Koh Young Technology is Exhibiting at the 2023 IEEE Electronic Components and Technology Conference

Reading time ( words)

Koh Young, the industry leader in True3D measurement-based inspection solutions, is excited to exhibit in booth 134 at the at the 2023 IEEE Electronic Components and Technology Conference from 30May to 02June 2023 in Orlando, Florida at the JW Marriott Orlando, Grande Lakes. 

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. IEEE Electronics Packaging Society is sponsoring the 73rd ECTC.

The technical program includes papers covering leading edge developments and technical innovations across the packaging spectrum, including topics like assembly and manufacturing technology, advanced packaging, as well as emerging technologies in both poster and presentation formats. The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants with the opportunity to gain the insight and perspective of technical and business leaders.

“Whether an engineer, manager, student, or executive, ECTC offers something unique for everyone in the microelectronics packaging and components industry. I invite you to make your plans now to join us and to be a part of all the exciting technical and professional opportunities,” commented Mr. Florian Herrault, 73rd ECTC Program Chair. “I also want to thank our sponsors, exhibitors, authors, speakers, PDC instructors, session chairs, and program committee members, as well as all the volunteers who help make ECTC a success.” 

The 2023 ECTC Exhibition complements the strength of the ECTC technical program with an opportunity for engineers and decision makers to collaborate with Koh Young and other packaging companies. Exhibit hours will be from 9:00am to 12:00pm and then again 1:30pm to 6:30pm on Wednesday, May 31, 2023. The second day of the expo is from 9:00am to 12:00pm and 1:30 to 4:00pm. Visit us in booth 134 to discuss your inspection or application challenge. “With our market-leading, AI-powered complement of inspection machines designed to reduce waste with zero-defect production via automated process control and optimization, we have the expertise and solutions to help manufacturers improve their processes,” remarked Brent Fischthal, the Senior Manager for Americas Marketing at Koh Young.


Suggested Items

Akrometrix: Masters of Metrology

05/24/2023 | Andy Shaughnessy, Design007 Magazine
At the Atlanta SMTA Expo and Tech Forum, I met Neil Hubble, president of the metrology systems provider Akrometrix. If you’re not sure exactly what metrology entails, you’re in luck. In this interview, Neil explains why metrology is becoming a critical part of PCB manufacturing. We also discuss the company’s capital equipment, testing services, and why Akrometrix counts many of the top PCB and semiconductor manufacturing companies in the world as their customers.

The EMS ‘State of the Union'

03/15/2023 | Mark Laing, Siemens Digital Industries Software
We recently heard President Biden’s State of the Union address, and it got me thinking that perhaps now is a good time to look at our own post-pandemic “state of the union” in the electronics manufacturing services industry. I will describe several key issues that our customers around the world are facing as we move forward into a new normal.

Cybord: 100% Component Inspection Is Here

12/21/2022 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Cybord’s Zeev Efrat about managing supply chain issues through advanced component verification procedures. Efrat describes the four-step process Cybord recommends to not only ensure that the components used are genuine and in good condition, but also to provide detailed provenance at the component level, thereby improving OEMs' ability to provide cradle-to-grave traceability.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.