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Endicott Interconnect Fabricates Set-up PCB for Space Application
October 26, 2009 |Estimated reading time: Less than a minute
MADISON, AL and ENDICOTT, NY —Endicott Interconnect Technologies Inc. (EI) delivered a complex, ruggedized printed circuit board (PCB) to STI Electronics Inc. (STI), designed to meet the unique temperature, reliability, performance, vibration, and G-force requirements for a space application. EI, with support from STI, developed a unique method of fabricating a double-sided PCB with a single-tier cavity on a 50-mil copper core.
The single tier design allows STI to wire bond their semiconductor module, also fabricated by EI, to the copper core, which provides both heat dissipation and rigidity. “EI has successfully completed the substrate fabrication of STI’s prototype using STI’s patented packaging technology Imbedded Component/Die Technology (IC/DT®) and patented design guidelines (US Patent No 7,116,557),” noted Casey Cooper, electrical engineering manager at STI.
EI was able to ship the circuit boards ahead of schedule and to passed STI’s assembly test requirements, with collaboration between the two companies throughout the project, commented Ash Bhatt, new products program manager at EI.
For more information, visit www.stielectronicsinc.com and eitny.com.