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NBS Adds 3D Solder Paste Inspection (SPI) from VI Technology
February 24, 2010 |Estimated reading time: 1 minute
SANTA CLARA, CA — EMS provider NBS acquired four VI Technology post-print automatic solder paste inspection (SPI) systems for its advanced manufacturing facility in Santa Clara. Its deployment and use of structural test verification technology identified the value of adding the new equipment.
Typically the need for in-line solder paste inspection is driven by maintaining production line stability and providing notification of process deviation after print. With extremely frequent change over and often smaller run sizes, NBS has different needs than many other SMT manufacturers.
NBS director of engineering Jeff Armato commented on the new installation, “Adding 3D SPI will enable us to deliver an even higher level of product quality. Our goal is always to meet or exceed the requirements dictated by the product designs from our diverse customer base. Some very specific goals and acceptance criteria had to be met in order for SPI to properly serve our manufacturing environment. We needed printer verification, even on first time builds; 30 minute or less CAM to board test time; minimal false calls; and data with traceability to downstream inspection and test.” He cited VI Technology 3D-SPI’s ability to meet process repeatability needs while reducing incidents of rework.
For more information about NBS, visit www.nbscorp.com.