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The SMT/Hybrid/Packaging tradeshow and conference takes place May 5 through 7 in Nuremburg, Germany. The show encompasses back-end semiconductor packaging and test, PCB assembly, and various end-market sectors. International companies account for 33% of the exhibitors. In addition to the exhibits, 14 tutorials, and full-day technical conference, an EMS comparison service, job fair, and vendor forum are resources for attendees. Following are some of the highlights to take place on the show floor at SMT/HYBRID/PACKAGING.

cheetah.jpgYXLON International GmbH will introduce the Y.Cheetah to its range of Feinfocus Solutions at Stand 7-228. Y.Cheetah offers high-quality X-ray imaging via one-click solutions for a range of inspection tasks. The Y.Cheetah combines Feinfocus X-ray technology with advanced high-speed flat panel detector technology. Its manipulation capabilities offer efficiency in operation control and usability. Zoom+ Technology deploys synchronized tube and detector motion, creating a constant image contrast at the highest resolution. PowerDrive enables repositioning of imaging components at constant magnification for higher contrast and power, lower noise, or fast imaging and 3D scanning. It suits failure analysis, R&D, process control, and production testing. The system is quickly configured for single to multiple part inspections, manual inspection to one-click series inspection, 2D to high-speed microfocus computed tomography (µCT) and other dedicated solutions, such as the Y.T&R Module for Tape and Reel inspection. Various options are available to adapt the Y.Cheetah to future inspection tasks through upgrades and a growing range of dedicated inspection modules. Standard 160 kV, 64 W microfocus technology with high-speed flat panel detectors covers an 18 × 16" inspection area viewed around 70°.

KIC announced that BALVER ZINN Group, with its Balver Zinn and Cobar brands, is now a value-added reseller (VAR) for KIC's products. The collaboration will debut in Europe at SMT/HYBRID/PACKAGING in the Balver Zinn Group stand 536 in Hall 9 of the Messezentrum. Balver Zinn's KIC-trained staff will be on-hand to meet visitors and discuss the latest KIC product offering. Visitors also will be able to see a demonstration of the latest KIC software and view an explanatory video on the company.

JUKI will launch a light KE-2050 at Stand 7-333. The KE-2050 light high-speed chip shooter is an enhanced version of the company's KE-2050 technology. The light model is a cost-effective, quality automatic system. Primarily designed to boost capacity, it features a quadruple head with MNLA laser. With an IPC rating of 13,200 CPH, the system offers a placement accuracy of ±50 µm at 3 sigma across a wide SMT component spectrum. It can place 0201s up to 20 × 20 mm, or 26.5 × 11 mm, including QFPs and micro BGAs and a height up to 6 mm. A bad mark recognition sensor is used for more accuracy. The KE-2050 light is compatible with all JUKI assembly machines, feeders, and software modules. Its 80 8-mm tape feeders suit PCB sizes 50 × 30 mm through 410 × 360 mm, to a thickness of 0.4 × 4 mm. The system also offers a range of additional options, including trolley retrofit kit for front and rear, external programming units software (EPU), host line computer software (HLC), and flexline CAD (CAD data conversion). Juki also will have its new Intelligent Shop-floor Solutions (IS) software at the show. IS comprises Intelli PE for creating production programs, Intelli PD for downloading programs to multiple lines, Intelli PM to improve the operating rate of the entire floor, Intelli SCS (setup control system) for parts verification and traceability, and Intelli EM for management of feeder maintenance history.

FINETECH product manager Dominik Horn will give a presentation, "QFN Rework in OEM Quality," Wednesday, May 6, from 1:40 to 2 pm. Flat packages such as QFNs and other MLFs with thermal, inductive, and capacitive benefits increasingly are being incorporated into assemblies. Unlike BGA components, QFNs do not provide a solder ball array for SMD assembly but must be soldered to the assembly with their contact pads attached directly to the metalized body. This technology makes higher demands than those of standard SMD components. The challenge is to apply fresh solder to the contact pad structure of the QFN component prior to placement and reflow. Typically, these packages are used in tight spaces where it is difficult to use conventional solder pasting methods; direct dispensing of solder paste is not a viable option either. As Horn will explain in his presentation, direct paste pasting the component is the preferred method. Thin-film stencils, fixturing, and skillful hands can sometimes achieve wonders, but aren't we supposed to be getting our hands out of the way? In this scenario, someone is usually left juggling a pasted component upside-down, and trying to position it onto a nozzle prior to reflow without disturbing the pasted work. Reworking MLF or QFN components repeatedly with high yield requires more of a hands-off approach that can be integrated easily into the rework tool. What is needed is an equipment module that ensures that the paste process does not limit rework yield. Because stencils are available with less than 300-µm pitch for component sizes in the mm range, there is a limit to successful paste printing that relies on hand/eye dexterity.

sonotek.jpgSono-Tek Corporation will launch the SelectaFlux Retrofit ultrasonic selective fluxing system at Rubroder GmbH Factory Automation's Stand 7-305. SelectaFlux is a ready-to-integrate system targeting accuracy, precision, and fine-line control, designed to retrofit into all major selective soldering machines and to offer compatibility with all flux types, including lead-free. It operates via a trigger signal, with a controlled velocity spray that will not harm or disturb any component types. The retrofit combines Sono-Tek's Microspray ultrasonic atomizing nozzle with low air pressure. The spray is restricted through a separately controlled module that handles input and output system functions. The self-cleaning nozzle eliminates clogging. Compressed air, typically at 1 psi, is introduced into the diffusion chamber of the air shroud, which produces a uniformly distributed flow of air around the nozzle stem. The ultrasonically produced spray, at the tip of the nozzle stem, is immediately entrained in the air stream. Spray width is controlled by an adjustable focusing mechanism on the air shroud. The spray envelope is bow-shaped. Nozzle-to-substrate distance ranges from near-contact to approximately 50.8 mm. The system includes flux control system, power supplies, ultrasonic broadband generator, electrical inputs and outputs, displays power, control of pressure to liquid delivery pressure reservoir and pressure to air shroud. It also contains a digital display for nozzle power and panel-mounted nozzle power, flow rate and air pressure adjustments, and an alarm output. Footprint is 432 × 305 mm and 221-mm diameter. Sono-Tek also will highlight SonoFlux EZ and SonoFlux Servo.

MIRTEC Europe will showcase a range of desktop and in-line AOI systems in distributor PB Tec's Stand 7-506. The MV-3L desktop AOI system is a five-camera configuration with one top-down camera and four side-view cameras. The system can be configured with a 9.8-µm lens for accurate 01005 inspection. The Quad Angle Lighting System provides four independently programmable zones for optimal illumination of inspection areas. A Color Inspection engine provides additional capability in detecting lifted components, part marking identification and overall component recognition, while the Intelli-Beam Laser System measures Z-height of a given region of interest. The MV-7L in-line AOI system also features the five-camera set up, 9.8-µm lens, Color Inspection engine, Intelli-Scan, and Quad Angle Lighting. A three-stage conveyor system with automatic board support and PCB clamping mechanism are coupled with precision motion control systems. An optional Side Viewer camera system provides four additional 2-megapixel side-view digital color cameras for enhanced detection of lifted leads and lifted components. This system also provides solder joint inspection of J-leaded and LCC devices.

indium.jpgIndium will be exhibiting at Stand 7-430. Indium8.9HF solder paste is a halogen-free lead-free solder paste with good print transfer efficiency and response-to-pause printing. The advanced rheology of Indium8.9HF suits 0.4-mm-pitch and 0201 technologies. As a halogen-free solder paste tested per EN14582 test method, Indium8.9HF possesses a unique activator package and oxidation barrier, which allows it to coalesce and wet as well as or better than halogen-containing alloys. The oxidation barrier also ensures there is no graping on small passives. The oxidation barrier and high slump resistance allow Indium8.9HF to effectively eliminate head-in-pillow defects. Indium8.9HF can be manufactured with SnPb powder so it can be used on products currently exempt from RoHS. Using Indium8.9HF in a SnPb process offers high thermal stability and low voiding in mixed-alloy applications. It also eliminates the need to change solder paste chemistry when transitioning to a RoHS-compliant environment. It ensures compliance with REACH, RoHS, and future halogen-restricting legislation.

th_284178.jpgKyzen Corporation will showcase AQUANOX A4241 PCB and stencil cleaner at Stand 7-539. AQUANOX A4241 PCB and stencil cleaner is an aqueous cleaning solution designed with an inhibition technology to be effective on tough soils while protecting sensitive parts from etch or darkening. It can be used in a multi-process environment for spray batch, spray in-line, and stencil cleaning processes. A4241 reportedly leaves shiny solder joints with no sump side additives and consistent cleaning results with minimal bath monitoring. It is multi-metal safe including bare aluminium and copper. Nonflammable, noncorrosive, nonhazardous, and biodegradable, the cleaner is compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.

essemtec.jpgAt Essemtec's Stand 7-203, three complete SMT production lines for various production-scales will be presented. Essemtec offers printers, dispensers, placers, and reflow ovens. The company will demo one fully automatic inline production (SP900, PANFLEX2, RO-VARIO) and two stand-alone production lines for various requirements for capacity (SP200AV2, FLX2011, RO400FC and SP150, CSM7200-V and RO300FC). They will highlight the flexible pick-and-place machine PANFLEX2, which focuses on the special requirements of electronic manufacturing with plenty of variations. Using the X-vision system, the PANFLEX2 offers more functionality at lower costs. PANFLEX2 picks and places the 01005s through fine-pitch 50 × 50 mm QFPs at the same accuracy. Additionally, the system can accommodate components up to 15 mm tall. It has a speed of up to 12,000 CPH. Essemtec will also showcase its RO-VARIO reflow soldering system with circulating air, infrared, or UV radiation; and its automatic SP900 and the semiautomatic SP150 screen printers, with features such as built-in stencil cleaning. Essemtec also will promote its CDS6200 dosing system for capillary underfill.

cyberop.jpgCyberOptics Limited will introduce its SE500 series advanced 3D solder paste inspection system, in Stand 7-430. This system has the ability to inspect the most demanding assemblies with a >80 cm2/sec. inspection speed that does not compromise measurement accuracy and repeatability. The system inspects pad sizes down to 01005 component size while keeping up with line speeds. The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50 × 50 mm to 510 × 510 mm. The SE500-X can transport panels from 100 × 100 mm to 810 × 610 mm. Standard features for both models include automatic conveyor width adjustment, mechanical board stop, 1D and 2D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability. Additionally, the SE500 has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output for easy integration to shop floor control systems. The SE500 also can run program files originally created for the SE 300 Ultra.

inneo.jpgEuroplacer will display the iineo SMT platform in distributor SmarTec GmbH's Stand 7-219. The iineo platform features a higher feeder count, increased board size, and increased maximum component height over prior platforms. Core features include a turret head, intelligent feeders, and powerful software, along with linear motors and digital cameras. Configurations can include single or dual linear motor gantry including a rotary turret head with 8 or 12 pickups, 1 or 2 board positioning mechanisms, oversized board options, and feeders in front and rear or front only. The single-head iineo can handle maximum PCB sizes of 700 × 460 mm with options to handle up to 1610 × 600 mm. The double-head system can handle maximum PCB sizes of 500 × 460 mm with options to handle up to 700 × 600 mm. Both systems handle minimum PCB sizes of 60 × 60 mm, board thickness of 0.5 to 4.5 mm, maximum weight of 3 kg and under-board clearance of 25 mm. Both feature board edge clearance of 3 mm above/5 mm below, and left to right, fixed front rail transport criteria with a height of 950 mm. Board location on both is full edge clamping with fiducial correction, and both systems feature a SMEMA interface. The single-head iineo features one nozzle with 40 positions in its "smart" nozzle tool bank, and the dual-head configuration provides two nozzles, each with 40 positions in its tool bank. Placement accuracy is 35 µm (QFPs) to 60 µm (chips). The single iineo has a rotary turret pick-up head on X/Y linear motor gantries with eight pick-ups each (12 pick-ups on Tornado head), while the dual-head iineo features a twin rotary turret pick-up head. Options include glue dispense with Archimedean screw, electrical test, fixed camera, conveyor auto-width adjustment, special nozzle magazine, and more. The iineo platform is compatible with existing Europlacer feeders. Software accessories include multi-job optimization and wireless stock management.

trident_01.jpgAqueous Technologies Corp. will showcase the Trident fourth-generation automatic defluxing system in distributor SYSTRONIC's Stand 7-429. Trident's specific throughput rate is determined by board size. The system is capable of defluxing and cleanliness testing up to 200 4 × 6" boards and up to 28 18 × 20" boards per hour. The system offers several defluxing configurations designed to provide complete compatibility with all defluxing requirements. Trident's defluxing process consists of up to five cycles including prewash, wash, rinse, cleanliness testing, and drying. The wash cycle uses environmentally responsible defluxing solutions, neutralizing, and solublizing flux and other residues. The dry cycle uses a combination of radiant and convection heat. Trident is equipped with an automatic chemical management system that automatically measures and doses concentrated defluxing chemicals into the wash-solution recirculation system. Trident is equipped with a unique inverse-mounted vertically oriented spray pump that virtually eliminates pump-caused dragout. Built-in statistical process control (SPC) data capturing technology allows users to view historical SPC data, including actual cleanliness results, both at the machine and remotely. Trident's stainless steel plumbing and EPDM pump seals provide full compatibility with a variety of environmentally responsible, operator-safe defluxing chemicals.

rmd.jpgRMD Instruments LLC will highlight a new solder analysis and identification feature of its LeadTracer-RoHS XRF system, in smarTec's Stand 7129. Counterfeit suppliers are getting more sophisticated and are using techniques such as laser etching in production of these components, which makes them virtually undetectable from the real parts. The LTRSync+ software feature takes advantage of the LeadTracer's K-Shell X-rays that allows the user to identify parts that might be substandard. RMD has added a new solder analysis and identification feature to its LeadTracer-RoHS XRF system that accurately identifies all solder alloys within minutes. Additionally, this new resource accurately performs a solder pot analysis. This is especially beneficial for SAC alloys in which an increase in Cu and Pb content (due to component drag-out) can affect not only the soldering process, but also RoHS compliance status. The LeadTracer-RoHS XRF system analyses the entire body of the components in a short period of time, rather than simply carrying out a surface analysis. The LeadTracer-RoHS' ability to analyze the entire energy spectrum eliminates the possibility of false-negative indications in components that otherwise would have found their way into the manufacturing process. The LeadTracer-RoHS XRF system is now available with a sample preparation stand, ergonomically designed for optimum ease-of-use and accuracy and is equipped with RMD Instruments exclusive "quick disconnect" grip to enable users to operate the hand-held, portable LeadTracer-RoHS as a benchtop unit.

bpmapex1.jpgBPM will exhibit its manual Flashstream Flash Vector Programming System in distributor PB-Tec Stand 7-506 and SmartRep GmbH Stand 7-415. The manual Flashstream Flash Vector programming system programs NAND and NOR flash memory at speeds as low as 2.5% over theoretical programming minimum, using a proprietary co-processor technology called Vector Engine. Designed for high-density flash, the Flashstream programs NAND and NOR flash up to 32 Gbit and has upgradeable RAM for future densities. It comes standard with 4191 Mbit memory per site and bad block replacement for NAND and low voltage support. The four-socket manual system also can be connected with other units to one computer to run the same programming job in concurrent programming mode. Single units can be mechanically connected. Also, a LED display identifies the programmer number that corresponds to software instructions. It can program with 1,2,3, or 4 socket cards for first article qualification. Flashstream reduces ramp to volume production fears for products that integrate high-density flash memory and enables new applications, especially for very large patterns. Additionally, these systems can leave the factory with preloaded data or content instead of blank memory.

The BALVER ZINN Group will launch the i-SAC series of optimized alloyed lead-free solders at Stand 9-536. BALVER ZINN will present four products in this new family of solders, based on the 'Iowa State Patent,' for which they hold a license. i-SAC 387 Solder, with the addition of cobalt (Co), is a silver-containing lead-free solder with shiny solder joints with a fine grain microstructure, in comparison to standard SnAg3.8Cu0.7. i-SAC 387 also contains germanium (Ge) to prevent oxidation and dross formation. i-SAC387 has a melting point of 217°C and a specific gravity of 7.5 g/cm3. The tin/silver i-SAC 105, with cobalt and germanium, has a silver composition on request between 0.5 and 1.5%. i-SAC105 has a melting point of 217° to 227°C and a specific gravity of 7.4 g/cm3. BALVER ZINN will also present i-SAC205 and i-SAC305, and a range of other lead-free solder alloys and products, including alcohol-based, low-VOC, and VOC-free flux technology, for use in lead-free and N2-free, SN100C-based wave and selective soldering processes.



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