Indium Corporation Introduces New Low-Voiding Pb-Free Solder Paste

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Indium Corporation is proud to introduce Indium8.9HFRV, a flux vehicle developed from the industry-leading Indium8.9HF chemistry. It features exceptional low-voiding performance while providing excellent stencil print transfer efficiency and response-to-pause performance.

Indium8.9HFRV is a new air reflow, no-clean solder formulated to improve the voiding performance of next generation Pb-free high reliability alloys. Applications requiring extended thermal cycling performance may use Pb-free SnAgCu-based alloys containing Sb, Bi, and In. Indium8.9HFRV is a superior choice for high-reliability alloys, providing both voiding performance and excellent electrical and process reliability. The flux is also fully compatible with the standard SnAgCu alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.

Among its key features, Indium8.9HFRV offers:

  • Low voiding when used with high-reliability alloys
  • High transfer efficiency through small apertures (≤0.66AR)
  • Excellent wetting
  • Superior response-to-pause performance
  • Compatibility with both Air and N2 reflow environments


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