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Endicott Interconnect Technologies Hosts IPC Technology Interchange Event
May 30, 2008 |Estimated reading time: 1 minute
Endicott Interconnect Technologies, Inc. (EI) hosted an IPC sponsored event entitled, "Will You Be Ready?: An Endicott Technology Interchange," on Wednesday, May 14, 2008. The event took place at the company's headquarters in Endicott, NY and included a tour of the facility, presentations from EI's top technologists and a panel discussion featuring leading industry suppliers.
"This unique event opened the communication channel between the original equipment manufacturers, electronic manufacturing service providers, and the supply chain for information exchange and networking," stated Voya Markovich, Senior VP and CTO at EI.
IPC identified and selected EI as a leading technology company offering a broad range of technologies, to present its customer driven roadmap and future product requirements to the supply base. The supply base gained a thorough look at the processes, materials and equipment needed to meet future electronics industry needs. The afternoon discussion focused on the industry's readiness to meet these expectations including gap analyses, as well as projections for materials, imaging, design and test with a focus on advanced packaging and substrates.
"This event was a rare opportunity to experience the synchronization of the industry and to take part in frank discussions about what technological advances are on the horizon, and more importantly, how future industry demands will be met," commented Jim Fuller, VP of Printed Circuit Board and Semiconductor Packaging Fabrication at EI.
About IPCIPC is a global trade association based in Bannockburn, IL., dedicated to the competitive excellence and financial success of its 2,600 member companies which represent all facets of the electronic interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, NM; Arlington, VA; Garden Grove, CA; Stockholm, Sweden; and Shanghai, China.About EndicottEndicott is a leading provider of high-performance electronics packaging and complex assembly solutions to a wide range of electronic equipment OEMs, such as IBM, Sun Microsystems, Cadence Design Systems, Cisco Systems, Inc., The Boeing Company and Raytheon Company. Endicott is the successor to IBM's micro-electronics division in Endicott, NY and was incorporated in 2002. The company provides a broad range of products and services, including semiconductor packaging, printed circuit boards and complex assembly solutions.