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Following are new products for automated optical inspection (AOI) and X-ray inspection, as well as cleanliness test, post-print solder paste verification, microscopy, and optical measurement. Also read Quality Sells at APEX: Test and Inspection ROI for a first-hand assessment of many of these products.
AOI Process Control System The Catch System can network multiple Marantz AOI machines into a closed-loop process monitoring and quality control system optimized for each user's workflow and internal organization. The Marantz Catch System uses an open source SQL database that manages a large data quantity, multiple users, and numerous machines. In addition to the SQL-based network control center module, it comprises three additional modules, which manage a particular component of the workflow and connect to the physical and administrative layout of the factory. CS Repair provides a paperless system of defect classification and repair, working from three process operational variations and including barcode control with multi-panel barcoding. CS Watch enables the user to observe their process from a remote location or factory display, providing real-time process control with alarms. The fourth module, CS Analyzer, delivers SPC Track and Trace and end of batch performance analysis. Spot causes of defects on the same PCB are derived by collecting data from sequential inspections. Marantz Business Electronics, www.marantz.com.
Programmer in Test FixtureA dedicated kit enables integration of FlashRunner technology into SPEA systems. FlashRunner is a production in-system programmer designed for manufacturing lines. The FlashRunner for SPEA Kit (code FR01SPE0) will contain a special version of FlashRunner designed for SPEA; a dedicated PCB for integrating FlashRunner in SPEA fixtures; a dedicated set of software functions to control FlashRunner from the SPEA software environment; and dedicated documentation for system integrators. The kit supports various SPEA fixtures (SAR 3600, SAR 1800, SAR 120 TOP, SAR 90 TOP and pneumatic and motorized drawers) and will be implemented in all SPEA systems (3030, Easy Test, Unitest, 4040, FT1000). It will run under Atos 2 and Leonardo SPEA operative systems. SPEA and SMH Technologies, www.spea.net and www.smh-tech.com.
Inspection CameraThe Visionscape Smart Camera combines technologies from machine vision and auto ID into a PCB inspection solution that performs cost-effective inspection for misaligned or missing high-value components and connectors, such as heavy or odd-shaped connectors with a high misplacement rate. A single Visionscape Smart Camera positioned over a conveyor or benchtop can verify the accuracy of components and placement, or identify errors prior to reflow. It combines a compact form factor with the broad applicability, versatility and high-performance machine vision software. Designed for use in a range of applications, the camera provides a cost-effective, easily deployed solution for manufacturers to monitor quality, control processes, or identify and trace parts on production lines, performing quality inspection, device metrology inspection, and full traceability. They support track, trace, and control processes with optical character recognition (OCR), optical character verification (OCV), and barcode/2D symbol reading, including direct part marks. Solid-state design and no moving parts reduce maintenance requirements. Built-in communication protocols and I/O features enable interface with any PLC, PC-based, or networked MES system. Microscan, a Spectris company, www.microscan.com.
Adjustable Pressure Pad on CSP Test SocketThe 27-mm CSP/MicroBGA test and burn-in sockets include an optional adjustable pressure pad. With 0.254 mm displacement per revolution of the screw, the mechanism makes the sockets suitable to test very small, fragile devices, such as thin or ceramic chips, without causing damage, and devices with large height tolerances. Users can back off the adjusting screw and close the socket's lid securely with one finger and very little force, and then modify the pressure pad force with the adjusting screw after the lid is closed. The screw can also be adjusted based on device height from chip to chip, eliminating socket rework downtime to design a new pressure pad. Each pressure pad comes with a user-adjustable washer stack in 0.0265 mm and 0.254 mm increments that serves as a hard stop to eliminate device over-compression. If constant large device height changes are expected during testing, the washer stack can be removed. The socket family accommodates a variety of CSP, microBGA, DSP, LGA, SRAM, DRAM and Flash devices from 6.5 to 55 mm2, using machined or custom-molded pressure pads and interposers and a 1.96-mm signal path. Their solderless pressure mount compression spring probes are located by two molded plastic alignment pins and mounted with stainless steel screws. The compression spring probes leave minimal witness marks on the bottom surface of the device pads for increased reliability. Probes are constructed of heat-treated beryllium-copper with a minimum of 30 µin gold per MIL-G-45204 over a minimum of 30 µin nickel per SAE-AMS-QQ-N-290 plating. Contact forces are 15 g per contact on a 0.30 mm to 0.35 mm pitch; 16 g per contact on a 0.40 mm to 0.45 mm pitch and 25 g per contact on pitches of 0.50 mm or larger. Operating temperature is -55° to +150°C and estimated contact life is a minimum of 500,000 cycles. Molded socket components are Ultem. Machined socket components (if required) are PEEK or Torlon. Hardware is stainless steel. Aries Electronics Inc., www.arieselec.com.
Portable Microscope With rotating lens and advanced digital enlargement and image capture features in a handheld format, iLoupe XL magnifies from 3 to 300 times and has a 5.1-megapixel, high-resolution sensor for detailed images. Six white-light LEDs with an adjustable intensity control illuminate images, and the lens tube rotates 180°. A touchpad menu and intuitive controls simplify use. The 2" LCD display makes it easy to frame fields precisely before capture and store on an included SD card. The iLoupe captures images in JPEG format. Applications include materials analysis, engineering work, redesign documentation, quality control inspection, troubleshooting, lab work, scientific field studies, illustrated presentations, education research or demonstrations and images for online or print use. A rechargeable lithium-ion battery allows continuous operation for five hours or standby use for up to seven hours. The unit is 2.5" wide, 6" high, and 1.5" deep. Aven Inc., SharpVue, www.aveninc.com.
OscilloscopesThe expanded digital-storage oscilloscope (DSO) portfolio has six new models that comprise the next-generation 1000 Series. These new scopes offer bandwidths between 60 MHz and 200 MHz. The oscilloscopes are available with two or four channels, and each comes in a package that is 5" deep and weighs less than 7 pounds. For full details, read about the oscilloscopes here. Agilent Technologies Inc., www.agilent.com.
3D AOI SeriesThe Koh Young Zenith series incorporates 3D inspection technology, including the ability to sense and measure the Z-axis profilometry of whole assembled PCB surfaces, including electronic components, solder joints, patterns, holes, and components with foreign material on them. The Zenith's 3D capability operates in addition to full conventional 2D AOI; this targets fewer escapes, false calls, and inspection errors. Common bottlenecks of 3D measurement such as specular problems associated with shiny solder joints, and projection obstacle problems due to relatively higher electronic components, were resolved. Object and reference plane shadow problems between the adjacent leads of fine-pitch QFPs were eliminated with the company's proprietary eight-way projection system. Zenith detects solder joint defects based on their true profilometry, as well as simple defects such as tombstoning. The system's measurement ability is not affected by dark components, lifted leads, or mislocated devices. Programming is typically achieved in less than 30 minutes; the system automatically extracts all the necessary information about the components to be inspected by Automatic Package Library Builder (APLB). The full capability of measuring solder joints and components themselves enables APLB to fill out all the necessary three-dimensional parameters for 3D inspection without requiring or wasting a lot of engineers' time. Zenith eliminates the inspection conditioning parameter setting procedure as well. Koh Young, www.kohyoung.com.
Optical Post-print MeasurementThis line of high-precision optically based measurement equipment for post-print inspection includes the VisionMaster volumetric and 3D profiling system and LaserVision economically priced, semi-automated solder paste measurement system. Many printing systems offer 2D paste inspection but do not monitor the quantity of solder paste on each pad, providing quantitative feedback of the quality of printing. These systems are designed to fill that gap in the quality verification oversight. Blakell Europlacer Ltd., distributor for ASC International, www.europlacer.com.
Ionic Contamination TesterCited in MIL-2000A, the Zero-Ion ionic contamination tester is a resistivity of solvent extract (ROSE) tester to determine the cleanliness of circuit assemblies. The Zero-Ion g3 is powered by a Windows-based PC for accuracy. A 19" LCD user interface provides clear, organized, real-time process information. Intuitive tabbed display screens organize both stored and real-time process data. Built-in SPC data recording captures all relevant testing data. An integrated SPC database lookup allows users to search for desired data sets, including SPC results by date range, recipe name, board serial number, etc. It can be networked for remote access. An optional barcode scanner provides one-touch entry of a board's serial number or other process data. The tester meets industrial cleanliness specifications including MIL-STD-2000A, MIL-P-28809, IPC-TM-650, and ANSI/J-STD-001B, IPC-TM650. The submerged sprays provide excellent agitation of the test solution while eliminating test inaccuracies caused by carbon dioxide adsorption associated with other open-air spray systems. The combination of test-board submersion and immersion spraying creates an environment where all soluble contamination is extracted and measured. The Zero-Ion g3 uses a dynamic measurement technology to detect weak ion activators in no-clean fluxes. The contaminated test solution is monitored and then filtered to supply de-ionized test solution back to the test chamber, resulting in greater solubility/sensitivity, eliminating the "saturation limit effect" associated with other static measurement methods. Unlike other systems that require heated test solution, the Zero-Ion performs all tests at ambient temperature, eliminating the need for heaters and their associated safety concerns. Ambient temperature testing also reduces machine start-up times and test solution evaporation. Aqueous Technologies, www.aqueoustech.com.
High-power X-ray TubeThis high-power X-ray tube provides up to 10 watts of power while retaining complete submicron feature recognition. High power and high resolution is especially important when looking through highly dense materials such as multilayer PCBs containing components located under heatsinks. This capability is achieved through the latest developments in Dage's sealed-transmissive X-ray tube technology providing a user-selected choice of 100 nanometer feature recognition at up to 4 W across the tube kV range, or up to a full 10 W of power yet still retaining sub-micron feature recognition. This flexibility offers high X-ray flux at the best resolution to image slight density variation in semiconductor device features. It also improves computerized tomography (CT) analysis. The high-power tube is available in the XD7600NT100 digital X-ray inspection system. Dage Precision Industries, a Nordson company, www.dage-group.com.