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Best Posters from IPC APEX 2010
April 22, 2010 |Estimated reading time: 2 minutes
BANNOCKBURN, IL — Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC – Association Connecting Electronics Industries announced the 2010 Best Industry Posters and the winners of the second annual IPC Academic Poster Competition at IPC APEX EXPO, held April 6-8, 2010 in Las Vegas.
23 industry posters were presented at this year’s show. The event’s Technical Program Committee selected the winners through a ballot process. Tied for first place honors were Christopher Hunt, Ph.D., National Physical Laboratory, for “Solder Joint Reliability from Material Properties,” and David Lee, Ph.D., Johns Hopkins University, for “Comparison of the Electrochemical and Physical Properties of the Nanocrystalline Copper Deposition in the Fabrication of Wiring Boards.”
In addition to the industry posters on display, IPC APEX EXPO held an academic poster competition. Ten posters highlighting research being conducted at the college level were featured from Auburn University; Missouri University of Science and Technology; Purdue University; University of California, Irvine; and University of Maryland. IPC APEX EXPO attendees voted on the top three posters, with first-place honors going to Pylin Sarobol, Aaron Pedigo, P.Su, J.E. Blendell, and C.A. Handwerker, Sc.D., from Purdue University for “A Defect Phase Diagram for Tin Whisker and Local Film Properties near Whiskers.” The same team, with Aaron Pedigo as the main author, took second place honors for “Tin Whisker Growth Related to the Crystallographic Texture of Sn and Sn Alloy Electrodeposits.” Amendra Koul from Missouri University of Science and Technology won third place for “Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor.”
Sponsored by the IPC Foundation, the academic competition was launched last year to promote greater accessibility to academic research and strengthen the relationship between academia and the industry worldwide. “IPC is delighted to offer this international venue to showcase the exciting work being done at universities all over the world,” said Kim Sterling, IPC vice president of marketing and communications. “Gaining this level of visibility can greatly accelerate the impact this research can have on the industry worldwide.”
IPC APEX EXPO 2011 will take place April 12–14 in Las Vegas. For more information on poster submission or the 2011 IPC shows, contact Greg Munie at GregMunie@ipc.org, or Toya Richardson, IPC technical administrative assistant, at ToyaRichardson@ipc.org.
Also see the Best Papers from IPC APEX EXPO 2010
And award winners: Jack Bramel Receives IPC Raymond E. Pritchard Hall of Fame Award Bob Black of Juki Honored with IPC President Award DuPont and Raytheon Honored with 2010 IPC Corporate Recognition AwardsSMT Celebrates 18th Annual SMT VISION Awards Subscribe
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