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These connectors, ESD protection components, new pulse resistor technologies, capacitors, and other bill of materials (BOM) elements for electronics assembly are new from Tyco, Cornell Dubilier, Molex, Hirose, Spectrum Control, Electronic Interconnect, Murata, Phoenix Contact, Printed Circuits Inc., and The Würth Elektronik Group.
Electrostatic Discharge (ESD) Protection Devices The series of 0201-sized silicon ESD (SESD) devices are approximately 70% smaller than prior-generation 0402-sized devices and help provide protection and improve reliability of portable electronics such as mobile phones, MP3 players, PDAs, and digital cameras. Bi-directional operation allows placement on the PCB without orientation constraint and won't clip signals that swing below ground. Designed to withstand IEC61000-4-2 ESD test pulses, the SESD device helps protect sensitive integrated circuits (ICs). Tyco Electronics' initial offerings in the 0201 chip scale package (CSP) include the SESD0201C-006-058 and the SESD0201C-120-058. The SESD0201C-006-058 is a bi-directional and ultra-low capacitance 0.6 picofarad (pF) device that is suitable for protecting very-high-speed data lines, such as USB and HDMI, or low-voltage antenna ports. The device's ultra-low capacitance, low insertion loss (<0.5dB up to 3GHz) and high linearity of voltage vs. frequency help minimize signal degradation. The SESD0201C-120-058 is a higher capacitance (12 pF) device that can be used for low-speed generic interfaces such as keypads, power buttons, speakers and microphone ports in portable electronics. Both SESD0201C-006-058 and SESD0201C-012-058 devices offer 8 kV contact and 15 kV air discharge protection per the IEC61000-4-2 standard. The SESD product line suits difficult board routing and space requirements. Tyco Electronics is also introducing the SESD0402S-005-054 device, an ultra-low capacitance SOD-923 (i.e., 0402-size package) device with 0.5 pF typical capacitance, and a 10 kV contact discharge rating per IEC61000-4-2 for use with digital applications such as USB and HDMI. Tyco Electronics Ltd., http://www.tycoelectronics.com/.
Aluminum Polymer CapacitorsTypes SPCX and SPSX surface mount aluminum polymer capacitors for DC/DC converter input and output applications are designed to handle up to 260°C solder temperatures used in the manufacture ROHS-compliant circuit boards. Type SPCX is the most economical series in a low ESR package. Capacitance ranges from 100 to 470 µF in voltage ratings from 2.0 to 6.3 Vdc, with ripple current capability of 2.7 A at 105°C. Type SPSX has less than 9 m? of ESR allowing it to handle 3 A of ripple current at 105°C. Capacitance values range from 82 to 470 µF in voltage ratings from 2.0 to 6.3 Vdc. Both types are supplied in a surface mount molded package with the same footprint as a D-size tantalum capacitor with 1.9-mm profile. Applications include DC/DC converters for audio/visual equipment, computers, and home appliances, optical and measuring equipment, etc. Cornell Dubilier, http://www.cde.com/catalogs/SPSX.pdf
1.27-mm-pitch SMT Latched HeaderThe Picoflex SMT header with positive retention latches provides a robust and reliable wire-to-board connection with increased retention force for rugged applications and high-vibration environments. These rugged connectors suit demanding industrial, automotive, medical, and multimedia applications. The proprietary Picoflex latch design increases the retention force between the header and receptacle by at least 50% compared to Molex’s standard friction-lock header. The greater retention force ensures a robust and reliable connection in applications where the harness can be placed under a push/pull force or where assembly involves movement of the cable to prevent the header and receptacle from unmating. The standard interface design makes the header backward compatible and able to mate with existing Picoflex receptacles. A high-profile polarizing peg avoids mismating of the header and receptacle and also acts as a lead-in to aid assembly. Polyphthalamide (PPA) housing material enables the header to tolerate reflow temperatures of up to +260°C. Optional gold plating, as opposed to the standard tin plating, allows for easier mating and higher mating cycles and is recommended for environments running at consistently high temperatures or in low current applications. Molex Incorporated (NASDAQ: MOLX and MOLXA), www.molex.com/product/ribbon/picoflex.html.
Board-to-Board and Board-to-FPC Connectors A comprehensive range of board-to-board and board-to-FPC connectors, the DF and FX Series devices feature contact pitches ranging from 0.40 to 2.54 mm, along with various termination styles and a variety of mated heights. Styles vary to comply with specific specifications, enhance the connectors’ resistance to drop shock, or enable high-speed signal transmission. The DF and FX Series connectors are deployed in LCD displays, cell phones, notebook computers, PDAs, digital cameras, and other compact devices. DF9 Series: 1-mm pitch; 4.3-mm mated height; parallel connection style; contact positions from 9-51 (31 and 41 position connectors comply with VESA specifications for flat panel display interfaces). DF12 Series: 0.5-mm pitch; 3.0- to 5.0-mm mated heights; parallel connection; 10-80 contact positions. DF17 Series: 0.5-mm pitch; 4.0- to 8.0-mm mated heights; parallel connection; 20-80 contact positions; special contact and housing design enhances resistance to drop shock. DF23 Series: 0.5-mm pitch; 1.5-mm mated height; parallel and board-to-FPC connection; 10-60 contact positions. DF30 Series: 0.4-mm pitch; 0.9-mm mated height; parallel and board-to-FPC connection; 20-80 contact positions. DF40 Series: 0.4-mm pitch; 1.5-mm mated height; parallel and board-to-FPC connection; 10-100 contact positions. FX8 Series: 0.6-mm pitch; 3.0- and 4.0-mm mated heights; parallel connection; 40-140 contact positions. FX8C Series: 0.6-mm pitch; 5.0-to 16-mm mated heights; parallel connection; 60-280 contact positions. FX11 Series: 0.5-mm pitch; 2.0- to 3.0-mm mated heights; parallel connection; 60-140 contact positions; designed for high-speed signal transmission. Hirose Electric Co., Ltd. (Tokyo Stock Exchange 1st sec: Index #6806), www.hiroseusa.com.
Filtered Micro D-Sub ConnectorsA line of smaller, lightweight EMI-filtered Micro D-subminiature connectors features high-performance EMI filtering and rugged construction, as well as RoHS compliance. Micro D-sub connectors are designed and built to MIL-DTL-83513. The compact footprint addresses medical, industrial and aerospace applications where space is limited and EMI a concern. The connectors are available with 9 to 37 contacts and a variety of styles, terminations, and mounting options. These connectors offer capacitance values to 4700 pF, can be specified for selective line filtering and provide an environmentally sealed contact area once mated. Micro D-sub connectors withstand an operating voltage to 100 VDC, dielectric withstanding voltage to 300 VDC, current rating of 3 Amps, and insulation resistance of 5G ? @ 100 VDC. Spectrum Control, Spectrum Advanced Specialty Products, www.SpecEMC.com/ceramic.
Specialized PCBs for Medical Device Electronic AssembliesThese specialized PCBs and engineering and design services help customers plan and develop medical electronic circuit assemblies. Often, thermal management issues must be anticipated in the design, and assemblers must conform to certain quality standards such as ISO 13485. Burn-in and rigorous vacuum chamber testing are vital for medical electronics and circuit board products. Testing involves subjecting fully functional sub-system circuit boards to different temperature cycles to ensure a full simulation, as though the product were fully operational in a medical facility. Vacuum chamber testing puts the subsystem circuit board in a real environment, with temperature ranges from -40° to +85°C for 24 to 48 hour test cycles, and it is put into non-stop operation for periods ranging from 24 to 72 hours. Environmental cycling exposes the PCB to possible anticipated extreme conditions, ensuring 100% product reliability as well as exposing latent defects. The PCB prototype serves as a product R&D tool, allowing the EMS provider to increase reliability by defining and building in Design for Manufacturability (DFM) and Design for Testability (DFT) procedures within the different stages of the product development. Electronic Interconnect (EI), www.eiconnect.com.
ESD Protection SeriesThe LXES product series of silicon-based devices are critical components in protecting electronic equipment, such as mobile phones and portable personal computers, from ESD. A high level of ESD protection is achieved through the LXES series’ ultra-low capacitance design, which also minimizes signal loss on high-speed data and transmission lines. Additional features include high suppression levels (less than 100V output when input voltage is 15kV) and high repetition durability (1000 cycles at 8kV contact voltage). Current product series includes a 2, 4, and 6 line array design along with a single line device. The next-generation product will expand to a 10-element device that will also contain built-in filtering. Murata Electronics North America is a wholly owned subsidiary of Murata Manufacturing Co. Ltd., http://www.murata-northamerica.com/murata/murata.nsf/pages/08252009.
Small PCB Terminal BlockThe PTSM PCB terminal block stands 5-mm tall with a 2.5-mm centerline. The spring-cage connector is rated for 6 amps. It is available in two mounting technologies: pin-in-paste or surface mount technology (SMT). Both technologies save time and costs compared with traditional mounting methods. Rugged surface mount device (SMD) anchors enable multiple wire termination and disengagement cycles. The PTSM suits space-critical applications such as LED lighting, building automation, and power supply units. Phoenix Contact GmbH & Co. KG, www.phoenixcontact.com.
Quick-turn Manufacturing on Complex Rigid-flex and Multilayer Flexible PCBsPrinted Circuits Inc. added quick-turn capabilities on high-reliability rigid-flex and multilayered flex circuitry, from 1 to 20 layers; high-density line and spacing; laser vias; and high aspect ratio plating. The service offers 1 and 2 week turns on complex, high-reliability rigid-flex and multilayer flexible circuits. Printed Circuits, Inc. (PCi) is qualified to the military performance specification Mil-PRF-31032, as well as Mil-P-50884; is ISO 9001 2008, and routinely builds to IPC 6013 Class II and III. PCI also has extensive UL qualifications for rigid-flex PCBs. Printed Circuits Inc. (PCi), www.PrintedCircuits.com.
Conductive Polymer for Printed Pulse ResistorsThese printed pulse resistors achieve 200,000 V high-voltage rating. The product’s smart-conductive polymer thick film systems allow wide variability in resistances, including resistance to extremely high field strength during real-time operation. The printed pulse resistors are able to assimilate high KW-load requirements for milliseconds. Their high integration potential enables reduced volume for more robust and cost-effective components. They can be printed on a multilayer PCB’s inner layer. Reliability remains high at a high level of thermo cycles (-40°/ +125°C, up to 3,000 cycles). Standard resistors for pull up/down applications can be printed in a controlled process at a tolerance range of ±30%. For higher grade applications, the resistors tolerance is reduced to ±5 % over the entire life cycle, even under extreme climate conditions (40°C/92%RH/1000h). Self-regulating, due to the resistor characteristic, achieves a nearly constant temperature up to 60°C. Normal power resistors require a heatsink area of 10 × 5 cm for 10 W power. For power resistors, resistant to 25 KW only for two milliseconds, an aluminum heatsink would not be helpful. Pulse resistant conductive polymer matches this special requirement; the multifunctional thick film system absorbs electric energy by transforming it into heat. Users supply data to Würth Elektronik, which calculates the required length, width and thickness of the pulse resistance. Engineering processes reduce risk of hot spots, high field energy, or damage from surge- or burst-pulses. The pulse resistors are proactive in energy absorption, enabling substitutions for varistors and other cost-intensive semiconductor elements. Pulse resistors, printed on the polymer thick film, survived testing in all three voltage ranges: low, normal, and high. Curved geometry avoids sharp edges, which can be subject to sparks emission especially for a voltage of 100,000 V and more. The Würth Elektronik Group of Companies, http://www.we-online.com.