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New Products for Reflow Profile Verification
May 26, 2009 |Estimated reading time: 1 minute
MILWAUKIE, OR Participants in an ECD survey begun at APEX and continued through April were asked to answer specific questions about their practices regarding thermal processing. While over 90% of respondents were diligent in creating a correct reflow profile, nearly 60% did not display that same diligence when it came to verifying that profile on a regular basis. ECD conducted the study and shares the results.
Perceived difficulty and/or time required often dissuade otherwise vigilant manufacturers from verifying profiles. ECD promotes three methods to improve usability of verification tools.
V-M.O.L.E. thermal profiler can verify established profiles, using three thermocouples. This method, when using correct parameters, has been established as quite effective by a study at Binghamton University in N.Y. V-M.O.L.E. provides an OK Button that shows a clear "Go/No-Go" signal, meaning the operator need not involve the engineer to ok a run. The second way in which ECD encourages the profile verification of successive runs is with the newly released M.O.L.E. AttachEz, since attachment of TCs is one of the most commonly reported barriers to consistent thermal profiling. Because so much accuracy depends on the TC itself, the method to "stick it down" should have both ease of use and minimum impact. M.O.L.E. AttachEz are comparable to other popular methods for accuracy and can save time and money for users. Reportedly fast to attach, sticking well to flat or curved surfaces, reusable, Pb-free profiling temperature compatible, and providing number identification, they also have many more uses than the ten ECD outlined at their APEX introduction. An EMS provider who is currently doing a lot of prototyping reports after a few weeks of use that "the Attach-Ez work very well to hold parts that are in very close proximity to parts that are being reworked, enabling QFN rework without purchasing additional specific rework nozzles. Third, this continued verification of the profile throughout successive runs assumes added significance in light of the newly released J-STD-075 standard. Showing degradation of thermally sensitive passive components during reflow to be one of the main causes of product field failure, it concludes that such degradation often is not picked up by traditional assembly test and inspection. Instead, it often appears years later, after the product is in the field.
For more information, visit www.ecd.com/blog.