Present at a Major 2010 Electronics Tradeshow Conference

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IPC APEX EXPO (April 6–9 in Las Vegas) and SMTA International (October 24–28 in Orlando, FL) are accepting paper abstracts for the technical conference programs. APEX Poster Presentations

Submissions are sought in all areas of the electronics industry, including design, materials, assembly, processes, and equipment, especially design, embedded passive & active devices, flexible circuitry, HF, lead-free, printed board fabrication, rework & repair, RFID circuitry, SMT assembly, test & inspection, printed electronics, package on package assembly, and solar cell assembly. Provide an abstract of up to 300 words that summarizes technical and previously unpublished work covering case histories, research and discoveries. Previously published papers and papers focused on a company or its products are not appropriate and will not be accepted. IPC must receive the abstract by January 22, 2010. Conference speakers are entitled to a copy of the Proceedings and a free One-Day Conference Pass for the day of their presentation. Submit online here: To foster better cooperation between industry and academia in the critical areas of electronic interconnection technology, IPC is sponsoring an all academic poster competition as well. All accredited U.S. and international colleges and universities with a strong focus on the electronics industry are invited to submit a poster abstract for IPC APEX EXPO. In recognition of the hard work of academia, cash awards will also be available to the winning poster authors. A poster showcase on the exhibition floor will present the academic research work to the attending engineers, managers and executives from all segments of the electronic interconnection industry worldwide. Submissions for posters are sought on research into design, materials, processes and equipment in the same categories as the industry poster presentations. To submit, provide an abstract of approximately 100 to 300 words that summarizes technical and previously unpublished, noncommercial work covering case histories, research and discoveries. Abstracts must be received by January 15, 2010. Abstracts must be submitted on behalf of an accredited college or university. A technical committee will make a pass or fail determination regarding subject matter and appropriateness of your submission for this competition. All passing poster abstracts will be posted on the IPC APEX EXPO show Web site. Industry technologists worldwide will be invited to vote online for the best poster abstract based on innovation, timeliness of the work and applicability to industry needs. The top 10 winners will be invited to come to Las Vegas, where exhibition attendees and exhibitors will vote on the best poster. Prizes will be awarded for first, second, and third place. Winners will be announced in Las Vegas during the show floor reception on Wednesday, April 7, 2010. Submit online here:   For more information about poster participation or other ways of participating, contact Greg Munie, Ph.D., IPC technical conference director, or Toya Richardson, IPC technical administrative assistant at (847) 597-2825. Also visit  

SMTA International (SMTAI)

The SMTA International Technical Committee invites industry members to submit an abstract for the 2010 conference. Short course descriptions are also being solicited. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Materials should be original, unpublished and non-commercial in nature. Abstracts are due March 5, 2010. Acceptance information will be sent May 20, 2010. Accepted manuscripts are due July 16, 2010. Be sure to obtain approval to write and present a paper prior to submitting an abstract. SMTA is soliciting papers in the following categories: Emerging Technologies: 0201/01005 Components and Assembly, Consumer Applications, Electronic Printing Technology, Embedded Technology / Actives and Assembly, Flexible Electronics, MEMS/RF, MEMS/MOEMS, Nanoelectronics, Reliability of Nanodevices, New Materials and Processes, Optoelectronics, Power or Thermal Management, Sensors and Manufacturing, Solar Technology, System in a Package, Thermal Interface Materials, and Wireless Applications including Bluetooth and Wi-Fi Components: BGA, Battery Interactions, BTCs (Bottom Termination Components), CSP (including Wafer-Level Packages), Component Solderability, Component Reliability, Connectors, Embedded Passives, Failure Analysis, Fine Pitch Technology, Flip Chip / Direct Chip Attach, Lead/Termination Finish, Leadless Packaging, Multichip Packages (including 3-D Packaging, Package on Package), and Tin Whiskers. Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Halogen and Halogen-Free, Head-in-Pillow Defect, Land Pattern Design, Lead-Free Soldering (including case studies), Lead-Free Reliability, Lean Manufacturing, Low Volume / Prototype Assembly, Medical Electronics, Placement, Printing, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Solder Voids, Supplier Engineering, Underfill, Vapor Phase Reflow for High Reliability Assemblies, Wave Soldering, Yield Improvement. PCB Technology: Black Pad and Surface Finish Defects, Embedded Passive and Active Components, Halogen Free, HDI, Microvias (including filled and unfilled), Moisture Sensitivity, Soldermask, Substrate Reliability, Substrate Solderability, Surface Finish. Process Control: Acoustic Imaging, AOI, CIM, In-Circuit Test, Process Modeling, Software, Test Strategies, X-Ray. Harsh Environment Applications: Components and Component Reliability, Lead-free Issues for Harsh Environments, Substrates, and Thermal Management. Business: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing / Quality Initiatives, Operations Management, Remaining Competitive, RoHS Compliance, Supplier Management, Technology Roadmaps. Submit online here:   For more on SMTAI, visit



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