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Something New: The Third Dimension in AOI
May 6, 2009 | Pete Starkey, I-Connect007Estimated reading time: 1 minute
Koh Young Technology, based in Korea and well known for their solder paste inspection systems, created a lot of interest at the IPC APEX Expo in Las Vegas, Nevada with the launch of a range of AOI systems based on a new three dimensional technology. CEO Dr. Kwangill Koh and Director of Sales Thorsten Niermeyer described their equipment to EMS007 editor Steve Gold.
The project was initiated by the requirements of a major customer, explained Dr. Koh, and Koh Young developed an innovative solution with true inspection value, as evidenced by improved production yields. The newsystem is based on technology which overcomes the limitations of the two-dimensional AOI inspection by incorporating the ability to sense and measure the Z-axis profilometry of whole assembled PCB surfaces--including components and solder joints. The three dimensional system eliminates escapes, false calls and inspection errors and is also much quicker to program.
"We faced some complex challenges," said Dr. Koh,"but we solved the common bottlenecks of three-dimensional measurement, particularly the specular problems associated with shiny solder joints, and projection obstacle problems due to relatively higher electronic components. We achieve a much greater height measurement range whilst maintaining a 400-nanometre z-axis resolution and this gives us the ability to measure the height and shape of components and shiny solder joints and make a true assessment of their acceptability."
Thorsten Niermeyer was pleased to report that, even in the current difficult business environment, many potential customers are eager to check out the equipment.