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More SMTAI Conference Highlights
October 1, 2009 |Estimated reading time: 2 minutes
SAN DIEGO, CA — Presentations on solder paste, reflow profiling, package-on-package (PoP) assembly, and other topics will be given by Indium Corporation authors and co-authors at SMTA International (SMTAI), October 4–8 in San Diego, CA.
Ning-Cheng Lee, Ph.D, VP of technology, Indium Corporation, is presenting three papers: Lead-Free Flux Technology and Influence on Cleaning; Sealing the Gap of Solder Paste Technology in Lead-Free Halogen-Free Era, co-authored with Yan Liu, Ph.D. and Runsheng Mao, Ph.D., Indium Corporation; and Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control, co-authored with Mike Bixenman, DBA, Kyzen Corporation. Lee is also chairing the session on Thermal Management Innovations. He is a soldering expert and an SMTA Member of Distinction with extensive experience in the development of solder pastes, fluxes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research covers advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on high-performance and low cost of ownership. Lee is also a member of the SMTAI planning committee. Ronald C. Lasky, Ph.D. PE, senior technologist, Indium Corporation; and Ed Briggs, Indium Corporation, will present “Best Practices Reflow Profiling for Lead-Free SMT.” Lasky is also presenting “SMT: The Next 25 Years” as part of the anniversary dinner celebration and chairing the event Alternative Lead-Free Alloys. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. Read his blog at http://www.indium.com/drlasky. Eric Bastow, senior technical support engineer and Tim Jensen, Indium, will present “The Proliferation of Pb-Free Alloys.” Bastow joined Indium Corporation in 2001 developing new solder paste flux chemistries under the direction of Dr. Ning-Cheng Lee. He also gained experience performing residual gas analysis of hermetic electronic packages and developing electroless nickel-plating bath chemistries. Eric is an SMTA-certified process engineer (CSMTPE) and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College.
Chris Anglin, applications development engineer and Dave Sbiroli, Indium Corporation; George Babka, Assembléon America, Inc.; and Richard Brooks, Christopher Associates, will present “Sustaining a Robust Fine Feature Printing Process.” Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing. He has a master’s degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is also an SMTA-certified process engineer.
Jim Hisert, applications engineer and Brandon Judd, Indium Corporation, will present “Next Generation PoP Pastes for Electronics Assembly.” Hisert has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology and is a member of the American Society of Mechanical Engineers. He is involved in precision flux application in semiconductor packaging. He was awarded the Silver Quill award for his educational and instructive “Thermal Interface Materials” presentation.
In addition, two of Indium Corporation’s research scientists are presenting their iNEMI project reports. Runsheng Mao is presenting a Step Stencil Printing Study for the Solder Paste Deposition Project and Weiping Liu is presenting Thermal Fatigue Experiments and Alloy Test Requirements as a part of the Lead-Free Alloy Alternatives Project Report.
More SMTAI news:SMTAI Booth PreviewSMTAI Conference Preview: Paper Abstracts and TimesSMTAI Exhibitor Preview IISMTAI Products Preview I