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On the Show Floor at SMT Hybrid Packaging: Exhibits Preview II
June 1, 2010 |Estimated reading time: 13 minutes
NUREMBURG, Germany — The following dispensing products, inspection systems, pick-and-place equipment, dummy components and test boards, automation and support tools, and other products will be highlights of the SMT Hybrid Packaging show, June 8-10 in Nuremburg. Stay tuned to SMT’s Website, www.smtonline.com, for more previews of the tradeshow.
Techcon Systems Features Dispensing Replacement Solution at SMT Show
Techcon Systems, a product group of OK International, debuts the 700 Series Premier Dispensing Syringe Barrels. The 700 series provides the same look, fit and function as a recently discontinued industry standard syringe, with substantial cost savings. Popularity of this series has increased considerably as manufacturing engineers seek quality alternatives for their syringe barrel and matching component requirements. Techcon Systems will exhibit in association with their German Partner Globaco GmbH in Hall 6 Stand 300. Techcon’s 700 Series is a drop-in replacement solution to preserve process without changing receiver heads and improves productivity. The series also provides up to 40% cost reduction over leading alternatives The receiver head assemblies for the 700 Series are preassembled and provide the connecting link from syringe barrel to the dispenser. Designed to work with industry standard equipment, the syringe barrels are silicone and chloride-free and are made from low friction polypropylene to ensure accuracy, repeatability and productivity. The barrels also feature a double Helix Luer lock for secure dispense tip attachment and are available in three colors: natural for most generic applications, amber to provide protection of UV/visible light block (up to 520 nm) but with the ability to see material inside the syringe barrel and black for total light block. Featured alongside Techcon’s range of consumables including syringes, dispensing tips, cartridges, valves and material packaging, Techcon will also showcase the newest addition to their Rotary Microvalve range, the TS7000 Interchangeable Material Path (IMP) Series Valve. The ultra-precise new auger valve is available in 3 choices of feed screw sizes (16-pitch, 8-pitch and high output 8-pitch) and provides fast, repeatable dispensing of medium to high-viscosity fluids and pastes. The modular design enables quick and easy replacement of the feed screw/chamber cartridge assembly without removing the valve from the machine. During the show, Techcon will feature a number of working valves linked to small robotic systems using the TS500R controller. The TS500R is capable of controlling all valve series in the Techcon Systems range. The plug-and-play system features user-friendly firmware with an option of programming up to 10 varied, sequenced or individual shots. A low-pressure warning feature helps maintain uninterrupted dispensing and pressure can be set in both psi and bar. Through use of the interface port, the dispense cycle can be initiated, stopped and an end-of cycle signal can be fed back to the host machine in order to start the next dispense cycle. www.techconsystems.com
Chipshooters and Component Mounting Equipment from Juki
JUKI will highlight its latest line-up of chipshooters, in booth 7-333. The JUKI product portfolio serves the range of demands from entry level (Flexlinelight – best price) to advanced production level (Flexlinepremium – premium flexibility) up to the high speed production level (Flexlinevelocity – flexible high-speed).Appearing for the first time in Europe, the FX-2 High-speed Chip Shooter is JUKI’s latest high-speed modular mounter with production capacity increased by 20 percent over previous models, improved economical efficiency, operations and reliability. The FX-2 supports the centering and placement of components from 01005 to 33.5 mm square. Efficient, high-speed production lines can be created by connecting a high speed FX-3 or general purpose mounter such as the KE-2080. The FX-2 uses the same nozzles, feeders and production data as other JUKI mounters, providing better use of assets and simpler operations on the production floor. The highly popular FX-3 High-speed Chip Shooter from the JUKI Flexlinevelocity line, rated at 60,000 CPH, will be shown in a line with the brand new KE-3020 High-speed Flexible Mounter from the JUKI Flexlinepremium line. The line will demonstrate minimum footprint and maximum flexibility by being able to place parts ranging from a 01005 chip to a 50 x 150 mm connector. The FX-3 marked the entrance of JUKI into ultra-high-speed assembly lines and introduced JUKI’s standards for high quality, reliability and cost of ownership. The modular FX-3 fits seamlessly into JUKI's portfolio of products and adds its powerful optimization software and quick-change feeder banks to set the standard for electronics manufacturing uptime. The KE-3020 High-speed Flexible Mounter is the perfect match for the FX-3 High Speed Chip Shooter. The KE-3020 is equipped with the new LNC-60 high-resolution 360° component laser centering system featuring 6 nozzles plus a separate high resolution vision head with one nozzle. With an IPC rated placement speed of 17,100 cph it can place components from 01005 to 74mm square or 50 x 150 mm and a height up to 25 mm. The KE-3020 has 80 slots for 8mm tape feeders and a placement accuracy of ± 30 µm (3 sigma) with vision centering and ±50 µm with laser alignment. Both the KE-3020 and FX-3 are the fist JUKI mounters featuring the possibility for the brand new JUKI Electrical Tape feeders (ETF). The KE-3020 offers 80 feeders spaces for 8 mm tape feeders.Electrical Tape feeders (ETF) -- JUKI’s new motor driven electric feeder can feed sensitively for ultra small components. ETF feeders enable faster component feeding and automatic pitch adjustment. With the electric feeder there is no need to stop the machine when replenishing components using the splicing function. JUKI will also showcase its entry-level KE-2060light High-speed Flexible Mounter from the from the JUKI Flexlinelight line. The machine will now feature placement of components up to 20 mm height in its standard configuration plus an optional upgrade for large board size (510 x 360 mm). Providing best price performance and highest proven reliability in its class, the KE-2060light features a quadruple head with laser alignment or one high-precision placement head with vision and laser alignment. With an IPC rated placement range of 12,500 cph laser alignment and 1,750 cph vision centering, its component range spans 0201, 75 x 75 mm to 50 x 150 mm – up to 12 mm in height. The KE-2060 Light also offers a placement accuracy of ±30 µm (3 sigma) with vision centering and ±50 µm with laser alignment. The system also offers options such as exchangeable feeder trolleys, high-precision camera for µBGA and 0.3 mm pitch. KE-2070 High Speed Chip Shooter and the KE-2080 High-speed Flexible Mounter are from the JUKI Flexlinepremium line. Built on the one-piece SuperCast single casting base that includes Y beams, the mounters are designed with speed, accuracy and reliability in mind. It is equipped with the LNC-60 high-resolution 360° component laser centering system and an improved magnascale resolution down to 1 mm. The systems are 25% more accurate than previous models capable of placing down to 01005 components. The KE-2070/2080 series introduced the Load Cell option that gives the machine the ability to measure nozzle placement force necessary for high accuracy, stackable and fluxing applications. The KE-2070 will be equipped at the show with the EPV (Embedded Process Verification) option, whereas the KE2080 High-speed flexible mounter will feature the IFS-X2 RFID intelligent feeder system. www.jas-smt.com
Rommel Presents New Basic Automation Cabinet
ROMMEL GmbH, a member of the Mühlbauer group, presents its new WL 3000 basic automation cabinet at SMT 2010 in booth 7-421. Due to a maximum of standardization and an absolutely modular setup, the WL 3000 can be equipped very flexibly. Process modules can be integrated for laser marking, labelling, dispensing and encapsulation, assembling, UV-curing, and ICT/FKT testing. At SMT 2010, ROMMEL GmbH exhibits the variant “laser” (WL 3000 LC) and thus, a highly complex solution for marking and verification of various devices. The laser module is able to mark a variety of materials in a highly precise way. This is realized by field marking without the need of moving the laser or device, what has a positive influence in the speed and costs of system and products. Upon request, the marking result can be directly verified by a camera, which is injected into the beam path of the laser. In order to have no influence on the production environment, the laser system can be connected to an in-house exhaustion system. Due to the solid, ergonomic setup and the “look & feel” concept of the menu navigation, the handling of the WL 3000 basic automation cabinets is very user-friendly and secure. A connection to a database to track products along the complete production chain (traceability) is optionally possible. www.muehlbauer.de
Production Solutions brings RED-E-SET Ultra HD to Nuremberg
Production Solutions Inc. will exhibit its line of RED-E-SET board supports, including the award-winning RED-E-SET Ultra HD, in distributor Multi-Components GmbH's booth, 7-320. The RED-E-SET Ultra HD eliminates expensive custom tooling plates, the need for new custom tooling plates for each board revision, defects due to inadequate board support, time-consuming changeovers and machine downtime. The Ultra HD offers the support coverage of dedicated tooling but with the flexibility of universal tooling. Ultra HD modules are made to the user's board dimensions and come standard with 0.350" pin spacing. So instead of having to wait for custom-machined plates due to a new PCB revision, the RED-E-SET Ultra HD gets you running right away. The new format is ideal for those users that typically run similar board dimensions but change board layouts frequently, have panelized boards, or those that are highly populated. The Ultra HD modules come in both strip format for those users that need to add or remove support depending on board width, and our new format which is board/application specific. Multi-Components GmbH will also showcase Production Solutions Red-E-Set Autoset – Motorized model, the Red-E-Set SZ – Center Support model, the Red-E-Set Inline – Standard model and the Red-E-Set VB – Vacuum Box Printer model. www.production-solutions.com.
EVS International To Exhibit Solder Recovery
EVS International will exhibit the EVS 1000 Solder Recovery System with German distributor Microtronic in Hall 9, Stand No 512D. The EVS 1000 is a smaller, lighter version of the popular EVS 3000/6000, with all of the recovery performance of the standard and lead-free solder units. The smaller size and footprint help to reduce the cost, but still provide a capacity of 10lb/5kg of dross, giving a rapid payback and impressive return on capital employed. The EVS 1000 can quickly convert waste dross into pure solder in minutes not hours, while improving the wave solder machine process. This provides a cleaner wave with less maintenance, less downtime, and a reduction in shorts and bridging as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders. Each model of the EVS Solder recovery system has a Lead and Lead Free version. The EVS 1000 is aimed at small to medium users who typically have one to three wave solder machines and who must regularly dedross or use nitrogen to reduce drossing. This group currently comprises the majority of users in the industry. By using the EVS, nitrogen can be dramatically reduced or eliminated, resulting in significant cost savings. The EVS 1000 has vastly increased EVS International's coverage of the wave solder marketplace and has revolutionized its total market penetration. www.solderrecovery.com
Marantz to Highlight Inspection Technology
From stand 7-517, Marantz will provide visitors with an opportunity to see a live demonstration of its recently introduced Solder Print Inspection (SPI) technology, while also learning more about its iSpector desktop AOI system and advanced Inspection Island. PowerSpector S1 system uses “5D” technology, measuring height, volume, true area, shape, and offset measurement. Simultaneously combining 3D and 2D measurements leads to defect detection and process control far beyond 3D only technologies. PowerSpector S1’s high speed post-print solder paste inspection process incorporates patented new sensor technology. SMT Germany attendees will also be able to discover Marantz’ new generation iSpector desktop AOI system equipped with 1 top and 8 side cameras in 45/45° configuration for the first time in a desktop machine. Solder joints of increasingly popular 45° space-saving circuitry designs can now be inspected with 10 µm resolution side cameras. Featuring the company’s pioneering true 24-bit colour imaging technology and 3D Solder Meniscus profiling, the system delivers an advanced AOI performance. Extending the amount of data available per pixel, 24-bit color processing substantially enhances defect detection. By discerning subtle changes for improved image clarity, the technology helps to separate components and solder images from the background board or substrate. In addition, high speed and high accuracy 3D profiling of Solder Meniscus is achieved with a combination of reflected angle detection and synthesized imaging for a further AOI advantage. Thanks to a successful partnership with Nutek, the Marantz iSpector system also enables value-driven automated PCB handling with the Marantz Inspection Island. Visitors will be able to find out more about this technology at the show, where the Marantz team will outline its ability to serve multiple lines while eliminating the requirement to load and unload PCBs. The Marantz Inspection Island also features unique repair & traceability software for effective post processing of defects. For additional flexibility, operators can also select classification on the fly through manual intervention. www.marantz.com/bus/eu
SIPLACE Continues Innovation Drive
After the introduction of its SIPLACE SX1 and SX2 placement machines featuring swappable gantries (“Capacity-on-Demand”), Siemens Electronics Assembly Systems will unveil the new SIPLACE SX4 at Hall 7, Booth 204. As the flexible high-speed module of the SIPLACE SX-Series, the new machine’s speed rate is 120,000 components per hour on 1.9 meters of line space, targeting the flexible high-speed segment. As part of its Capacity-on-Demand concept, the SIPLACE team will also introduce its “Peak Demand” and “Floating Demand” rent-a-gantry business models. In view of current economic developments, such concepts are becoming increasingly important for electronics manufacturers. The tutorial titled “Competitive Advantages of Build-to-Order in SMT Production”, which the SIPLACE team will host on June 6 as part of the SMT/Hybrid/Packaging Congress. Using practical examples, SIPLACE will demonstrate during this event that build-to-order (BTO) is not a concept for the distant future, but that the necessary systems, methods and tools are available today. They will also learn how supplier integration, performance indicators, lean production or kanban concepts can be adapted to the specific requirements of SMT production. The SMT/Hybrid/Packaging 2010 show will also see the European premier of the SIPLACE CA, a platform that makes it possible to place dies directly from the wafer using the standard SMT placement process. It also supports flip-chip as well as the die-attach (COB) processes. SIPLACE will also present powerful software and service solutions for more transparent processes in all areas of SMT production. In combination with the SIPLACE SX line, these solutions provide the new basis for intelligent BTO strategies in the electronics industry. www.siemens.com
Practical Components to Feature Newest Dummy Components and Test Boards
Practical Components will showcase its latest portfolio of dummy components and test boards at SMT Nuremberg. The international distributor of mechanical IC samples, or “dummy” components, and SMD production tools and equipment will highlight their latest technologies in representative AAT Aston’s booth 7-243. Among the innovative technologies on show at the AAT Aston/Practical booth will be Pac Tech Flip Chips and test boards, FusionQuad components and thermal cycle test board, 15mm x 15mm Amkor POP components, 12mm Middle stack POP components, B-52 Cleaning test kits with isolated components, 01005 capacitors and resistors, 0.4mm pitch CVBGA components as well as a newly revised Aim test board and CPK test and machine maintenance components. The new dummy component catalog and design guide will also be available to provide additional information on these products. This free virtual catalog is available at www.practicalcomponents.com, and is organized by package type/category with each product accompanied by drawings, description and part number. The catalogue also presents both lead-free and tin-lead availability and formulations, in addition to daisy chain patterns. www.practicalcomponents.com, www.aston.de
Read the first SMT/Hybrid/Packaging Show Preview for more new products and exhibits.
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