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New Products for Electronics Test and Inspection
March 29, 2010 |Estimated reading time: 7 minutes
— In these new test and inspection releases, Johnstech debuted a configurable test contactor; Glenbrook combined optical and X-ray inspection; Seica added thermal scan to its flying probers; ASSET increased its Intel test coverage; Corelis updated its boundary scan toolset; Sonoscan offers inspection for high-reliability and anti-counterfeiting tasks; and Nordson YESTECH adapted the X1 for batch X-ray inspection.Configurable Kelvin Test Contactor
The Configurable Kelvin Pad ROL 200K Series contactor tests high-power and precision analog devices that require tight test guard-bands. This Kelvin solution is designed for mechanical and electronic performance, flexibility, and cost effectiveness. The Pad ROL 200K is configurable for general purpose IC testing and precision Kelvin testing, as needed. It features a solid Force Contact and dual touch Sense design for high-current, low-resistance connections regardless of device contact variations. It uses two self-cleaning features to maintain low and repeatable Kelvin contact resistance. A proprietary oxide removal wipe action prevents surface debris from accumulating on the Force Contact tip. In addition, the Contactor’s Force and Sense work in combination to remove debris buildup between the two Contacts. Johnstech International Corporation, www.johnstech.com.
Real-time X-ray and Optical Inspection Paired
The Dual-VU inspection system offers magnified real-time X-ray and optical component images at the same time and at the same level of magnification. It combines two patented Glenbrook technologies, real-time X-ray camera technology with magnification fluoroscopy technology featuring high-resolution zoom capability, taking an optical and an X-ray image of a complex component. This feature adds quality control and component authentication for electronic and medical components. On BGAs, hidden solder bridges or voids and surface problems can be revealed in a single pass. The Dual-VU allows the solder joint integrity and placement accuracy of leaded IC components to be verified simultaneously. The ability to view the surface and interior of the component at the same magnification, usually 15×, helps to identify remarked components rapidly. In failure analysis, signal traces on multilayer boards can be identified visually and tracked. Users of multilayer technology can use the Dual-VU to confirm electrical continuity of the plating after drilling. The X-ray system produces images that can be magnified from 7 to 40 times without repositioning the device being inspected. An additional vision camera and a precision dichroic mirror allow devices to be inspected optically along the same axis, at the same magnification and time. Glenbrook Technologies, www.glenbrooktech.com.
Thermal Scan on Aerial Flying Probers
Flying IC Thermal Detection Units, positioned on each side of the UUT to detect thermal parameters of ICs under power, are available on Aerial flying probers. The purpose is to compare temperatures of “known good” boards to “suspect” boards and indict bad components in the depot repair environment. Thermal sensors join the traditional features already present on flying probers, such as in-circuit (ICT), functional, boundary scan and power up test. The IC Thermal Detection Unit capabilities allows for precise thermal measurement of the IC or other components while the part is powered up even under low-voltage conditions. The AERIAL Prober is based on Seica’s proprietary VIVA Integrated Platform (VIP) core hardware and software. It suits testing prototypes, samples, and small- to medium-sized production runs. Four independent, mobile test probes, two on each side of the test board, enable simultaneous, accurate double-sided testing, while Seica’s proprietary OTPN (One Touch Per Net) technique characterizes the net and identifies faults on subsequent test boards. Additional tests, such as junction fault verification, are executed at the same time. Data collection and statistics functions are standard, and the system’s capabilities can be further expanded with optional in-circuit test and visual inspection software modules. Seica S.p.A., www.seica.com
Validation and Testing Tools for Intel’s Future Platforms
ASSET’s ScanWorks platform for embedded instruments will continue to support Intel’s Interconnect Built-In Self Test (IBIST) technology embedded in the chip company’s processors and chip sets, and ScanWorks will provide a comprehensive validation solution for high-speed input/output (I/O) on Intel platforms. “For six years we’ve been the industry’s only provider of IBIST tools. Additionally, the ScanWorks platform’s I/O instrumentation tools are expanding beyond Intel’s QuickPath Interconnect (QPI) high-speed serial bus, including functionality to perform bit error rate testing (BERT) as well as margining tests. In validation applications, these types of tests can be employed to validate that the high-speed serial I/O buses on a circuit board design will perform as expected before the design moves into high-volume manufacturing. ScanWorks’s next-generation tools will support major high-speed I/O buses, including QPI, PCI Express (PCIe), Direct Memory Interface (DMI), and Double Data Rate 3rd Generation (DDR3). ASSET InterTech, www.asset-intertech.com
Updated Boundary-scan Tool Suite
The latest version of ScanExpress Boundary-Scan Tool Suite, Version 7.0 CD, supports FlexNet licensing. Legacy software licenses will continue to be supported; however, all newly issued software and network licenses will utilize FlexNet. CD improvements include more file manipulation functions incorporated by the TPG scripting engine; test pattern generation support for the Firecron JTS06Bu 6-port JTAG gateway hierarchical device; increased ScanExpress JET Flash programming speeds, by up to 33%; support for 64-bit Flash address access; and new ScanExpress JET processor support for BCM7400, i.MX27, OMAP3530, and PPC603EV. Current Corelis customers that have a valid maintenance contract can now access the new Version 7.0 CD through the existing support website. To inquire about a maintenance package or to obtain a full list of improvements, contact Terri Martinez, maintenance program administrator, Corelis Inc.,(562) 926-6727; terri.martinez@corelis.com
Mil/Aero Reliability Inspection for Latent Defects
Sonoscan Critical Evaluation (SCE) is a confidential service that acoustically inspects critical electronic components such as hybrids, capacitors, and plastic-encapsulated microcircuits used in military and aerospace systems. Acoustic micro imaging nondestructively images hidden latent defects such as delaminations, cracks and voids. It also characterizes materials such as encapsulants. SCE handles individual components, hybrid devices, and printed wiring boards (PWB). The purpose of imaging is to locate, identify, and analyze internal anomalies that can cause electrical failures in service, such as die attach voids in a hybrid device or singulation cracks in a capacitor. In some applications, the interest is on purely mechanical features in items such as micro spot welds or multi-layer composite materials. To provide SCE, the SonoLab applications laboratory personnel work with hardware engineering, machine shop, software engineering, and other Sonoscan departments that give specific support as needed. Typically, client engineers handle their own parts and load them into a laboratory C-SAM system in a secure, certified room at the Elk Grove Village, IL, SonoLab. Acoustic imaging, according to the client’s requirements, is supervised by Sonoscan specialists who apply their expertise in critical areas such as image interpretation and the use of alternate imaging techniques to achieve the component reliability required by the client. The various Sonoscan departments can quickly design adapted fixtures to hold parts, or modify programs to provide the optimum imaging for the critical parts. Sonoscan, SonoLab manager Ray Thomas, (847) 437-6400 x245
Batch-loading X-Ray Inspection Debuts
The X1 X-ray inspection system is now available in a semi-automatic, batch-loading version. X1 provides a reportedly flexible, compact, and maintenance-free configuration. The X1 suits inspecting mixed BGA/SMT devices, connectors and plated though hole (PTH) assemblies. The high power 130Kv x-ray source provides ample energy to image even the most demanding samples, including those with metal sinks. The X1 is available with a 4 or 5 axis sample manipulator and a 15 × 20″ (380 × 508 mm) X/Y travel for samples up to 5 pounds in weight. Full 360 degrees of rotation and 30 degrees of tilt are available. Stepper motor drives provide a wide range of motion from ultra-slow use at high magnifications, to high speed for travel over large distances. All systems come with a control module and programmable motion for automated inspection. The X1 comes with proprietary machine vision technology for fully automated inspection of BGA and flip chip devices. Other automated inspections include die attach, bond wire and correct assembly verification. Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN), www.yestechinc.com
Sonoscan Expands Counterfeit Identification Menu
New analytical techniques bring to 25 the number of acoustically detectable features and characteristics used to separate counterfeit plastic IC packages from genuine packages, which are often within a mixed-lot shipment. Identifying a counterfeit component may be straightforward, he added, but is often more complex. Part of the problem is that counterfeiters are becoming more skilled at making their knock-offs resemble genuine components. Using a greater number of acoustic techniques increases the confidence factor when separating genuine parts from fake parts. “Identifying counterfeit parts may involve multiple disciplines: optical inspection, acoustic imaging, and sometimes X-ray. Acoustic imaging has the flexibility to go after hard-to-imitate features and material characteristics such as acoustic impedance, filler particle distribution, and bond integrity. Sonoscan, SonoLab manager Ray Thomas, (847) 437-6400 x245
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