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New Specialized Soldering Equipment for Selective, Reflow, Rework, and Wave Systems
March 22, 2010 |Estimated reading time: 4 minutes
— In the soldering equipment arena, Seho introduced a process gas cleaning system, Rehm debuted a new cooling zone design for reflow, Christopher Associates added a fluxless soldering robot, Seika released a nano rework station as well as a solder paste recycling unit, ACE added a spot preheat with nitrogen for selective, and Miyachi Unitek introduced a weld monitoring system.
Process Gas Cleaning System for Reflow Soldering Machines
The SEHO MaxiReflow is equipped with the latest cyclone technology, which extracts the contaminated process gas from all heated zones, leads it through a cyclone, and then directs the cleaned gas back to the heating area. The temperature inside the cyclone is controlled to allow optimum condensation. The cleaning system features water-supported process gas cleaning. By injecting a small amount of water into the cyclone, both liquid and solid residues are washed off and lead into an active carbon filter unit. This improves condensation of residues in the spray fog and provides an efficient washing down of residues inside the cyclone. As a result, the cyclone is kept cleaner for longer intervals between maintenance. The entire unit is configured as closed system, so the water is filtered and pumped back into the cyclone and the cleaned process gas is directed back to the last preheat zone. SEHO Systems GmbH, www.seho.de
Reflow Cooling Technology
A new cooling zone designs for the Vision Series convection reflow ovens creates homogenous cooling for large thermal mass PCBs. Depending on the length of the system, the cooling area in the VisionXP is laid out in 2, 3, or 4 stages. The fans in the individual zones, which are available with separate speed/volume control, can cool even lead-free-processed PCBAs to below 50°C. The system also provides precise cooling gradients that can reduce thermal stress and board twist/warp. A new bottom-side cooling configuration enhances homogenous cool-down, suiting reflowed thick PCBs, workpiece carriers, and PCBs with unevenly distributed inner copper layers. Rehm Thermal Systems, www.rehm-group.com
Fluxless Ultrasonic Soldering Robot
The Unisonik 414R fluxless ultrasonic soldering robot suits electronics assembly, photovoltaic manufacturing, and a range of other industrial applications. It solders materials such as glass, silicon, aluminum, and molybdenum. The Unisonik technology is available in a range of robotic platforms, as well as in a manual, benchtop unit. Christopher Associates and Japan Unix, www.christopherweb.com
Nano Rework Station
The MS6000 Nano Rework Station is a manual rework system for chip sizes down to 0402 (01005). Parts are supplied from the taping parts feeder and/or individual parts feeder. The parts can be picked up by a vacuum bit and positioned by the high-magnification CCD camera system. The MS6000’s CCD camera system is ideal for parts positioning and chip size parts pick-up. The system features a chip parts nozzle that accommodates chip parts as small as 0402. Chip parts are supplied at random on the circular glass palette and can be checked on the monitor. The circular glass palette can be moved and rotated left and right as needed. The MS6000 also includes dispensing capabilities with a 5-cc syringe. Other options include a tweezer head, a center vacuum bit, and an 8 mm tape feeder. Seika Machinery Inc., a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group, www.seikausa.com
N2 Spot Preheat for Advanced Selective Soldering
Nitrogen (N2) Spot Preheating capability is now available on the KISS line of selective soldering machines. N2 spot preheating makes it possible to focus and control superheated nitrogen delivery to a small, user-defined area of an electronics assembly to be selectively soldered. It is appropriate for soldering operations where large-area bottom-side or top-side preheating is not feasible and in situations where extended preheat cycles and/or extended solder dwell times represent a danger to the subject component or adjacent components. The N2 Spot Preheat feature proportionately controls parameters including ramp-to-temperature, volume of flow, and dwell time, creating a true small-area preheat profile. Integral controls and added programming to the company’s existing methods of using nitrogen within the system were used for the N2 Spot Preheat. Using N2 Spot Pre-Heat controls in conjunction with their nozzle and nitrogen cap design allows the user to program the delivery of the right amount of nitrogen, with the proper profile, through the solder nozzle before the solder begins to flow. ACE Production Technologies Inc., www.ace-protech.com
Resistance Welding Monitor
The Advanced Data Analysis Monitor (ADAM) gathers information to support ISO, GMP and TQM requirements. It monitors pre-trigger process conditions and what happens during the weld. Sophisticated SPC capabilities include an integrated database and Minitab 15 statistical software to collect and analyze data. Other key features include current, voltage, power, resistance, force, and cover gas flow monitoring; high-resolution sensors; pre-and post-trigger viewing; envelope limits; and Ethernet communications capability. ADAM is a desktop unit which comes with computer and wide-screen LCD monitor. Miyachi Unitek, www.muc.miyachi.com
Solder Paste Recycling Unit
The Solder Paste Recycling Unit enables approximately 90% of waste solder paste to be recovered as solder bar. The system provides a major decrease in disposal costs for factory waste, a reduction in CO2 emissions, and reduced demand for new solder bars. In approximately 34 to 45 minutes, the Solder Paste Recycling Unit turns wasted solder paste into solder bar. The unit enables selection of manual and automatic mode via a touch screen panel. Seika Machinery Inc., a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group, www.seikausa.com
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