolving the Islands of Automation

03/20/2023 | Nolan Johnson, I-Connect007
When Canadian artificial intelligence company Darwin AI was founded in 2017, machine learning and deep learning were still relatively new terms. In the past five years, CEO Sheldon Fernandez and his team have been working with this technology to develop some foundational IP to simplify implementation. About a year ago, Sheldon took a “part happenstance, part deliberate” opportunity to develop a vertical offering for EMS manufacturing. Here’s what happened.

Pack Your Bags! We’ve Got Your Trade Show Calendar Here

09/23/2022 | Michelle Te, I-Connect007
It’s officially fall, and that means it's time to start planning your trade show attendance. To help you make decisions about when and where to go, we’ve put together a list of industry trade shows. It has been two long years with no or few in-person trade shows, and we’ve felt it. So, now we’re back in business and ready to hit the road. Do you have a show or conference to add to our list? Let us know!

Book Excerpt: 'The Printed Circuit Assembler’s Guide to… Solder Defects'

06/07/2022 | I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.