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Following are the new connectors, components, PCB materials, and tooling options such as lead trimmers and wire crimpers available to increase assembly density, improve reliability, and deal with challenges such as harsh environments and high frequencies.
PCB Thermal Management Materials and ConstructionsThese printed circuit board (PCB) materials, constructions, and configurations for electronic assemblies requiring heat management characteristics (high-power devices, RF and wireless, lighting/LED boards, etc.) are UL-certified metal-clad PCBs with a standard dielectric, and can work with various thicknesses of aluminum and copper metal cores. Precise machining tolerances and high-quality fabrication services enhance thermal management and long-term board reliability. The T-lam thermal lamination system, which includes T-Preg thermally conductive dielectric/ Prepreg, DSL or double-sided metal core laminate is offered, as well as insulated metal printed circuit boards (IMPCBs). Other constructions include 2-layer T-lam, hybrid IMPCBs with FR-4/T-preg, multilayer metal base construction, and multilayer FR-4/T-preg hybrids. Design counseling services support the PCB program. The materials used feature good thermal performance with high dielectric strength and low capacitance; and can eliminate the need for fans, heatsinks, and heat spreaders. Electronic Interconnect Technology (EI), www.eiconnect.com.
The Mezza-pede connector.
1-mm SMT Connectors with 36 PositionsMezza-pede SMT connectors are available with 36 positions. Designed for 1-mm-pitch micro board-to-board and flex cable-to-board applications, the low profile Mezza-pede Connector system has passed the mixed flowing gas (MFG) test and suits high-reliability applications. The proprietary pin and leadframe design is surface mountable and features screw-machined terminals with multi-finger contacts. An overmolded leadframe seals the surface mount pins to prevent solder wicking and ensures a solid solder joint at the PCB level. Precision molded from high-temperature LCP, the RoHS-compliant, two-piece connector system has a mated height of 4 mm. Other standard sizes include dual row 8- and 14-position versions with other pin counts available on a customized basis. The product is packaged in tape and reel for automated assembly. Advanced Interconnections Corp., www.advanced.com.
Low CTE LaminatesReverse-treated copper foil option on RO4000 series laminates, RO4000 LoPro use a special interface technology to be made with low-profile reverse-treat copper foil while maintaining copper peel strength equal to or better than standard RO4000 materials. Electrical and thermo-mechanical reliability is that of RO4000 laminates with improved insertion loss and good passive intermodulation (PIM) characteristics. RO4000 LoPro laminates feature a low Z-axis coefficient of thermal expansion (CTE) over a wide temperature range for reliable plated-thru-hole performance in multilayer circuits. The LoPro family of laminates is compatible with standard PCB fabrication processing and lead-free assembly temperatures. RO4000 LoPro laminates support high-speed, high-frequency circuits with low insertion loss, and improved signal integrity for ATE, wireless, and networking applications. Suitable analog and digital applications include antennae, microwave radio links, ATE, servers, and routers. Rogers Advanced Circuit Materials (ACM) Division, www.rogerscorp.com.
The 27E wire stripper.
Lead StrippersThe Model 27E magnet wire stripper is designed to strip magnet wire, coils, and resistor leads to within 0.031" (0.8 mm) from the component body. The rotating slotted stripping insert removes the film insulation resulting in a neat, clean edge. Strip lengths with the stop rod installed are up to 0.625" (16 mm) or up to 2.87" (72 mm) with the stop rod removed. Stripping inserts are exchangeable for various wire gauges and are available in tool steel or carbide. With the optional P/N 1939D Flexible Shaft Assembly, the Model 27E also can be converted from a benchtop machine to a more portable unit, capable of processing leads on heavy coils. The Model 88E magnet wire stripper is a fast and accurate way to efficiently strip miniature coils and fine magnet wire, using rotating cone-shaped stripping wheels. These wheels come in two grit textures and have a stripping range from 26 to 48 AWG. The Twincone wheel design makes close stripping possible on all types of film insulations to within 1/8" of a component's body. Carpenter Manufacturing Co. Inc., www.carpentermfg.com.
Glass Fiber for High-frequency CircuitsL-Glass low-loss glass fiber yarn for printed wiring board (PWB) applications has low dielectric constant (Dk) and low dissipation factor (Df) properties for designs requiring increased signal speeds and better signal integrity than traditional E-Glass/epoxy substrate materials. L-Glass fiber overcomes limitations of E-Glass/epoxy substrates and low Dk/Df resins with ceramic filler and lower E-Glass content by allowing epoxy resin systems to achieve much lower Dk/Df properties, and the PTFE-based systems to use a higher glass loading. At 10 GHz L-Glass fiber has a dielectric constant of 4.86 and a dissipation factor of 0.0050 whereas E-Glass has a dielectric constant of 6.81 and a dissipation factor of 0.0060. The CTE of L-Glass fiber is 3.9 ppm/°C compared to 5.4 ppm/°C for E-Glass. This makes L-Glass fiber an attractive material for use in IC packaging, where CTE mismatches with silicon are magnified due to the thermal environment and can cause defects. AGY's L-Glass fibers will be available in a variety of yarn counts, that will allow production of low-loss fabrics analogous to styles 106, 1080, 2113/2313, and 2116. Additional yarn counts can be produced as needed. AGY, www.agy.com.
Tab Router for Singulating PCB PanelsThe N200 punch separates round and odd-shaped panels without dust. The N200 is a top-down air-operated punch for separating panels one tab at a time. An upper and lower matching knife blade is used to pinch the tabs apart. This method produces less stress on the PCB than a punch and die since the cutting action takes place from both sides. The standard die set consists of an upper and lower knife for cutting a single tab at a time. The tab is positioned on the lower knife by placing the routed section of the panel on a set of locating pins and holding the PCB or letting it rest on the support table. The exact cutting location can be adjusted by turning an adjustment screw, which brings the locating pins to the desired place for cutting a tab at the board end of the material. Pins can be adjusted in the x and y direction to bring them close to the sides of the cutting blade and to set up for various diameter panels. Locating pins are mounted on quick change blocks. FKN Systek, www.fknsystek.com.
PCB Instruction BooksPCB technologist Robert Tarzwell, "Mr. Wizard," released the Xtreme series of PCB technology cookbooks. The initial twenty-two Xtreme PCB technologies are tested but not widely known technologies. One of the first in the series, "Fine Lines," will movea fabricator from 4/4 mil lines and spaces down to 2/2, reportedly within five days. Process details in the e-books are specific, well-sorted, and streamlined so companies can quickly implement any of the new technologies. Some of the other technology books Tarzwell will be offering are Xtreme high reliability to 2000 thermal cycles, Xcessive heavy copper to 12 oz., Xciting three-dimensional copper plating, and Xpert HDI manufacturing systems. Xtreme books by Robert Tarzwell, www.dmrpcb.com.
Low Dropout Linear RegulatorsLX8213 300mA CMOS LDO voltage regulators suit digital and communication-based systems requiring low noise and fast transient response, including set top boxes, digital televisions, broadband modems and wireless access points. Rapidly changing load currents found in these applications necessitate the faster transient response found. This component maintains regulated output voltage set points without the need for a large amount of output capacitance. Low dropout voltage is 170mV (typ) at 3.3V and 300mA. Input voltage range is 2.5 to 6V. The regulators are optimized for use with ceramic capacitors and feature a power saving mode. Voltage options are fixed and adjustable output. The output discharges when disabled. The LX8213 is offered in standard, fixed output voltage options and one adjustable option which may be set from 800mV to 5.5V, expanding Microsemi's LDO family. The LX8213 is designed on a high-performance CMOS process to enable tighter specification limits for critical parameters such as initial accuracy and line and load regulation. The LX8213 is offered in a ROHS-compliant 5-pin SOT-23 package. Microsemi Corporation, www.microsemi.com.
Board SupportThe RED-E-SET can reduce component damage by providing better board support, eliminating the risk of component damage due to misaligned bottom-side board support tooling or placement pressures. For screen printers, dispensers and automated assembly machines, the RED-E-SET can be configured in less than 3 minutes, providing zero defects, and higher throughput. The proprietary RED-E-SET in-line system eliminates board flex, using a spring-loaded support pin system. Units are available for most manufacturers' screen printers, dispensers and automated assembly machines, including Assembléon, Asymtek, Camalot, DEK, EKRA, Fuji, Juki, MPM, MYDATA, Panasonic, Philips, Quad, Siemens, Surface Mount Techniques, Universal, and others. Units are available for semiautomatic machines and in custom configurations. Production Solutions Inc., www.production-solutions.com.
Precision Linear ShaftsFor industrial automation machinery and systems, these precision linear shafts are available in various designs, including radial wrench hole drilled at one or both ends (as a low cost alternative to wrench flat option now available for many styles); precision option with improved perpendicularity tolerance of 0.03 mm for many of the existing offerings; high-precision piloted shafts with pilot concentricity tolerance of 0.02 mm; both ends stepped and tapped with wrench flat; and both ends tapped and one end stepped with wrench flat. The induction-hardened shafts are precision formed, ground and machined to tight concentricity and straightness dimensional tolerances. The shafts come in standard and configurable sizes and lengths, as well as in a selection of materials/grades and surface treatments. Users can also configure the dimensions of over 90 machined end variations. Misumi USA, Inc., a subsidiary of Misumi Corporation, part of Misumi Group Inc., www.misumiusa.com.
AVX Component Simulator.
Component Modeling and Simulation SoftwareAVX Component Simulator enables designers to view all basic characteristics and parameters for Accu-P, Accu-L, Thin Film Low Pass Filters, Couplers, 3dB Splitters, Hi-CV SMT, LICC, LGA, and IDC products. The simulation software features multiple parameter graphing options including Smith Charts, S-parameter, ESR, impedance, current, inductance and capacitance values. It generates appropriate product part numbers based on customer's technical specifications. The software also provides Internet links for data sheets, samples, and distributor stock checks. AVX Corporation, www.avx.com.
20W Chip AttenuatorThe high-power 2010 size chip attenuator VGX-2010WA features wraparound terminals for solder or epoxy attachment and will dissipate 20W at a 100°C baseplate temperature. Standard impedance is 50 Ω and attenuation values to 30dB are available including 0.5dB increments. Achievable VSWR is 1.3:1 to 12GHz depending on implementation and attenuation accuracy starts at ±0.2dB. These attenuators suit RF and microwave applications, among others. International Manufacturing Services Inc. (IMS), www.ims-resistors.com.
Single- and Multi-pocket PCBsThe Stac64 connection system provides single- and multi-pocket PCB solutions to offer a diverse range of circuit sizes and eliminate custom tooling. The stackable connection system allows OEM and device manufacturers greater design flexibility to support both low-level signal requirements as well as power applications upwards of 30.0A. Users can place header assemblies as stand-alone components or gang multiple headers to support a large range of signal and power needs for devices and modules. When ganging individual headers together to form a larger header assembly, no additional performance validation is necessary. The system reduces device packaging complexity and allows automotive devices quicker time to market. The standard product line, based on the 0.025" (0.64 mm) terminal, includes 8-, 12-, 16- and 20-circuit connectors in both vertical and right-angle headers supporting low-level signal requirements. An additional 10-circuit 'power pocket' version, supporting power applications for 0.059 and 0.110" (1.50 and 2.80 mm) terminal systems, is available in vertical and right- angle configurations. The pre-assembled, linear Mylar PC tail alignment strip for right-angle headers protects the pins through shipment and processing and provides additional PCB space savings. The concept also addresses wire harness assembly efficiencies by color-coding different connector pockets to aid with vehicle assembly. The PCB alignment posts ensure all terminals are properly aligned into PCB thru-holes during assembly and retain the header to the PCB during assembly and solder processing. In addition, PCB standoffs molded into housings provide additional trace-routing real estate under the headers. Stac64 is a standard product system based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications. The connectors mate to existing wire-harness connectors designed to the USCAR/EWCAP industry footprints. High-temperature thermoplastic housings withstand IR and wave lead-free solder processing. Molex Incorporated, www.molex.com.
Low Warpage LCP The low warpage Vectra liquid crystal polymer (LCP) grade V-0 halogen-free polymer, E488i, is designed to improve warpage behavior resulting in flatter molded parts such as CPU sockets and DIMM connectors, including those under lead-free soldering temperatures. The Vectra LCP family of high-performance polymers offer inherent flame resistance, thinner walls, higher temperature resistance, higher production rates, lower overall part costs and recyclability. The E488i enables increased pin densities for higher bandwidth and speeds. The product is formulated with enhanced mechanical properties for design flexibility. Benefits include reduced warpage, high temperature resistance, high flow, thin walls, and fast cycle times. Ticona, the engineering polymers business of Celanese Corporation, www.ticona.com.