-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
From the Show: Volunteers Honored at IPC Midwest
September 24, 2009 |Estimated reading time: 3 minutes
SCHAUMBURG, IL — IPC — Association Connecting Electronics Industries presented Special Recognition, Distinguished Committee Leadership, and Distinguished Committee Service awards at IPC Midwest Conference & Exhibition 2009, September 20-24 in Schaumburg.
The awards were presented to individuals who have made significant contributions to IPC and the electronics industry by lending their time and expertise to committees and standards and program development.
Special Recognition award recipients were:Marg Drouin, Cirtronics Corporation, for her contributions to IPC Multimedia Training in providing materials, acting as technical advisor, and input and review of scripts. Mike Freda, Sun Microsystems Inc., for his contributions to the IPC Executive Market and Technology Forum as a steering committee member and speaker.Mike Bryant, BGF Industries, Inc. and Silvio Bertling, Neltec, Inc., for their contributions to the development of a data-based value of permittivity/dielectric constant for E-glass in IPC-4412A, Specification for Finished Fabric Woven from "E" Glass for Printed Boards.Kathy Johnston, Raytheon Missile Systems, for her extraordinary contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.Daniel Foster, Defense Acquisition Inc., for his training committee leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.Jeannette Plante, NASA Goddard Space Flight Center, for her leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
Distinguished Committee Leadership awards went to:Antonio Senese, Panasonic Electric Works and Douglas Sober, Kaneka Texas Corporation for their leadership of the 3-11 Laminate/Prepreg Materials Subcommittee that developed IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards.George Milad, Uyemura International Corp. and Gerard O’Brien, Solderability Testing & Solutions, Inc., for their leadership of the 4-14 Plating Processes Subcommittee that helped develop IPC-4553A, Specification for Immersion Silver Plating for Printed Boards.Michael Jouppi, Lockheed Martin, for leadership of the 1-10b Current Carrying Capacity Task Group that developed IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design.Hue Green, Lockheed Martin Space Systems Company and Garry McGuire, NASA Marshall Space Flight Center, for leadership and contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
Distinguished Committee Service awards were presented to: Michael Beauchesne, Amphenol Printed Circuits Inc.; Silvio Bertling, Neltec, Inc.; Tracy Cai, Guangdong Shengyi Sci. Tech Co. Ltd.; Terry Fischer, Hitachi Chemical Co. America, Ltd.; Robert Hearn, Dow Chemical USA; Douglas Leys, Nelco Products, Inc.; Rolland Savage, High Performance Copper Foil Inc.; Crystal Vanderpan, Underwriters Laboratories Inc.; Daniel Welch, Arlon MED; Dewey Whittaker, Honeywell Inc. Air Transport Systems and Karl Sauter, Sun Microsystems Inc., for their contributions to IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards.Dr. Martin Bayes, Dow Electronic Materials; Elizabeth Benedetto, Hewlett-Packard Company; Trevor Bowers, Adtran Inc.; Donald Gudeczauskas, Uyemura International Corp.; David Hillman, Rockwell Collins; Helen Holder, Hewlett-Packard Company; James Kenny, Enthone Inc. — Cookson Electronics; Karl Sauter, Sun Microsystems Inc.; Dr. Polina Snugovsky, Celestica Canada and Karl Wengeroth, Enthone Inc. — Cookson Electronics, for their contributions to IPC-4553A, Specification for Immersion Silver Plating for Printed Boards.Byron Case, L-3 Communications; Don Dupriest, Lockheed Martin Missiles and Fire Control; Gary Ferrari, FTG Circuits; Michael Green, Lockheed Martin Space Systems Company; Michael Miller, NSWC Crane; Jack Olson, Caterpillar Inc.; William Ortloff, Raytheon Company and Dewey Whittaker, Honeywell Inc. Air Transport Systems, for their contributions to IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design.James Blanche, NASA Marshall Space Flight Center; Robert Cooke, NASA Johnson Space Center; Michael Engler, The Aerospace Corporation; Charles Gamble, NASA Marshall Space Flight Center; Ronald Hebden, NASA Goddard Space Flight Center; Robert Humphrey, NASA Goddard Space Flight Center; Lisa Maciolek, Raytheon Company; Norma Moss, L-3 Communications; David Nelson, Raytheon Company; William Ortloff, Raytheon Company; Doug Rogers, Harris Corporation, GCSD; Richard Rumas, Honeywell Canada; Blen Talbot, L-3 Communications; Anthony Wong, NASA Johnson Space Center and Alan Young, Jet Propulsion Laboratory, for their contributions to the development of J-STD-001DS Revision A, Space Applications Electronic Hardware Addendum to J-STD-001D.
For more information on these awards and the award recipients, contact Anna Garrido, IPC director of marketing and communications, at (847) 597-2804 or AnnaGarrido@ipc.org.