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IPC Midwest Exhibitor Preview I
September 1, 2009 |Estimated reading time: 4 minutes
SCHAUMBURG, IL Following are some of the many new and flagship products that will be exhibited later this month at IPC Midwest, September 2324 in Schaumburg. The exhibition will include AOI systems from Mirtec and YESTech, selective soldering tools from Juki and ACE Production Technologies, solder paste inspection (SPI) from CyberOptics, and printing platforms from DEK, among a host of other exhibits.
Mini-wave Selective Soldering SystemFlexSolder W510 is a mini-wave that handles boards up to 510 × 510 mm. FlexSolder W510 uses established selective soldering technology with a flexible design that allows the machine to be assembled anywhere, and to allow complete option upgrades in the field. It can have multiple mini-wave nozzles soldering simultaneously or running separately using two different-size nozzles. The benefit is that a nozzle as small as 1.8 mm can be used for tight areas (1 mm away from SMD or other components) on densely populated boards and a larger nozzle for making single passes on large connectors. This adds flexibility to the process, allowing various soldering options with no changeover. A special miniature wide wave supports 60-mm-wide soldering. The W510 offers 7° soldering that supports laminar nozzles and 0° soldering that supports wetted nozzles down to 1.8 mm. Juki Corporation, Booth 715.
Automated Optical Inspection SystemThe upgraded YTV BX benchtop AOI has advanced 5-megapixel color camera technology and Fusion Lighting for high-speed PCB inspection with high defect coverage and a low false failure rate. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput. The four optional side viewing cameras add inspection capabilities. Programming reportedly takes less than 30 minutes to create a complete inspection program including solder inspection. The BX utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Programs created with the BX are also compatible with YESTech's other AOI systems. Advanced Fusion Lighting and 5-megapixel image processing technology integrates several techniques, including color inspection, normalized correlation and rule-base algorithms, to provide complete inspection coverage with low false failure rates. The BX suits pre- and post-reflow and final assembly inspection. Remote programming and real-time SPC monitoring are available on the system. YESTech, a subsidiary of Nordson Corporation, Booth 501.
SPI SystemThe SE500 series advanced 3D solder paste inspection system has the ability to inspect the most demanding assemblies with a >80 cm2/sec. inspection speed that does not compromise measurement accuracy and repeatability. The system inspects pad sizes down to 01005 component size while keeping up with line speeds. The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50 × 50 mm to 510 × 510 mm. The SE500-X can transport panels from 100 × 100 mm to 810 × 610 mm. Standard features for both models include automatic conveyor width adjustment, mechanical board stop, 1D and 2D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability. Additionally, the SE500 has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output for easy integration to shop floor control systems. The SE500 also can run program files originally created for the SE 300 Ultra. CyberOptics Limited, Booth 301.
Printing PlatformsThe Horizon printing platform series includes the Horizon 01i, Horizon 02i, and Horizon 03i. Advanced standard features include optimized printer frame technology, motorized stencil alignment, fast product changeover, 2 Cpk print process capability and 6 Sigma production performance. Options are available, such as speed improvements, advanced understencil cleaning technology, automatic board support, and inspection capabilities. Options can be retrofitted in the field, customizing the Horizon platform for current and future manufacturing requirements. DEK, Booth 324.
Warpage-minimizing Soldering ConveyorThe SMART Conveyor controls PCB warpage during the selective soldering process and was developed in response to the continuous challenges of selective soldering process development. PCB assemblies, due to size, thickness, multi-part routing and component weight, tend to sag or warp. Board holding strategies such as custom fixturing ensured a reliable and repeatable selective soldering process but are expensive and time-consuming. The SMART Conveyor automatically senses and adjusts to board size, then "crowds" the PCB for a snug fit to ensure accurate board location. Then, the SMART Conveyor automatically clamps the two parallel edges and re-sizes the holding area while exerting gentle pressure that eliminates any board shape issues. Lead-free assembly is less forgiving than lead-based, and today's assemblies are more complex and demanding. Warpage of PCBs directly impacts the precision of the selective soldering process, and to ensure good solder connections, repeatability, and product reliability, warpage must be controlled to keep the board as planar as possible. The SMART Conveyor, in conjunction with automated optical alignment and skew correction, addresses the critical requirements of true automation for lights-out operation. ACE Production Technologies Inc., Booth 537.
AOI SystemsThe MIRTEC MV-3L desktop AOI system is configured with a 4-megapixel top down camera and four side-view cameras. The downward camera provides 9.8-µm/pixel resolution and 2D bar code recognition. The MV-3L also features MIRTEC's Intelli-Beam Laser Inspection System. This system provides the ability to precisely measure the Z-axis of a given region of interest. This advanced technology provides four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability. The MV-7xi in-line AOI system provides one top-down 4-megapixel camera with 9.8 µm/pixel resolution and four side-view cameras. The patented Quad Angle Lighting System provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi will feature a 2D camera bar code reader, a high-throughput, three-stage PCB conveyor and a PCB under board support system. This system also will be configured with MIRTEC's exclusive Intelli-Scan Laser Inspection System. MIRTEC Corp., Booth 725.