-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
IPC APEX EXPO 2010: Exhibits Preview III
March 9, 2010 |Estimated reading time: 16 minutes
-- IPC APEX is coming up April 6–9 at the Mandalay Bay Convention Center in Las Vegas. This preview includes cleaner chemistry from Kyzen; test systems from Digitaltest, atg, and Seica; selective soldering systems from Juki and Seica; cleanliness test systems from Gen3 and Ascentech as well as Austin American Technology; process control from ProWorks and Microscan; reflow profiling from KIC; halogen-free solder from Indium; assembly systems from Siemens and Juki; and spray fluxing from Sonotek.
Over the next several weeks, SMT will bring you new product previews and highlights of the exhibit floor. Also see the first and second APEX exhibits previews for even more new products.
Kyzen to Debut pH-neutral Cleaner
Kyzen will feature AQUANOX A4703 Neutral pH Aqueous Cleaning Chemistry, an aqueous cleaning solution designed with a pH-neutral formulation. AQUANOX A4703 is combined with Kyzen’s inhibition technology for improved material compatibility. Additionally, A4703 is effective at concentrations as low as 3%, while being environmentally friendly and providing low cost of ownership. This chemistry was developed for use in spray batch and spray in-line cleaning systems to remove OA, no-clean, and RMA pastes and fluxes, including difficult lead-free residues. AQUANOX A4703 is easily controlled by refractive index, manually or when using an automated process control system such as the Kyzen PCS. AQUANOX A4703 is available in one, five, and 55 gallon containers. Kyzen Corporation, www.kyzen.com, Booth 2241.
Digitaltest Displays Hardware and Software
Digitaltest will showcase a range of economical Digitaltest solutions, both hardware and software for ICT/functional test and flying prober technology. The MTS500 Condor II Flying Probe Tester is now 30% faster. The faster probing speed results in improved testing throughput without compromising probing accuracy and repeatability, or the high levels of test coverage made possible by targeting access points down to 75 µm. The prober's motion time is further reduced by the Condor’s optimization of Z, as well as X/Y, movement. This automatic process calculates the highest component level along the path of motion and raises the probes to just above this level. To limit test program development time, the Condor II features advanced software support that reduces test program generation and commissioning time. C-LINK DTM Design to Manufacturing software combines CAD translation, component database management, and program generation. Additional system software tools include interactive schematics for debug, and on-line modification tools that allow implementing tests for PCB hardware modifications. The MTS500 CONDOR features four identical flying test probes and over 1000 fixed pins. It has a SMEMA-compatible conveyor and tests boards up to 16 × 24″. The test probe travels toward the component or pad at a normal speed until it is approximately 1-2 mm above target, when it decelerates to a transition speed maintained for the remainder of the spring probe compression. Adding this “Softlanding” to an existing probe contact can reduce the footprint size by one third. Also at APEX, the MTS300 SIGMA is designed for flexibility, high fault coverage, and easy programming with a modular design. Future changes to individual test methods, as well as to the number of test system pins, can be easily performed with the MTS300 SIGMA. The system performs up to 1,000 measurements/sec. SIGMA test systems provide analog and digital ICT capabilities, Vectorless Testing, Functional Test, Boundary Scan and On-Board programming. The MTS300 can also be integrated into a handling system, with enough space for the MTS300 test system rack plus additional space for IEEE or VXI Instruments. Short wire connections guarantee signal integrity and quality. In addition to the C-LINK DTM software, Digitalest offers C-LINK QMAN, a powerful yet easy to use quality management software. It gathers test data from the production floor to ensure product quality goals are met. It provides complete data analysis to assess the efficiency of the production process, generate full reporting and raise alerts when problems arise. Digitaltest Inc., www.digitaltest.net, Booth 459.
New Cleanliness Testing Systems
GEN3 Systems and Ascentech will introduce a line-up of Ionic Cleanliness Test systems at IPC APEX 2010. Ascentech is the North American distributor for GEN3 Systems Ltd. products. The line-up consists of systems with larger test capacity, innovative measurement software and hardware, and a new budget-sensitive cost structure. All the new systems deliver a measurement range of 0.01-30 µg/cm² (Auto-ranging) and measurement sensitivity of <0.25% of range. Additionally, all of the systems deliver a test measurement accuracy of better than 0.005µS. GEN3's "Curvefitting" algorithms enable test times of generally less than 5 minutes. Other features include a solid gold measurement cell for accuracy and reduced maintenance, and the implementation of a Ballistic Amplifier in the measurement circuitry for high accuracy and the elimination of polarization effects. The series includes the CM11, 22, 33, and 66 (differentiated by test chamber size). The CM-66 also incorporates the "VMC," which automatically calculates the surface area to be tested. Other products being exhibited in the Ascentech booth include the MUST III Solderability tester (wetting balance); Auto-SIR, Surface Insulation Resistance test; SPA-1000, Solder Paste Analyzer, DC Series and SB, precision dip-coating and spray coating equipment; and the Gensonic SMT Stencil Cleaning system. Ascentech LLC, rallinson@snet.net, Booth 2359.
Assembly, Soldering, and Other Equipment
Juki Corporation will showcase a range of products. With IPC speed of 60,000 CPH, the FX-3XL (large board size 22 × 24") expands Juki’s assembly equipment. The modular FX-3 offers optimization software and quick-change feeder banks. The KE3020XL (large board size 22 × 24") is the newest flexible placement machine from Juki that offers flexibility, accuracy, and repeatability, and can be used in-line with the FX-3XL. Juki will also display its new, motor-driven electronic feeder for steadily feeding ultra small components sensitively and quickly. With the electronic feeder, there is no need to stop the machine when replenishing components using the splicing function. The feed pitch can be changed with the press of a button, and status is displayed by a seven segment LED. Feeder loading and unloading is simple. Also at the show, the JX-100 can now be used in-line to support long, narrow LED board applications. The JX-100 also suits NPI and low-volume/OEM applications. The system combines high versatility with a reasonable price, is easy to operate, and has a small footprint. It uses state-of-the-art laser centering and shares feeders and nozzles with other Juki models. The FX-2 high-speed chip mounter is Juki’s latest high-speed modular mounter with production capacity increased by 20% over previous models. The FX-2 supports centering and placement of components from 0402 (01005) to 33.5 mm sq. Efficient, high-speed production lines can be created by connecting a high-speed FX-3 or general purpose mounter such as the KE-2080. The FX-2 uses the same nozzles, feeders and production data as other Juki mounters. The KE-2080 is a high-speed modular flexible mounter built on the one-piece SuperCast single casting base. Combined with the new LNC-60 high-resolution 360° component laser centering system and an improved magnascale resolution down to 1 mm, the KE-2080 is 25% more accurate than previous models. It introduces the Load Cell option that can measure nozzle placement force necessary for high accuracy, stackable and fluxing applications. The KE-2080 also introduces new stepper motors in the conveyor system that allow enhanced speed control. The motion control communications have been upgraded to fiber optics. A USB port now is available for machine communication. The TR-6 Matrix Tray Changer is equipped with a dual shuttle that brings the components to the head for picking. Components with a minimum flat surface of 5 × 5 mm can be picked with a vacuum nozzle (TSOP, QFP, PLCC). Other rectangular components such as BGA, FBGA and connectors with a minimum outline of 17 × 17 mm will be handled mechanically. IS Software for production preparation, scheduling, quality and monitoring brings together related functions in one software package using a server-based architecture. IS is composed of individual pieces of software specialized for each type of job classification and a series of options for higher added value. The client-server system allows you to manage multiple JUKI lines. IFS-X2 is an RFID intelligent feeder system that uses a closed-loop interface for error-free feeder set up. IFS-X2 also supports board and component traceability for component tracking down to the board level. The system uses Cogiscan leading-edge RFID technology and the new CAMX equipment communications standard to integrate the advanced Juki machine intelligence with components and feeders as well as other machines and manufacturing systems.In soldering equipment, Juki will highlight the FlexSolder W510 inline with a new flexible design, allowing the machine to be assembled anywhere and complete option upgrades in the field. Multiple mini-wave nozzles can solder simultaneously or run separately (using two different size nozzles). A nozzle as small as 1.8 mm can be used for tight areas (1 mm away from SMD or other components) on densely populated boards and a larger nozzle for making single passes on large connectors. Juki, www.jas-smt.com, Booth 1735.
KIC to Introduce Profiling Study
KIC will share the latest science and products for reliable nondestructive methods of reflow profiling. KIC and the Rochester Institute of Technology have completed a groundbreaking study in the field of thermocouple attachment that explores methods of creating offsets in place of drilling holes and other destructive means for high interest components, such as BGAs. Additionally, hard science on the best attachment method of thermocouple attachment is also covered in this report. Visitors can request a copy of this report, as well as explore some of the hardware and software options currently on the market for nondestructive profiling. Booth visitors also can try to beat KIC’s auto-prediction Navigator for a chance to win prizes, including the new Apple iPad. KIC, www.kicthermal.com. Booth 1549.
Combination Cleaner and Cleanliness Tester Demo by AAT
Austin American Technology Corp. has developed a combination cleaner and cleanliness tester for circuit assemblies. The Mega Ion is a portable closed-loop single board cleaner with R.O.S.E cleanliness verification testing built in. Mega ION completes the cleaning operation with an industry standard ROSE test giving the actual micrograms NaCl eq/per square inch and a real pass/fail. It is designed to provide verifiable cleaning support locally to manufacturing operations such as touch-up, add-ons, ECOs, product development, and pre-conformal-coating cleaning. The cleaning system can use a selection of solvents from traditional water and IPA blends to proprietary solvent blends, matched to the residues that need to be cleaned. The spray under immersion cleaning process can be followed with an automatic measurement of the ionic cleanliness of a circuit board. A built-in dryer completes the cleaning/testing cycle. The cleaning system is sealed to use a minimum amount of solvent (<100 gals/year). The solvent is automatically renewed with built-in mixed bed ion exchange resin tank that removes anionic and cationic soils. The ROSE cleanliness test method relies on dissolving the residue in a mixture of IPA and water. Many fluxes are marginally soluble in this cleaning fluid. If the residue is not dissolved then the remaining residue is not detected by the ROSE method. The Mega Ion overcomes this problem by using other solvent blends with improved solubility to extract the residues; all tanks are made of stainless steel. The system has a small footprint built in a stainless-steel floor standing mobile cabinet (with lockable casters) requiring 220 volts , air/nitrogen supply, and a vent. Noise levels are below 80 dB. The Mega Ion is UL Compliant: UL 1950 (standard), CE and CSA Certifiable and is designed to NFPA 79. Austin American Technology Corp., www.aat-corp.com, Booth 2242.
atg Luther & Maelzer to Display A5-8 High-Speed Flying Prober
atg Luther & Maelzer GmbH, in cooperation with Everett Charles Technologies, will highlight its A5-8 Head high-speed flying prober at APEX. The A5-8 (Eight Moving Probes) provides CF (Click and Flip Shuttle) for thin panel and flex testing; soft touch probe tips (down to 2g of force for lightest witness marking); and embedded components option for testing inductance, buried resistors, and capacitors. Additional available options include 4 Wire Kelvin Measurement; Automatic Verification (from grid system); Latent defect detection also available; LA-Test is patented by atg-LM; MSD, Micro Short Detection. Everett Charles Technologies (ECT), www.ectinfo.com, Booth 1782.
Microscan to Exhibit Track, Trace, and Control Solution
Microscan will debut its Track, Trace and Control (TTC) Solution, developed in partnership with Cogiscan. The flexible solution features new Microscan TTC middleware, which can partner with any of Microscan's machine vision or auto ID hardware to address plant-wide information. The TTC middleware is the first jointly released solution since the company’s strategic partnership agreement with Cogiscan last year. Microscan’s TTC middleware is specifically designed to provide work-in-progress (WIP) visibility through any factory (tracking), validate the process flow (control) and provide the history of the process steps accomplished on a product (traceability). With TTC middleware, efficient data collection is combined with error proofing to demonstrate process compliance, while reducing material and assembly costs. This new solution ensures that the right material is at the right place at the right time, along with the historical data to prove it. The middleware provides complete, real time data visibility across the plant floor for any and all data collection points. This can include data collected from machine vision inspections, RFID, barcode and 2D readers. The Microscan TTC solution allows simple implementation, featuring Web-based controls and reporting, separate from the main IT plant floor network. The solution includes middleware, choice of hardware and complete visibility online for real time reporting. Connectivity to all commonly used MES and ERP systems is easily accomplished. Additionally, it features visual warnings and alarms if a product is scanned at the entry of the wrong operation or if the operation is out of sequence. For more information on Microscan, www.microscan.com, Booth 1826.
SEAS Intros SIPLACE SX Placement Machine
Siemens Electronics Assembly Systems (SEAS) will introduce its SIPLACE SX placement machine platform. The SIPLACE team will demonstrate adding to existing line capacity without influencing feeder capacity. SIPLACE SX offers optimum placement speed and feeder capacity with scalable gantry modularity. The SIPLACE SX has 120 feeder positions on 1.5 meters of line space. Additionally, the SIPLACE team will demonstrate how the SIPLACE SX powered by the SIPLACE MultiStar (Collect & Pick & Place) head can cover the entire component spectrum using only one placement head in three different placement modes. The SIPLACE SX, the SIPLACE MultiStar CPP head and flexible services such as SIPLACE Rent-a-Gantry, being featured at this year’s APEX, deliver line scalability. The SIPLACE SX features proprietary exchangeable gantries, which can be installed or uninstalled by a single person in less than 30 minutes. Users can increase or decrease the placement capacity of their SMT lines and shift performance between lines in accordance with specific order requirements. Since the SX gantries calibrate themselves and the software recognizes them automatically and adjusts the placement programs accordingly, adapting production to short-term order fluctuations or introducing new products. To make an appointment for a private demonstration at the APEX show, contact your local SIPLACE Sales Representative. Siemens Electronics Assembly Systems, www.siplace.com, Booth 2011.
New Process Management Software from ProWorks
ProWorks, a division of Everett Charles Technologies, will demonstrate its new productivity modules. ProWorks is a multi-user process management software tool that enables businesses to deploy and manage the execution of work instructions and processes throughout their organizations. Unlike conventional documentation tools, ProWorks turns your work instructions into a real time, integrated component of your manufacturing floor. This yields reports based on real time performance, quality, and material flow. ProWorks’ software allows users to author and distribute work instructions more efficiently than the typical "Office" tools that are most commonly used. The application is geared towards creating rich content with graphical information (pictures and video) and acts as a portal to retrieve and store all process related data. ProWorks' database allows for a true multi-user, and multi-site, environment that enables the collection and distribution of knowledge and centralizes all Work Instruction information. ProWorks can share data with ERP/MRP/PLM systems to ensure the information on the shop floor is accurate and up to date. Everett Charles Technologies, Booth 1782 and ScanCAD, Booth 1447, www.proworksinfo.com.
Indium Features New Halogen-free Lead-free Solder Paste
Indium8.9HF-1 Solder Paste is a no-clean lead-free halogen-free solder paste that offers stencil print transfer efficiency to work in a broad range of processes. Indium8.9HF-1 has a high oxidation barrier to eliminate graping and head-in-pillow defects. Indium8.9HF-1 was designed for thermal stability and soft, pliable residue after reflow. Indium8.9HF-1 has strong print transfer efficiency on 0.4-mm-pitch CSPs and is halogen-free per the EN14582 test method. It exhibits low voiding (<5%) over many profiles when soldering BGAs with via-in-pad technology. It also offers a robust processing window that can minimize potential defects, as well as accommodate various board sizes and throughput requirements. Indium, www.indium.com, Booth 441.
Seica Features Test Products
The AERIAL M4 is a cost-effective flying probe tester for production test, repair, and reverse engineering. The AERIAL M4 has a vertical architecture with two flying test probes on each side, two additional Openfix probes and two cameras (one on each side). This configuration allows the Aerial M4 to perform true in-circuit tests, giving full access even to boards that do not have all the test points on one side only. The system also has the capability to place guarding points, as well as use all of the vectorless test techniques for ICs, with or without powering up the UUT. The PILOT V8 flying probe test technology offers high test speed for low to medium volume operations and high test coverage and flexibility. Seica will demonstrate the latest updates on Pilot V8 on video at Apex. With 8 electrical flying test probes (4 on each side), 2 Openfix flying probes (1 on each side), 2 power flying probes (1 on each side) and 2 CCD cameras (1 on each side), the Pilot V8 has 14 mobile resources available to test the UUT, all included in a vertical, very compact and robust architecture. The system also includes statistic functions and procedures of the retest of failures. Aiming to further enrich its range of solutions for the test and repair of electronic boards, Seica, in partnership with Temento Systems, has developed the FlyScan module as a new approach to the integration of the boundary scan technique and flying probe test systems. The true innovation of FlyScan is available on the complete line of Pilot/Aerial flying probe testers. It offers automatic generation of the test program in a single software environment (Seica VIVA); automatic creation of the boundary scan program also for nets that are not of the JTAG type, using the “extended test” function and the flying probes to transform them into “JTAG testable” nets; automatic elimination of test redundancies; automatic fault diagnostics, with real-time generation of additional tests executed by the flying probes for the specific identification of the faulty component. A single test report is generated in the VIVA environment. It manages the faults detected by the boundary scan test in the Seica Repair Station environment.On display at Apex will also be the Firefly selective soldering system. Due to the fine-pitch solder capability of Seica’s laser system, when new production builds are being contracted out, some of the previously difficult solder operations are being reviewed against the latest solder process technology. The system can use lead-free solder; it prevents undesirable thermal stress. Laser technology allows a non-contact soldering process. It can solder a wide range of components; i.e. through-hole components, pin grid array, odd form components, RF shielding and connectors. Seica S.p.A., www.seica.com, Booth 973.
Sono-Tek to Feature Spray Fluxing
Sono-Tek Corporation will feature the SonoFlux EZ Ultrasonic Reciprocating Spray Fluxing System, an economical system designed on a reciprocating platform. The ultrasonic atomization module in SonoFlux EZ uses a high-impact flux transfer system for maximizing topside fill. The system is easily integrated into all major wave solder machines and is compatible with all PCB fluxes, including fluxes that contain rosin (often used in lead-free manufacturing). The SonoFlux EZ brings all of the benefits of ultrasonic spray fluxing to manufacturers otherwise unable to invest in a higher-cost ultrasonic spray fluxing system. Sono-Tek, www.sprayfluxing.com, Booth 1783.
Join the PennWell SMT Group on LinkedIn
Become a Fan on SMT's Facebook Page
Post your electronics manufacturing, SMT-related material to the #SMT community on Twitter. Use the #SMT hashtag.