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From the Show: New Substrate Challenges FR-4
April 1, 2009 |Estimated reading time: 1 minute
LAS VEGAS Hollingsworth & Vose, a long-time player in the paper market, is debuting their ViaMat nonwoven aramid organic reinforcement material to the PCB fabrication sector, noting better coefficient of thermal expansion (CTE) than glass, less warpage, and tolerance of high heat applications.
The ViaMat paper reportedly offers improvements in dimensional stability and enables higher interconnect densities. "ViaMat paper fills the void created by the technical limitations of woven glass in advanced high-performance electronic packaging applications," said Nate Burnes, business manager for Advanced Fiber Nonwovens (AFN) at Hollingsworth & Vose. For manufacturers of PCBs on woven glass reinforcement, ViaMat paper enables expansion into higher-performance electronics applications such as avionics, portable electronics, medical devices, and high-capacity servers. It suits harsh environments due to the CTE match with components. The substrate is able to support a higher density of components than other materials on the same real estate, explained Burnes. The paper's randomly aligned fibers create an isotropic nonwoven paper for uniform density and resin pickup, offering a smooth surface for resin application. Aramid fibers exhibit a negative CTE and restrain expansion of applied resins. Saturation of ViaMat paper can be processed on most existing glass resin saturation lines with minimal capital investment. The substrate can be drilled and laser/plasma ablated for advanced interconnect schemes, unlike some woven materials. Its 3.64 mil thickness is comparable to glass substrates currently in use.
ViaMat nonwoven aramid paper rolls are manufactured in Georgia and are immediately available for evaluation. They have been used at beta testing sites and in third-party tests. APEX is an opportunity to interact with PCB users to learn about their requirements and disseminate information about ViaMat's capabilities, said Burnes. For more information, visit www.hollingsworth-vose.com/products/afn/viamat-aramid-paper.htm.