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Terepac, IMEC Partner for Low-cost Flexible Electronics
October 22, 2009 |Estimated reading time: 2 minutes
EINDHOVEN, The Netherlands — Terepac Corporation and research center IMEC will collaborate on novel packaging technologies for flexible electronics. The initial driver for this shared research is a next-generation wireless ECG system, developed in the Human++ Program at Holst Centre, Eindhoven.
For many applications, like on-the-body devices, thin and flexible form factors greatly improve the comfort of wearable electronics. To allow large-scale manufacturing and market penetration, low-cost/high-value solutions are targeted in R&D programs. Traditional electronics packaging and assembly with rigid printed circuit boards (PCBs) and pick-and-place machines are unable to cope with these demands, the research partners assert.
The technology developed by Terepac uses a proprietary photochemical printing process, thinned silicon dies, and passive components that can be placed on flexible substrates at speeds of more than one chip per second and with accuracies down to a few microns.
The wireless ECG patch that is being developed in IMEC’s Human++ program at Holst Centre, an open-innovation initiative by IMEC and TNO, will be used as a test vehicle for further development of Terepac’s technology. IMEC will use the partnership as an opportunity to go from a lab-scale assembly on polyimide carrier to a more production-ready version of its wireless sensor nodes. Ric Asselstine, CEO of Terepac, noted that the partnership follows five years of development based on the patents of co-founder and CTO Dr Jayna Sheats. First results are expected by mid-2010.
IMEC performs world-leading research in nanotechnology. IMEC leverages its scientific knowledge with the innovative power of its industrial partners in ICT, healthcare and energy, IMEC delivers industry-relevant technology solutions. Further information on IMEC can be found at www.imec.be.
Holst Centre is an independent open-innovation R&D centre that develops generic technologies for wireless autonomous transducer solutions and for systems-in-foil. A key feature of Holst Centre is its partnership model with industry and academia around shared roadmaps and programs. Holst Centre was set up in 2005 by IMEC (Flanders, Belgium) and TNO (The Netherlands) with support from the Dutch Ministry of Economic Affairs and the Government of Flanders. For more information, visit www.holstcentre.com.
Terepac Corp. is a privately held emerging technology company in Waterloo, ON, and developed a system for transfer printing electronic components of any lateral size and thinness down to microns or below, at high speeds and accuracy. For more information, visit www.terepac.com.