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Nihon Superior Debuts Solutions for Lead-free Soldering Challenges
July 28, 2009 |Estimated reading time: Less than a minute
OSAKA, Japan Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, posted a new presentation about the challenges and issues in lead-free soldering on the Nihon Superior Website.
Copper erosion, voiding, and tin whiskers are only a few of the problems in the field of lead-free soldering. Nihon Superior's proprietary SN100C silver- and lead-free alloy is shown as a product to solve users' challenges. SN100C can reportedly reduce bridges with uniform eutectic solidification, provide good through-hole fill, and reduce voiding resulting in low defect manufacturing and high reliability.
Additional performance features of SN100C presented on the Website include excellent melting performance, prevention of shrinkage cavities, excellent ductility, reduced copper erosion, and stabilized IMC. It provides long service life in thermal cycling conditions, as well as excellent impact resistance in BGA applications, and vibration resistance.
For additional features of SN100C solder alloy and to view the presentation, visithttp://www.nihonsuperior.co.jp/english/ppt_swf/sn100c/sn100ckadai/.