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From the Show: Lead-free Soldering Presentation
April 2, 2009 |Estimated reading time: Less than a minute
LAS VEGAS Keith Sweatman, Nihon Superior Co. Ltd.'s senior technical advisor, will present a paper titled "Hot Air Solder Levelling in the Lead-free Era," during Session 28, Surface Finishes, today at the IPC APEX technical conference, from 9 to 10 am.
In his presentation, Sweatman will examine the reasons for the increasing popularity of HASL as a lead-free PCB finish and outline current best practice for the operation of the process. He will review the characteristics of the HASL finish that made it the most popular choice during the era of tin/lead soldering and document the additional benefits that the lead-free version can provide in terms of more uniform coating thickness and better retention of solderability during storage and thermal profiles.
For more information, visit www.ipcapexexpo.org.