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Ticona Vectra LCP Adds Dimensional Stability to Housing in Samtec BullsEye System
March 23, 2010 |Estimated reading time: 2 minutes
FLORENCE, KY AND KELSTERBACH, Germany — Samtec Inc., a worldwide manufacturer of a broad line of electronic interconnects, has specified a glass-fiber reinforced Vectra liquid crystal polymer (LCP) from Ticona Engineering Polymers for an injection molded housing used in its BullsEye test point system.
Samtec cited Vectra’s 30% glass-filled LCP E130i’s precision, high-heat resistance, dimensional stability, and mold flow as meeting its requirements for thin-wall electronic connectors. Vectra LCP is well suited for electrical and electronic components. "Its high flowability allows it to fill long, complex flow paths in molding and create thin-walled parts having outstanding dimensional accuracy, both of which are essential in creating high-precision parts like the housing that Samtec used in the BullsEye,” said Ed Hallahan, marketing manager, Vectra LCP. "Vectra LCP also gives electronic component manufacturers excellent dimensional stability and a low coefficient of thermal expansion, so they can consistently obtain dimensional accuracy with virtually flash-free parts at an economical cost."
Samtec’s BullsEye is a high-density, high-performance, low-cost solution that eliminates the need for expensive radio frequency (RF) connectors on production boards. An inexpensive microwave cable adaptor (RF25M) attaches to the existing SubMiniature version A (SMA) type RF connector on the test equipment, then to a plastic housing (CCH) on the board via a compression tip with locking features. A conductive elastomeric inside the plastic housing allows for the ground to transfer to the board in the same manner as it would in an SMA. The plastic housings use the same footprint as an SMA, but cost less. Ganged versions can be used to increase the density. The BullsEye unit contains a Vectra LCP housing that forms the heart of the RF connector.
Vectra E130i offers high-temperature capability for easier flow and quicker cycle times, making it suitable for applications where very thin walls are required; UL 94 V-0 listed at 0.20-mm thickness in natural and black; relative-temperature-index (RTI), according to UL 746B: electrical 464°F (240°C), mechanical 464°F (240°C), mechanical with impact 428°F (220°C) at 0.75 mm; inherently flame resistant without additives; and halogen-free.
Samtec Inc. is a worldwide manufacturer of PCB-level interconnects, www.samtec.com. Ticona, the engineering polymers business of Celanese Corporation, produces and markets a range of high-performance products, www.ticona.com or www.ticona.cn (Chinese language).
Attend the Lead-Free/RoHS Materials for Printed Circuit Board Manufacturing Webcast free on www.smtonline.com. Also read High-Performance Polymers for Environmentally Friendly Electronic Components.
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