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Creative Materials Inc. introduces 129-50LS a high temperature electrically conductive die-attach adhesive. This unique product is designed for application by syringe dispensing and may also be used with stencil printing, dipping and pin transfer. The high continuous operational temperature of 350°C enables this product to be used in a variety of performance parts which are used in extreme environments. Based upon a proprietary modified polyimide, 129-50LS can be processed at lower temperatures in less than typical polyimide die attach adhesives.
The 129-50LS is a single component adhesive that is NMP free and complies with semiconductor and die attach requirements where high Tg, high temperature performance, and low damping is required. The high purity and low extractable ionics allow for long operating life without the need for encapsulation. The high strength and reliable bonding of 129-50LS is designed for great performance under thermal shock and mechanical vibratory conditions.
High performance applications for 129-50LS include, but are not limited to, die attach component mounting in microelectronic and semiconductor packaging, quartz oscillator attachment, hermetic packaging, and aerospace applications. 129-50LS features a longer working time and lower volatility compared to earlier products. The product has been specifically formulated to be used production environments where high throughput automated dispense equipment is essential.