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Solder Chemistry, an Indium Corporation company, will feature its proven solder paste solutions as part of the prestigious Fraunhofer Future Packaging production line exhibition at SMTconnect, May 9-11 in Nuremberg, Germany.
Organized by the Fraunhofer IZM, the live production line is an industry renowned collaboration among various equipment manufacturers, component suppliers, and research institutes. By replicating actual manufacturing conditions, it provides attendees with a unique glimpse into the most cutting-edge manufacturing processes and technologies enabling future advancements in electronics packaging.
The exhibition affords an invaluable opportunity for visitors to find customizable solutions for their unique production challenges. In addition to one-on-one discussions, technology breakfasts, and consultation hours, line tours are offered three times per day in both English and German throughout the show.
Solder Chemistry’s BLF083, a lead-free, no-clean paste designed for excellent soldering results with a wide range of process conditions, will be featured on the Future Packaging production line. BLF083 offers outstanding low-voiding, slump and solder beading resistance, as well as high-temperature stability, long-term processing and standing time. BLF083 paste delivers:
- Low-voiding performance
- Excellent low- to medium-speed printing
- High tackiness
- Good response-to-pause
- Low beading
- Clear residue
- Easy cleanability
“It is an honor for Indium Advanced Materials to feature Solder Chemistry’s BLF083 on the Future Packaging line at SMTconnect,” said Brian Craig, General Manager, Indium Advanced Materials GmbH. “The line is the highlight of the show and provides an invaluable opportunity for attendees to interact with cutting-edge manufacturing processes and technologies in a simulated real-world environment.”