An Image Library of SMT Defects Section 3: BGA PCB Defects, Via-in-pad

Estimated reading time: 1 minute

-- These images of SMT defects and attributes were compiled by consultant Tom Clifford. In Section 3, we look at via-fill plating failures; craters, lumps, and odd cover shapes; edge flaking; and other via-in-pad defects on PCBs. They provide resources for training, quality control specs and standards, and research. The complete Section 3 image library appears below. Other Sections will be published later. Descriptions, provided below each image, do not necessarily define causality or severity, but serve only as identification.

Figure 1. Odd via-cover: craters and lumps. Figure 2. Via-cover failure: dimples and open voids. Figure 3. Via-fill dimple. Also apparent mechanical damage. Figure 4. Poorly tented, not filled vias adjacent to BGA pads.  Figure 5. Via-fill plating failure. Figure 6. Lumps and dimples, via-fill and cover. Figure 7. Via-fill plating failure. Also, edge-flaking. Figure 8. Odd via-fill and cover shapes.

Section 1. BGA PCB Defects, PlatingSection 2. BGA PCB Defects, External Damage

(Upcoming)Section 4. BGA PCB Defects, Gap and Poke-thruSection 5. BGA PCB Defects, MaskSection 6. BGA PCB Defects, Metallic ContaminationSection 7. BGA PCB Defects, Non-metallic Contamination, FOD Section 8. BGA PWB-related Assy DefectsSection 9. BGA Assy X-sectionsSection 10. BGAs Re-balled Section 11. SMT Assy DefectsSection 12. SMT Assys, T-cycled CracksSection 13. SMT PWB PadsSection 14. PWB Vias, X-sections

Do you have images of solder-joint or other interconnect features or defects that you would want to share? Send them to Holly Collins at SMT, editorial@iconnect.com. You must obtain permission to publish the photos and may not show proprietary or company-specific information on the images. We are particularly interested in images of advanced SMT assembly technologies and failure analyses.

Post your electronics manufacturing, SMT-related material to the #SMT community on Twitter. Use the #SMT hashtag.