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IPC Midwest: Free Forums, Standards Development, and Other Conference Highlights
September 3, 2009 |Estimated reading time: 5 minutes
SCHAUMBURG, IL IPC Midwest's Conference Program and Standards Development Meetings, September 2024, will cover reliability and failure analysis, cleaning and alternatives, solder alloys, printing processes, and other relevant SMT assembly topics. Presenters include Chris Mahanna, Robisan Laboratory; Mike Bixenman, Ph.D., Kyzen; S. Manian Ramkumar, RIT; and many others from global companies.
Free forums will take place Thursday, September 24, from 10:15 am to 3:30 pm. Acceptability, Reliability and Failure Analysis Free Forums examine the intricacies of ensuring reliability throughout the lifecycle of electronic products and systems through technical case studies and how-to guidance.10:15 am Cross-Sectional Preparation of Specialty and Problematic Components Richard Wagner and Gabe Lucas, Buehler Ltd. 11:00 am Advanced Applications of XRF for Lead Detection on Electronic Assemblies Paul Lomax, Fischer Technology Inc. 11:45 am Are the Test Results in Your C of C Still Applicable to the Products You Are Buying?Debby Obitz and John Radman, Trace Laboratories 12:30 pm Implementing the New IPC Thermal Stress, Convection Reflow Assembly Simulation Test Method, IPC-TM-650, Method 2.6.27 Chris Mahanna, Robisan Laboratory 1:15 pm Analytical Methods of Detecting Lead in Electronic Assemblies Mike Fredrickson and Carmine Meola, ACI Technologies Inc./EMPF 2:00 pm Failures Resulting from Cleanliness: What to Test? Joe Russeau, Precision Analytical Laboratory, Inc. 2:45 pm Creep Corrosion Immersion Silver Corrosion Issues Terry Munson, Foresite
Dr. Mike Bixenman of Kyzen along with Dr. William Kenyon, Global Centre Consulting, will chair the Cleaning & Alternatives Subcommittee during Session 5-31 of the Standards Development Meetings, scheduled to take place Tuesday, September 22, from 8 am to noon. This subcommittee is combining and updating four cleaning handbooks into a single document. The base documents are IPC-SC-60, "Post Solder Solvent Cleaning Handbook;" IPC-SA-61, "Post Solder Semi-Aqueous Cleaning Handbook;" IPC-AC-62, "Aqueous Post Solder Cleaning Handbook;" and IPC-CH-65, "Guidelines for Cleaning of Printed Boards and Assemblies." Technology advances create the need for highly complex circuitry driven by improved performance, miniaturization, and circuit density. To address these challenges, the task group has developed 14 sections that address cleaning value, assembly design, materials compatibility, process control verification, assembly residues, post assembly cleaning issues, environmental and safety concerns, solvent cleaning, semi-aqueous cleaning, aqueous cleaning, and rework and repair. The goal of this meeting is to review the working drafts, set in motion a project plan that moves toward final drafts for industry review, and publishing at APEX 2010.
David Scheiner, Kester, will host a Solder Alloy Task Group at IPC Midwest during Session 5-24c of the Standards Development Meetings, Tuesday, September 22, from 1:30 to 3 pm The Task Group has completed modifying, via Amendments 1 and 2, revision C of J-STD-006, "Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications." It is continuing work on revising this document to its revision D.
Mel Parrish, director of training materials/FSO at STI Electronics Inc., a full service organization providing training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will conduct a committee planning meeting for the Product Assurance Committee during Session 7-30 on Monday, September 21, from 8 to 9 am. This is a planning meeting for all Product Assurance Committee task group and subcommittee leaders. The meeting is by invitation only for Technical Committee Chairs of Standards including IPC-A-600, 610, 620, 630, 7711/21, 820, etc. Planning includes standards for unique applications such as space and telecom, and supporting IPC training certification programs. The purpose of this meeting is to promote interaction between the peer leaders for any support they may need for their individual Technical Committees. It also will pass on any urgent information or guidance issues from the Committee Chairman Council (CCC) and the Technical Activities Executive Council (TAEC).
S. Manian Ramkumar, director of the Center for Electronics Manufacturing & Assembly (CEMA) at Rochester Institute of Technology (RIT), will present two courses. "Stencil Printing Process for Solder Paste Application" will provide a thorough understanding of the solder paste print process and its influence on yield with an in-depth look at stencils, solder paste, process parameters and characteristics, inspection, and defect identification. "Advanced Component Packages and Processes" will introduce SMT users to the classifications, construction, and assembly process for advanced component packages, including BGAs, CSPs, flip chip, wafer level CSPs (WLCSP), chip on board (COB), tap automated bond (TAB), and multichip modules (MCMs).
In "Troubleshooting Your PCB Assembly Yields," Bob Willis, owner of a training and consultancy firm based in England, will cover common process problems and solutions. Coursework includes methods for investigating the root causes of failure related to the selection of PCB materials, surface finishes and soldering materials, etc. In his practical, how-to course, "LGA and QFN Design, Assembly and Rework Guide," Willis will review each step of the implementation process for land grid array (LGA) and quad flat no-lead (QFN) devices and present results of practice process trials.
As the industry continues the transition to lead-free, solderable finishes that protect bare copper prior to assembly are increasingly important. Michael Carano, a vice president at OMG Electronic Chemicals, will reveal what companies must do to be successful with lead-free finishes in "Final Finishes and their Compatibility with Lead-Free Assembly."
In "Fundamentals of Solder Joint Reliability," Werner Engelmaier, president of Engelmaier Associates, will explore the mechanisms underlying thermally induced solder joint fatigue, combined with the temperature-, time- and stress-dependent behavior of solder. Participants will practice using an acceleration model to extrapolate results from reliability tests. With component packaging technology decreasing in size and increasing in interconnection density and functional performance, traditional six sigma process controls are insufficient to achieve a high yielding manufacturing process.
In "DFM for Manufacturing," Dale Lee, DFX process engineer with Plexus Technology Group, will introduce design for matched process (DFMP), with examples of yield improvement through manufacturing tooling design, SMT and PTH assembly process matching and environmental controls. Assessment of lead-free solder joint reliability requires the use of efficient accelerated thermal cycling profiles coupled with reasonably accurate acceleration factors (AFs) that allow for the extrapolation of failure times from test-to-field conditions. Using reliability test data and predictive models developed for standard SnAgCu (SAC305/396) assemblies.
Jean-Paul Clech, Ph.D., president of EPSI, will review test procedures in "Accelerated Thermal Cycling and Acceleration Factors for Lead-free Surface Mount Assemblies." He will also cover the basic ingredients and methodologies needed to develop AF or life prediction models for lead-free soldered assemblies.
To learn more, visit www.ipcmidwestshow.org/professional-development-courses, or view the entire schedule of events at www.ipcmidwestshow.org/html/main/default.htm.