-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Siemens Electronics Assembly Systems Concludes SIPLACE SX Road Show
February 4, 2010 |Estimated reading time: 1 minute
SUWANEE, GA — Siemens Electronics Assembly Systems (SEAS) completed its five-stage SIPLACE SX Road Show of North America in January of 2010. More than 200 visitors from 60 different companies attended the show. The SIPLACE Team performed more than 100 live placement system gantry upgrade demonstrations during the four-month tour.
The Road Show took the SIPLACE SX systems through Mexico, the U.S. and Canada. Mark Ogden, marketing manager for SIPLACE in the Americas stated “We are very pleased with the overwhelming response to our SIPLACE SX Road Show, with a fully booked schedule and some demonstrations even taking place on the weekends. The SIPLACE SX pick-and-place platform is capable of providing rapid capacity upgrades without needing to reconfigure line layouts or change product set ups. The system’s Multistar placement head has three placement modes.
The SIPLACE Team has been demonstrating its new concept of “Real Capacity on Demand” to show manufacturers an affordable SIPLACE SX concept that combines minimal initial investment with maximum scalability. Additionally, the SIPLACE team has been demonstrating how the SIPLACE SX powered by the SIPLACE MultiStar (Collect & Pick & Place) head can cover the entire component spectrum using only one placement head in three different placement modes eliminating the need for head changes and line reconfigurations.
For more information on the SIPLACE SX, visit www.siplace.com.
Join the PennWell SMT Group on LinkedIn
Become a Fan on SMT's Facebook Page
Post your electronics manufacturing, SMT-related material to the #SMT community on Twitter. Use the #SMT hashtag.