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Good Connections - The Electronic Interconnection Files
August 19, 2005 |Estimated reading time: 2 minutes
Welcome to the first in a series of commentaries on electronic interconnections. Why, one may ask, would anyone set finger to keyboard to discuss so prosaic a subject as electronic interconnections? The answer is simply that electronic interconnections have, in recent years, become the gate keepers of electronic performance. Even as much attention has been and continues to be focused on making optical interconnections over the last few years, it is electronic interconnection technologies that will continue to carry the vast majority of electronics signals for short reach interconnections (e.g., <1 meter) for the foreseeable future and thus they cannot be ignored for they are not going away. Moreover, the truth is that the theoretical bandwidth potential of electronic interconnection technology actually significantly exceeds common expectations. A case in point is the demonstration nearly two years ago of 30 inch long 40Gbps data transmission channel in copper (measurements taken by Agilent and TDA*) using non-standard interconnection practices. The interconnection structure in question, designed by SiliconPipe, definitively showed the potential of copper to operate in regions that have largely been relegated to optical solutions. Moreover, the company has learned that when employing standard materials and somewhat modified processing, 3D models indicate that copper based interconnections appear capable of greater than 25Gbps over distances up to 1 meter. This bodes well for makers of copper based electronic interconnection solutions..
The context of this series will be broad brush and inclusive rather than exclusive. The intent is to cover everything in the electronic path from chip to chip and it will thus encompassing everything from on chip connections and IC packages to sockets and connectors to printed circuits and backplanes. The series will also zoom in and out in view as required to help highlight the issues effecting electronic interconnections from the nano and micro to the macro. Hopefully with each installment, we will find and become more convinced that electrical and electronic interconnection technologies have a lot more life left and much more to offer, we just need to understand the issues and act on that understanding. Most important to remember is that in electronics just as in life, it's important to have good connections.
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* www.agilent.com/about/newsroom/presrel/2004/02feb2004a.html
Joseph Fjelstad, a founder of Silicon Pipe Inc., is an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 150 U.S. patents issued or pending. He is the author of "An Engineer's Guide to Flexible Circuits" and author, co-author or editor of several other books including the most recent Chip Scale Packaging for Modern Electronics. He has also authored numerous technical papers and articles. He frequently presents seminars on PCB, flex circuit and chip scale packaging technologies at industry conferences. You may contact him at 408-973-1744 x203, or by e-mail at JosephFjelstad@aol.com or J_Fjelstad@sipipe.com.