YINCAE Launches Breakthrough Thermal Underfill: UF 158A2

Reading time ( words)

YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product: Thermal Underfill - UF 158A2.

Designed for use in a variety of electronic devices, not only can UF 158A2 replace underfill, silver epoxy paste and thermal pad/paste in one step in CoWoS package, but also provides superior protection and improved thermal management for critical components. By filling the space between the device and the PCB (Printed Circuit Board), Thermal Underfill enhances the structural integrity of the assembly while reducing stress on solder joints.

UF 158A2 is ideal for use in high-reliability applications where temperature cycling, shock, and vibration can cause damage to electronic components. The product features excellent thermal conductivity and high-temperature stability, ensuring optimal performance even in the most demanding environments.

"We are excited to introduce UF 158A2 to our product portfolio," said Dr. Wusheng Yin, CEO of YINCAE. "Our team of engineers and scientists have worked tirelessly to develop a product that meets the growing demands of the electronics industry. We believe that UF 158A2 will provide our customers with a reliable and cost-effective solution: 1). Fast flow and easy to underfill 100x100 mm chip (20m gap); 2) Shorten Manufacturing Process; 3). High thermal conductivity 3-4W/mk; 4). Snap cure and reworkable; 5). Huge cost saving, for their thermal management needs."

UF 158A2 is available in a variety of formulations to suit different application requirements. The product is easy to apply and can be cured at low temperatures, making it suitable for use with a range of electronic devices. With its exceptional performance, reliability, and ease of use, UF 158A2 is set to become a key player in the electronics industry.


Suggested Items

Akrometrix: Masters of Metrology

05/24/2023 | Andy Shaughnessy, Design007 Magazine
At the Atlanta SMTA Expo and Tech Forum, I met Neil Hubble, president of the metrology systems provider Akrometrix. If you’re not sure exactly what metrology entails, you’re in luck. In this interview, Neil explains why metrology is becoming a critical part of PCB manufacturing. We also discuss the company’s capital equipment, testing services, and why Akrometrix counts many of the top PCB and semiconductor manufacturing companies in the world as their customers.

Shopping for a Soldering Robot

05/24/2023 | Ed Zamborsky, Thermaltronics
During factory visits, I've witnessed what’s happened to our workforce after the pandemic. Sometimes it looks like operator separation for social distancing, working extra shifts to cover for lost or missing employees due to illness, workers who now work from home, or they have simply found working no longer suits them. One possible solution when you can’t hire skilled technicians is to look at automation, particularly automation for soldering. For many it was a “feature piece” for the obligatory factory tour just to demonstrate to potential customers they are forward thinking. Now it’s a reality to solve a true workforce shortage issue. But why use a robotic soldering system?

Blackfox Shares Tips for Successful Skills Training

05/17/2023 | I-Connect007 Editorial Team
Successful skills training is a crucial part of the onboarding process and can take experienced staff members away from their primary jobs on the manufacturing floor. Effective training to onboard new employees can not only speed up the ramp-up times, but can also be customized to a company’s specific needs. We posed these four questions about new hire training to Sharon Montana-Beard, vice president of sales and operations at Blackfox.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.