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New Test and Inspection Products
October 28, 2009 |Estimated reading time: 10 minutes
— These are the new advances in flying probes, in-circuit test (ICT), AOI, test contactors and probes, boundary scan, and more test and inspection systems.
Flying Probe and Boundary Scan Test
The FlyScan module integrates boundary scan technique with flying probe test systems. It is available on the complete line of Pilot/Aerial flying probe testers. Automatic generation of the test program is done in a single software environment (Seica VIVA). Automatic creation of the boundary scan program is also for nets, which are not of the JTAG type, using the extended test function and the flying probes to transform them into JTAG-testable nets. Test redundancies are automatically eliminated. Automatic fault diagnostics, with real-time generation of additional tests executed by the flying probes for the specific identification of the faulty component, is an additional benefit. A single test report is generated in the VIVA environment. Management of the faults detected by the boundary scan test is done in the Seica Repair Station environment. The FlyScan module exploits the specific benefits of flying probe and boundary scan testers, creating a single test program that utilizes the full capabilities of both, not as two entities working independently, but in a fully integrated system. Seica, in partnership with Temento Systems, www.seica.com.
AOI System
The FX-Series AOI features advanced 5-megapixel color camera technology and Fusion Lighting, offering high-speed PCB inspection with exceptional defect coverage and a low false failure rate. With one top-down viewing camera and four side viewing cameras, the FX-Series inspects solder joints and verifies correct part assembly. Programming typically takes less than 30 minutes to create a complete inspection program including solder inspection. The FX-Series utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. Color inspection, normalized correlation, and rule-based algorithms provide inspection coverage. The systems are configurable for paste, pre-/post-reflow, and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring is available. YESTech, a subsidiary of Nordson Corporation (Nasdaq: NDSN), www.yestechinc.com.
Test Automation Platform
TestShell 4.1 automated test solution for hardware, devices and embedded systems offers new features for greater usability and flexibility. TestShell Test Authoring Applications were updated for more versatility and capabilities. Session Management allows greater control and tracking of tests, steps and functions; Enhanced Graphical Parsing capabilities provide fast, automated extraction of dynamic data; and advanced Web and GUI recording features allow direct interfacing and easy implementation within the test. The upgrades provide enhanced test creation experience and will further reduce test creation time and efforts. Data manipulation, tracking and debugging are now made even simpler with upgraded data filters, queries and dynamic data tagging. Advanced and customizable reporting capabilities allow users to examine different levels of test data and track automation coverage according to the product’s specific requirements. TestShell 4.1 is available to all existing customers as part of the Annual Maintenance and Support program. QualiSystems, http://www.qualisystems.com.
Desktop AOI
The S2088-II desktop AOI inspection system is equipped with automatic paste print, pre-/post-reflow, and THT solder joint inspections. The S2088-II includes high-performance 8M camera technology, with the same angled inspection and OnDemandHR function as Viscom’s in-line systems. Faster loading/unloading and large PCB fixturing are standard. The desktop S2088-II features high-performance camera modules, intelligent software, and advanced PCB clamping, along with a comprehensive IPC-compliant inspection library. AOI inspection programs can be quickly and easily transferred to other systems, including the S3088-II, S6056, and X7056. A program developed on the desktop S2088-II for low-volume NPI circuit boards can also be used in high-volume in-line AOI machines at other manufacturing locations. The S2088-II can inspect PCBs up to 20 × 18″. Boards are changed within a few seconds due to a directly accessible PCB tray. A mobile work table designed for this system is available as an option. The system’s angled camera technology with integrated standard and high resolutions positively detects critical production errors such as lifted leads. Viscom Inc., http://www.viscom.com.
Flying Probe Collaboration
ITOCHU will supply their TAKAYA flying probe tester with ASTER’s TPQR for TAKAYA, the test coverage analysis tool. TPQR for TAKAYA is a low-cost test coverage analysis tool that allows users to independently compute the test coverage provided by TAKAYA alone, or combined with other test/inspection equipments. TPQR is built around the QuadView next-generation viewers for the electronics industry. Utilizing this powerful layout and schematic viewer, users can visualize coverage at both device and pin level. This software imports the TAKAYA test program, computes the test coverage and generates detailed reports in HTML and MS-EXCEL format that provide precise, detailed and impartial international test coverage metrics, such as PPVS and PCOLA/SOQ. When the TAKAYA is combined with Boundary-Scan test equipment such as ACCULOGIC, ASSET, CORELIS, Flynn, GOEPEL, JTAG Technologies or XJTAG, the TAKAYA test program is dynamically optimized by removing the redundant test steps. The flying probe test time could be reduced by a factor of 30 to 80%. ASTER Technologies and ITOCHU, www.aster-technologies.com.
Boundary-Scan Controller
A high-performance boundary-scan IEEE Std. 1149.1 controller, the DataBlaster JT 37x7/PCIe supports the PCI-express slot format found extensively in PCs. The PCIe bus is a high-speed serial replacement of the older parallel PCI bus. The boundary-scan controller satisfies requirements for high-speed in-system programming (ISP) of flash memories and CPLDs and complex digital circuit testing. The new DataBlaster JT 37x7/PCIe offers the user sustained test clock speeds of up to 40MHz by use of proprietary ETT (Enhanced Throughput Technology) system and features a flash image buffer memory which may be expanded to 128 Mb. Supplied with the QuadPOD, the new DataBlaster/PCIe offers four synchronized test access ports (TAPs) to support multi-TAP test targets or gang programming four single TAP targets. QuadPOD is low-voltage ready and allows maximum test speeds at the target by incorporating high-speed signal conditioning, logic threshold adjustments and cable delay compensations in a compact, remote, extension module. The scalable DataBlaster JT 37x7/PCIe range starts with the low-cost entry model JT 3707/PCIe for high-speed 40MHz test applications and in-system PLD programming. Companion models JT 3717/PCIe and JT 3727/PCIe, optionally fitted with an ETT module for flash ISP, support high-throughput flash programming as well as test and PLD programming. ETT supports memories with data-bus widths from 1 bit to 64 Kb. DataBlaster PCIe units are compatible with all revisions of JTAG Technologies test and ISP tools. JTAG Technologies, www.jtag.com.
Fine-pitch Test Probes
These probes are available in sizes from 20 to 8 mils, along with corresponding test fixtures. A new-generation fine-pitch test probe series can probe tightly spaced and small electrical targets with ±15 µm pointing accuracy on 10-mil center-to-center placement. The µHELIX test probes are available in diameters of 20, 16, 12 and 8 mils. These include fine-pitch spring-loaded test probes that can meet the mechanical challenges of testing miniature circuits such as hybrids; RFID antennas; flex circuits; flat panels; and StripLine, BGA, CSP, SOC, SiP, MEMS, MCM, and photonic packages. AlphaTest Corporation, www.alphatest.com.
CSP Test Socket for Smaller Devices
A chip scale package (CSP)/microBGA test and burn-in socket with an optional adjustable pressure pad, this version accommodates devices 13 mm2 or smaller, with a pitch of 0.30 mm or higher. The CSP socket incorporates a simplified pressure pad compression design for a greater range of movement without over-compressing the device, suiting testing of small and/or fragile devices. The pressure pad is easily adjustable with the lid open or closed simply by using the included hex key, and can handle device thickness variations up to 1 mm. Greater ranges can be custom-designed per application. Operators can fine tune the pressure pad force for perfect connection by adjusting compression force on the device. The Aries CSP/MicroBGA test and burn-in socket family accommodates a variety of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash drives by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers. With a signal path of 0.077″ (1.96 mm), the CSP/MicroBGA socket for devices up to 13 mm2 provides minimal signal loss for higher bandwidth capability. The cost-efficient socket is easily mounted to and removed from the burn-in-board (BIB) using solderless pressure mount compression spring probes located by two molded plastic alignment pins and mounted with four stainless steel screws. Its small overall size allows the maximum number of sockets per BIB and BIBs per oven. Compression spring probes are constructed of heat-treated beryllium-copper, and plated with a minimum of 0.75 µm gold per MIL-G-45204 over a minimum of 0.75 µm nickel per SAE-AMS-QQ-N-290. Contact forces are 15 g per contact on a 0.30- to 0.35-mm pitch; 16 g per contact on a 0.40- to 0.45-mm pitch and 25 g per contact on pitches of 0.50 mm or larger. Operating temperature is -55° to +150°C and estimated contact life is a minimum of 500,000 cycles. Molded components are UL94V-0 Ultem, while machined components are UL94V-0 PEEK or Torlon. All hardware is stainless steel. The socket is available in custom materials, platings, sizes and configurations to suit specific applications. Aries Electronics Inc., http://www.arieselec.com/Web_Data_Sheets/23017/23017.htm.
500°F Two-zone Top-loading Oven
No. 1012 is an electrically heated, 500°F (230°C) top-loading oven for testing electronic equipment. Two zones, each 96″ wide × 12″ deep × 12″ high, can be separated for use as independent ovens. 24 KW (12 KW per load) are installed in Incoloy-sheathed tubular heating elements and two 1/3-HP recirculating blowers provide a total horizontal airflow of 1200 CFM to the workload. This top-loading oven features 4″ insulated walls, aluminized steel interior and exterior, manually operated rear hinged door, reinforced flooring that can accommodate a load up to 500 lbs., and swivel casters with swivel lock and wheel brakes. Controls include a digital indicating temperature controller, manual reset excess temperature controller with separate contactors and recirculating blower airflow safety switch. THE GRIEVE CORPORATION, www.grievecorp.com.
JTAG/Boundary Scan Platforms Integrated into Flying Prober
A next-generation JTAG/boundary scan option for flying probe is based on a full integration of the hardware architectures ScanBooster and SCANFLEX in combination with the JTAG/boundary scan system software CASCON GALAXY and also involves the probe of the Polar GRS500. Existing Polar users can upgrade their test solutions. There are two levels of integration options. In one, SYSTEM CASCON is integrated into the system interface of Polar Instruments via Teststand and LabVIEW in the Active Test Area, and a ScanBooster/USB controller executes the boundary scan tests of SYSTEM CASCON. The second level of integration is achieved with the SCANFLEX hardware based on a SFX 5704 I/O module for signal controlling and evaluation of the probe. This enables an interactive test between flying prober and boundary scan. Virtual ScanPin enables the diagnostic of all faults such as open solder joints, shorts, etc. between boundary scan ICs and test points. Just like in the first solution, the automatically generated tests are integrated in the Polar interface. GOEPEL electronic and Polar Instruments, www.goepel.com and www.polarinstruments.com/de.
Processor Support for Functional Test
Key processor families such as Freescale Power Architecture and Intel Atom are now available in the ScanExpress JTAG Embedded Test (JET) library. A complete listing of processor support is available on the Corelis website. ScanExpress JET is a functional test pattern generator, debugger, tester, and exerciser tool for microprocessors with on-chip debug features accessible through their JTAG port. The tool can be used as a stand-alone functional test station or in conjunction with traditional boundary-scan test techniques. This means that sound structural tests for opens and shorts can be performed via boundary-scan while at-speed functional testing can be performed using the CPU to run test programs loaded into memory. ScanExpress JET can also run functional tests and diagnose faulty boards when the embedded CPU is not able to boot and the board self test is not operational. Corelis Inc., a subsidiary of Electronic Warfare Associates Inc., http://www.corelis.com.
Low-force Test Solution for NiPdAu-plated IC Packages
The Low-Force XL Contacts for Pad ROL 100A Series and Pad ROL 200 Series Test Contactors suit testing of NiPdAu IC packages. They offer longer contact life, extended MTBA, improved continuity, extended load board pad life, and reduced cost of test when testing NiPdAu packages. NiPdAu is an alternative to matte tin, for tin whiskering prevention and cost effectiveness. NiPdAu-plated IC packages can present testing challenges. Without the proper socket design, material, and forces, the extreme hardness of NiPdAu material will result in faster pin wear rate, higher spare pin usage and higher overall cost of test. The Low-Force XL Contacts provide lower forces (20-30 grams per contact) and a self-cleaning wipe function to achieve longer contact life and higher performance. In addition to the extended contact life, cost of test is significantly lower. The Low-Force XL Contacts are also included in Johnstech’s SelecTest program. These contacts can be used for testing IC devices such as RF transceivers, filters, and amplifiers for wireless communications applications, and precision analog ICs for power management and analog-to-digital converters. Johnstech International Corporation, www.johnstech.com.