-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
KIC, Rochester Institute of Technology Study to be Presented for SMTA Boston
January 28, 2010 |Estimated reading time: 1 minute
BOSTON — KIC and Rochester Institute of Technology (RIT) recently completed a study dealing with reliable non-destructive methods for profiling BGAs. Brian O'Leary, national sales manager for KIC Thermal Profiling, will present their findings to an SMTA Boston meeting February 9, 2010 in Boxborough, MA.
KIC has a developed a quick and easy multi-step approach to profiling electronic assemblies. During this session, KIC will introduce attendees to an updated approach to profitability. As part of the presentation, KIC and the Rochester Institute of Technology recently completed a comprehensive study on discovering reliable non-destructive methods for profiling sensitive critical components such as BGAs. This study demonstrates the merits of various thermocouple attachment methods and how common tried and true practices are drawn into question since they are seen to have a negative impact on modern profiling reliability. Based on these new findings, KIC will discuss strategies for profiling complex PCBs that do not require drilling holes and destroying components in the process. Creating off-set as well as how to balance your board will be discussed. Depending on time allowed, other soldering topics can be covered to include simple profiling basics, profiling for energy savings, continuous monitoring with reflow process inspection, SPC, and traceability. Hardware and software will be available for attendees to try out at the end of the presentation. Participants will have a chance to win a copy of the 2009 Profiling Guide, full of tips and examples on how to improve your reflow process. KIC is represented exclusively by Dave Wilson of Competitive Edge Solutions LLC in New England, www.cesolutionsllc.com. O'Leary has presented at various SMTA chapters showing innovative concepts for improving processes and yields. He also developed an independent book titled Profiling Guide for Profitability. His Website, www.profilingguru.com, hosts discussions on profiling tips, energy conservation, thermocouple (TC) attachment as well as more advanced concepts. The web site features articles, videos and podcasts.
If you make a reservation and cannot make the meeting, inform the SMTA Boston chapter by noon on Monday, February 8. If you have questions, contact Michael Jansen at 978-987-3716 or Michael Sivigny at 603-566-2141.
RSVP Deadline: Friday February 5th, 2010. Click Here To RSVP