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Presentations of Note at IPC APEX EXPO
April 2, 2010 |Estimated reading time: 3 minutes
LAS VEGAS — Scan through some of the upcoming paper presentations and courses coming up next week, April 6-9 at IPC APEX EXPO in Las Vegas. Presenters come from Indium Corporation, Photo Stencil, UL, and more.
Ning-Cheng Lee, Ph.D, VP of technology, Indium, is presenting three papers. “Lead-free Flux Technology and Influence on Cleaning” investigates lead-free, cost pressures, and the question of “how clean is clean?” on Tuesday, April 6 from 1:30 to 3:00pm. “Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly” discusses the market outlook, assembly process methodologies and key infrastructure elements that have evolved to enable integrating the new generations of high-performance discreet logic and memory die elements within a single package outline. Lee will present this paper Wednesday, April 7, 10:15 – 11:45am. “Achieving High-reliability, Low-cost, Lead-free SAC Solder Joints Via Mn or Ce Doping” will be presented Wednesday, April 7 from 1:30 to 3:30pm. In this study, low-Ag SAC alloys doped with Mn or Ce were evaluated against eutectic SnPb, SAC105, and SAC305 for JEDEC drop, dynamic bending test, temperature cycling, and cyclic bending tests. Lee will also be presenting a professional development course, “Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration,” which addresses how multiple factors contribute to failure modes, and how to select proper solder alloys and surface finishes to achieve high reliability. The course will be held on Friday, April 9, 9:00am to noon.
Mario Scalzo, senior technical support engineer, Indium, will be presenting the paper “Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly,” on Wednesday, April 7, 9:00-10:00am. This paper discusses the head-in-pillow failure mode and a strategy to minimize this troublesome defect. He will also be presenting a paper authored by Tim Jensen, “Challenges for Implementing a Halogen-Free Process,” on Thursday, April 8 from 10:15 to 11:45am. Replacing halogenated compounds can have a dramatic affect on the PCB assembly process. This paper discusses those challenges, as well as techniques and practices that help ensure high end of line yields and continued reliability.
Eric Bastow, senior technical support engineer, Indium, will be presenting “Understanding SIR,” where he will discuss the issue of SIR coupon preparation, board cleaning techniques, and how board cleanliness directly affects SIR results. He will present on Wednesday, April 7 from 10:15 to 11:45am.
Chris Anglin, applications development engineer, Indium, will present “Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume.” This paper addresses the issues associated with stencil and squeegee design and the printing of paste for small passives. It will take place on Thursday, April 8 from 10:15 to 11:45am.
Ronald C. Lasky, Ph.D. PE, senior technologist, Indium, will be presenting a professional development course “Lead-Free Reliability” on Thursday, April 8, 9:00am-noon. This course will cover how to develop a strategy for compliant electronic assembly with high yields and excellent reliability while complying with global environmental regulations. www.indium.com
UL’s primary designated engineer, Greg Monty, is chairing a presentation, “The Changing Environment of Printed Circuit Board Technology and the Evolution of Safety,” on April 7 from 1:30 to 3:30pm. Among other topics, Monty will share insight on new testing technologies (including a CT scanner that can identify failures in devices), embedded components, lead-free requirements, new materials in PCBs and changes in graphing. http://ul.com/global/eng/pages/
Photo Stencil also announced that their VP of technology, William Coleman, Ph.D., will be participating in APEX technical conference S32 on printing, April 8th from 10:15 to 11:45am. Coleman will present “Stencil Options for Printing Solder Paste for 0.3mm Pitch CSPs and 01005 Chip Components,” which outlines the difficult challenges these devices present to the printing process and how stencil technology can address them. www.photostencil.com