-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC APEX EXPO 2010: Exhibits Preview VII
April 4, 2010 |Estimated reading time: 14 minutes
LAS VEGAS — IPC APEX EXPO is coming up April 6-9 at the Mandalay Bay Convention Center in Las Vegas. This preview includes PCB materials from Rogers, TRI’s test solutions, IPS’s PCB production systems, carts from Bliss Industries, a rework system from Finetech, dross recovery with FCT Recovery, kitting carts from Inovaxe, ZESTRON’s environmentally neutral cleaning products, defect detection from Vi TECHNOLOGY, pick-and-place machines from Europlacer, ASYS process machines and EKRA screen printers, and Aster’s test products.
Rogers Will Display High-performance Materials for PCBs
Rogers will showcase its Theta, RO4360, RT/duroid 5880LZ, and RT/duroid 6202PR product lines. Members of Rogers Advanced Circuit Materials Division will be on hand to offer advice and guidance on the use of their high-performance PCB materials, including Rogers’ halogen-free, RoHS-compliant Theta circuit materials that offer strong thermal and electrical performance. With a stable dielectric constant of 3.90 and low dissipation factor of 0.008 at 1 GHz, Theta materials suit high-speed telecommunications and computing applications, and are an environmentally friendly product for the high-reliability, high-speed digital market. High-reliability requirements are addressed with a low coefficient of thermal expansion (CTE) of about 50 ppm/ºC (approximately 30% lower than standard FR-4). Rogers RO4360 high-frequency laminates are glass-reinforced, ceramic-filled thermoset materials that combine high performance with ease of processing. Although they support low-cost processing such as used with FR-4 material, RO4360 laminates feature a dielectric constant of 6.15 (matching competitive PTFE products) and low loss with a dissipation factor of 0.003 at 10 GHz. They also are designed for high thermal conductivity for use in high-power circuits, such as power amplifiers, and low CTE of 30 ppm/ºC in the z direction for high PTH reliability in multilayer circuits. They are compatible with lead-free processing and automated assembly methods. RT/duroid 5880LZ high-frequency laminate materials are PTFE-based composites with a proprietary filler with a very low density (specific gravity of 1.37 g/cm3) for weight-sensitive applications. With a dielectric constant of 1.96 at 10 GHz, maintained to a tolerance of ±0.004, RT/duroid 5880LZ materials provide consistency across a board and from PCB to PCB. The laminates also minimize losses with a dissipation factor of typically 0.0019 at 10 GHz. Rogers Corporation (NYSE:ROG), www.rogerscorp.com, Booth 1125.
Test Research Inc. to Display Total Test Solutions for SMT Manufacturing
TRI will display its end-to-end test solutions for SMT manufacturing. Test systems for each phase of the manufacturing process include solder paste inspection (SPI), automated optical inspection (AOI), automated X-ray inspection (AXI) and in-circuit testing (ICT). The new TR7007 is a high-speed 64-bit 3D SPI system for mid- to high-volume manufacturing. The TR7007’s inspection speed is 171cm2/sec at 14 µm resolution and 87cm2/sec at 10 µm. TR7007 implements a new “fringe pattern” technology and a dual lighting system that eliminates shadows. The TR7007 also uses a linear motor for smoother, more accurate imaging. The TR7600 AXI system provides in-line inspection for high-density components such as flip chips and BGAs, and micro-components down to 0201 and 01005. The system uses X-ray penetration to capture images using nine CCDs at different angles. Software developed in-house by TRI analyzes the slice images and calculates the different slice heights to inspect for PCB defects. The TR7550 in-line AOI system uses a linear motor for precise imaging. It combines a top-view digital 3CCD full-color camera with 4 angle cameras.The TR5001 and TR8100LV are ICT board testers. TR8100LV is TRI’s full-featured model for large, complex PCBAs. The TR5001 is a cost-effective MDA with a variety of upgrade options for on-board programming and boundary-scan. ToggleScan is an enhancement to IEEE 1149 Boundary-Scan, and VregTest introduces a new no-access test method for crowded motherboards. Test Research Inc. (TRI, TAIEX 3030), www.tri.com.tw, Booth 1425.
IPS to Display Cleaning, Other Technologies
The IPS Hole clean system is designed for challenging small-hole, high aspect ratio circuit boards. By ensuring a clean, dry hole, the IPS Hole Cleaning Series improves yields in PTH/metallization. The IPS Hole Clean Line processes panels using compressed air, ultrasonics, and high-pressure water blasting. IPS scrubbers meet Federal and local air compliance guidelines. They require minimal water and power. Systems are designed to customers’ site requirements and work in conjunction with all IPS and other manufacturers’ wet process equipment. The company will also showcase thin material transport and fine line conveyor etching systems, pulse/airless-type manual and automated copper plating systems. insoluble anode plating systems and copper replenishment (copper sulfate and copper gobbler type systems), direct metallization and oxide replacement systems, and fume air scrubbing and mist elimination systems. Integrated Process Systems Inc., www.ips-vcm.com, Booth 735.
Bliss Industries to Introduce Latest PCB Assembly Carts and Conveyors
Bliss will launch two new products at the show. In addition, Bliss will display its FLEXconveyor, a box-build factory on wheels, providing a new way to kit and assemble box build products. The design adds the ability to simply unclamp and re-clamp any section of the conveyor line at any time to meet changing needs and improved processes. The FLEXconveyor suits low- and high-mix facilities.Bliss’ new Cantilever Cart also will be on display in both standard and custom versions. The multi-purpose cart offers many options. KanBan Cart can store bins or totes at any height or location. Tech Bench Cart sits next to the electronics assembly technicians’ bench to hold tools or work-in-progress (WIP). Staging Cart can be prepared for the next project. Test Cart enables electronics test equipment to become portable. Transport Cart can be used for moving heavier items around the plant floor (estimated 100 lb capacity). Lab Cart is for use in electronics test and compliance labs. In datacenters, it can be used for safely moving test equipment. It also can function as a Repair Cart for machine support and maintenance. Bliss Industries Inc., www.blissindustries.com, Booth 471.
FINETECH to Debut Core Rework System
FINETECH will debut the FINEPLACER Core rework system at IPC APEX EXPO. The FINEPLACER Core offers rework technology for a spectrum of SMT components, ranging in size from 0201 to 50 × 50 mm BGAs, and handling PCBs up to 300 x 400 mm. The semi-automated design includes force measurement with automatic component lift off and placement. Based on technology from FINETECH’s established platforms, the Core is a compact, versatile hot-gas rework system. The system integrates the complete rework cycle into an efficient design. Using the FINEPLACER fixed vision alignment system, the Core handles de-soldering, site dressing, paste print, reballing, and component replacement in one integrated platform. It is driven by integrated thermal management and the new QuickStart Profile Library. FINETECH, www.finetechusa.com, Booth 2329.
FCT Recovery Will Exhibit at APEX
FCT Recovery provides high-quality, reliable, and transparent recovery services for lead-free, tin/lead dross and scrap, including solder paste and wipes in quantities as small as 25 lb. Customers are updated at every step in the process, and FCT Recovery writes customer checks within 15 days of receipt of material. Customers also receive a certificate of recycling for their material. Additionally, FCT Recovery will pick up scrap, bare, and populated circuit boards. FCT Recovery, a division of FCT Assembly, www.fctrecovery.com, Booth 2317.
Inovaxe Corporation Introduces Suitcase-sized Kit Cart
Inovaxe will introduce its Suitcase-Sized Kit Cart. Using the “single package, single location” control feature, the system provides non-dedicated, high-density, flexible component package storage and Web-based inventory control. It is designed to accommodate the complete SMT kiting function for the production floor. The system, in concert with the Web-based software, provides location, inventory accuracy and correct component validation for feeder loading and replenishment. Inovaxe will also display the NPI InoCart MSD unit, along with two versions of the InoCart Material Handling System. New Web-based software with additional features and controls promote unparalleled inventory accuracy within the conventional stockroom, the lean manufacturing/floor stocked discipline and WIP environments. Inovaxe Corporation, www.inovaxe.com, Booth 658.
ZESTRON Focuses on Environmentally Conscious Cleaning Products and Processes
In the past, the electronics manufacturing industry has relied on alkaline cleaning products to remove flux residues. However, recent studies have shown that pH-neutral defluxing agents offer an excellent alternative while providing the numerous advantages of pH-neutrality. ZESTRON’s VIGON N 501 performs better than its alkaline counterparts, particularly when removing flux residues under low standoff components. PH-neutral cleaning agents can significantly reduce effluent volumes and eliminate the need for excessive waste water neutralizations, thus, leading to greener, more cost-effective cleaning processes. Recent research has also shown that DI-water cleaning processes are reaching their limitations. Implementing chemistry-assisted cleaning processes seems to offer a number of previously unknown long-term benefits that exceed those of DI-water. ZESTRON America, www.zestron.com, Booth 865. Umut Tosun, M.S.Chem.Eng., application technology manager, ZESTRON America, will present “Limitations of DI-Water Cleaning Processes” at the IPC APEX 2010 conference on Tuesday, April 6, 3-5pm, session “Cleaning II,” room S07.
Vi TECHNOLOGY Demonstrates Ways to Reduce Defective PCBAs
The Vi-3D-SPC integrated SPC software is a reportedly powerful, full-featured, easy to use statistical process control (SPC) modular software platform. It is fully integrated with the 3D-SPI machine; data transfer is over a high speed network connection directly from the source. Inspection items are summarized in a quick-read format to allow operators and engineers to quickly ascertain any patterns, and determine short-term corrective action. There are extensive flexible report functions. Vi TECHNOLOGY Selective 3D technology enables 3D inspection within AOI. This feature allows the detection of coplanarity defects on flat surface components and avoids the installation of multi-cameras systems. This option provides accurate and repeatable tilt and coplanarity measure on ICs, connectors, and passive components while inspecting the PCBAs without affecting cycle time. It particularly suits costly and high-reliability end-user applications in the automotive, industrial, and infrastructure segments. Many defects can be transparent to electrical tests as well as 2D optical inspection and require additional and costly process steps to eliminate them from production. Having 3D capability within the AOI system circumvents this. The Selective 3D AOI technology is available on new machines or as an upgrade on existing installed 3K and 5K platforms.Vi TECHNOLOGY Super-resolution technology expands current 3K Series and 5K Series capabilities. Advanced mathematical algorithms reconstruct high-resolution images from several images at standard resolution. A <10% Gage R&R is systematically achieved on 01005 package type. This technology can be combined with the Vi TECHNOLOGY Vectoral Imaging technology in AOI. This technology will be soon rolled out in the company’s Premium AOI product to selectively enable the Super-resolution mode, when appropriate and required. Therefore, cycle time impact is minimized and should almost be transparent.Vision2009, the new integrated software suite, has intuitive “Wizards” to guide users through each step of program creation and optimization, reducing the need for advanced training. Vision2009 is based on Vi TECHNOLOGY’s modular software platform and accommodates all AOI application options including: 2D Post Print, Mixed Mode, Pre Reflow, Post Reflow, Post Wave, backplane inspection, OCV and OCR. The suite also encompasses full off-line programming capability, an optimization tool, centralized common database, cross platform program transportability, review/repair station, data mining system. Vi TECHNOLOGY, www.vitechnology.com, Booth 1948.
Europlacer to Exhibit Pick-and-Place Units
Europlacer will display its IINEO SMT platform, along with its new XPii-II pick-and-place unit. The iineo platform features many enhancements to the Europlacer machine range such as a higher feeder count, increased board size, and increased maximum component height. The platform uses turret head, intelligent feeders, powerful software, linear motors, and digital cameras. It can be configured with single or dual linear motor gantry including a rotary turret head with 8 or 12 pickups; 1 or 2 board positioning mechanisms; oversized board options; and huge feeder capacity to front and rear or front only. The single-head iineo can handle maximum PCB sizes of 700 × 460 mm with options to handle up to 1610 × 600 mm. The double-head system can handle maximum PCB sizes of 500 × 460 mm with options to handle up to 700 × 600 mm. Both the single and dual-head iineo systems can handle minimum PCB sizes of 60 × 60 mm, board thickness of 0.5 to 4.5 mm, maximum weight of 3 kg and under board clearance of 25 mm. Additionally, both feature board edge clearance of 3 mm above/5 mm below, and left to right, fixed front rail transport criteria with a height of 950 mm (adjustable from 890 to 975 mm). Board location on both is full edge clamping with fiducial correction, and both systems feature a SMEMA interface. The single-head iineo features one nozzle with 40 positions in its “smart” nozzle tool bank, and the dual-head configuration provides two nozzles, each with 40 positions in its “smart” nozzle tool bank. Both systems feature standard placement accuracy of 35 µm (QFPs) to 60 µm (chips), full range of intelligent feeders for 8-88 mm tapes for components in plastic sticks and matrix trays, and a feeder capacity of 264 x 8 mm. Also, the single head iineo can accommodate an internal matrix tray capable of holding 10 full size JEDEC trays without loss of any feeder capacity. The single iineo has a rotary turret pick-up head on X/Y linear motor gantries with eight pick-ups each (12 pick-ups on Tornado head), while the dual-head iineo features two independent rotary turret pick-up heads. Depending on the configuration, maximum placement rate can be between 14,000 and 26,000 CPH, the largest PCB can reach 1,610 × 600 mm, component range is from 01005 to 70 × 70 mm, and the tallest component can be 35 mm height. Options include glue dispense with Archimedean screw, electrical test, fixed camera, conveyor auto-width adjustment, special nozzle magazine and more. XPii-II modular pick-and-place system incorporates technology from Europlacer’s iineo platform. XPii benefits from low-maintenance linear motors, high-resolution digital cameras, and advanced on-head optical component sensing. Users can build lines to meet growing demands with the modular configuration. XPii-II features two placement heads and uses Europlacer’s turret head, intelligent feeders and software. It is equipped with a choice of turret heads and incorporates optical sensors that can detect on the fly presence of components as small as 01005 and as large as 50 × 50 mm from picking to placement. XPii-II will accommodate components supplied on tape, strip tape, stick and matrix trays. The system uses Europlacer’s Integrated Intelligence, and is widely configurable, allowing two versions: 8 or 12 nozzles, tape trolleys or feeder trolleys, matrix tray sequencer, and an internal matrix tray. Unlike traditional chip-shooter style machines, XPii-II has no restrictions or limitations on component range. Europlacer, www.europlacer.com, Booth 2259.
ASTER Will Debut DfT Software Combining Electrical and Mechanical Analysis
ASTER Technologies will introduce its design for test (DfT) software to combine electrical and mechanical analysis. It has been developed to address a new vision of the DfT market that has to solve the many challenges that developers face today, such as shrinking release cycles, budget compression, and improvement in product quality. TestWay reference coverage analysis tool allows users to quantify and qualify the test coverage for a range of inspection and test equipments. It has been enhanced to address the problem for companies that subcontract the manufacture and test of their products, but need to know how to optimize the physical test access to achieve maximum test coverage. The probe analyzer is an interactive, rules-based routine that assists the layout engineer or test developer to identify any possible probe location based on the copper surface, which is useable for a physical access. Access constraints, spacing checks, test points assignment, use of the largest probe size, pin offset and Agilent’s bead probes are taken into account in accordance with company-specific guidelines. Once the potential probe placement has been identified, TestWay can estimate the test coverage for ICT and FPT based on the measurement capabilities of the targeted test equipment. The probe analyzer also generates a comprehensive accessibility report that states whether adequate probe locations were identified for each net, highlighting mechanical rules violations, so that this information can be fed back to design to support improvements. By reading the access report interactively with the layout viewer, color coding is used to assist the design and test engineer to graphically browse the non-testable nets in the design. TestWay provides a sophisticated level of coverage analysis by allowing users to define the test line and combine ICT or FPT with complementary test techniques such as AOI, AXI, BST, FPT, ICT, MDA, and functional test. It estimates the theoretical coverage aligned to various test strategies, prior to test development, to identify areas where test coverage can be improved, so that electrical rules could be applied to identify DFT violations that limit the test efficiency. The ability to estimate coverage that is aligned to the mechanical layout constraints of the PCB allows users complete visibility of what can realistically be achieved, so that the effectiveness of the completed test programs can be realized. TestWay is a scalable product from TestWay Express for coverage estimation and measurement to TestWay-Classic that provides additional features such as a fully programmable environment capable of supporting customer’s rules checking, test optimization criteria, advanced reporting and Boundary-Scan test generation. ASTER Technologies, www.aster-technologies.com
ASYS Group Shows Processing Equipment
ASYS has five process machines on display. Live presentations will be held at the show. ASYS Basic Marking BLS 01 is an in- and off-line laser marking system designed to cost-effectively mark PCBs using a CO2 laser. Benefits include off-line programming.The ASYS Depaneling ADS 03M Base is an off-line depaneling system that offers routing and dust management from the top. It has an ergonomic HMI.The EKRA Screen Printer X3 has alignment repeatability to ±15 µm @ 6 sigma, along with EVA EKRA Vision Alignment. It performs 2D inspection and is reportedly easy to maintain. The EKRA X4 screen printer has alignment repeatability to ±12.5 µm @ 6 sigma, as well as EVA. 2½D inspection features short circuit and stencil inspection. The EKRA Screen Printer X5 Pro also has ±12.5 µm accuracy and 2½D inspection, with a non-print cycle time of about 5 seconds. Standard print area is 20 × 20″ ASYS Group, www.asys-group.com, Booth 2247.